CN-121974000-A - Full-automatic vacuum packaging integrated machine for semiconductor packaging

CN121974000ACN 121974000 ACN121974000 ACN 121974000ACN-121974000-A

Abstract

The invention relates to the field of semiconductor packaging integrated machines, in particular to a full-automatic vacuum packaging integrated machine for semiconductor packaging, which comprises a machine tool support, wherein a material conveying belt is movably arranged on the left side of the machine tool support, and a transfer support matched with the material conveying belt is fixedly connected to the top of the machine tool support. The full-automatic vacuum packaging integrated machine for semiconductor packaging realizes synchronous parallel operation of semiconductor transfer and information strip processing through the cooperation of the transfer support, the manipulator support and the scanning mechanism, specifically, the manipulator simultaneously completes the clamping transfer of the semiconductor, the adsorption extraction of the information strip and the scanning of the information strip in a guide groove in one-time movement process, thus thoroughly changing the serial step-by-step mode of traditional 'firstly moving the information strip and then moving the semiconductor', eliminating the time of idle stroke waiting and repeated positioning of the manipulator, greatly shortening the cycle beat of single operation, and greatly improving the packaging efficiency and the productivity of the production line as a whole.

Inventors

LIU CHUNWEI
LUO CHUNHUA
YU HUIZHEN
SUN GUANGMING
LI HAOTIAN
JIAO HUI
WANG YONGQI
LAN TIAN
WANG SHAOBAI

Assignees

中科泉舜(山东)智能技术有限公司

Dates

Publication Date: 20260505
Application Date: 20260123

Claims (7)

1. The full-automatic vacuum packaging integrated machine for semiconductor packaging comprises a machine tool support (1), wherein a material conveying belt (2) is movably arranged on the left side of the machine tool support (1), a transfer support (3) matched with the material conveying belt (2) is fixedly connected to the top of the machine tool support (1), a manipulator support (4) is slidably arranged on the upper portion of the transfer support (3), and a vacuum packaging assembly (5) matched with the manipulator support (4) is arranged on the rear side of the top of the machine tool support (1); The device is characterized by further comprising a scanning mechanism (6) movably arranged at the bottom of the manipulator bracket (4) and used for scanning the information strip; And the arrangement mechanism (7) is movably arranged in the manipulator support (4) and matched with the scanning mechanism (6) and is used for collecting and stacking information strips in sequence.
2. The full-automatic vacuum packaging integrated machine for semiconductor packaging according to claim 1, wherein the scanning mechanism (6) comprises a groove (601) formed in the bottom of the manipulator support (4), L-shaped guide grooves (602) are symmetrically formed in the inner wall of the groove (601), an electric sucker (603) is slidably arranged between the two L-shaped guide grooves (602), a driving rod (604) is fixedly connected to the side wall of the electric sucker (603), and a wedge-shaped driving plate (605) matched with the driving rod (604) is fixedly connected to the upper portion of the transfer support (3); the guide groove (606) is formed in the middle of the manipulator support (4), and a transmission belt group (607) for conveying information strips on the electric sucker device (603) is rotatably arranged in the guide groove (606); And the scanner (608) is fixedly connected to the top of the manipulator support (4), and the scanning end of the scanner (608) extends to the inside of the guide groove (606).
3. The full-automatic vacuum packaging integrated machine for semiconductor packaging according to claim 2, wherein an adjusting bracket (609) is slidably arranged on the surface of the transferring bracket (3), and the top of the manipulator bracket (4) is fixedly connected with the bottom of the adjusting bracket (609).
4. The full-automatic vacuum packaging integrated machine for semiconductor packaging according to claim 3, wherein the inner top surface of the groove (601) is fixedly connected with a guide block (610), a guide groove is formed in the middle of the guide block (610), the driving rod (604) is movably inserted into the guide groove, and a reset spring matched with the guide block (610) is movably sleeved on the surface of the driving rod (604).
5. The full-automatic vacuum packaging integrated machine for semiconductor packaging according to claim 4, wherein the conveying belt group (607) consists of a double conveying belt (6071) and a supporting and cushioning conveying belt (6072), a driving motor (6073) is fixedly connected to the rotating end of the double conveying belt (6071), the driving motor (6073) is fixedly connected with the inner wall of the manipulator support (4), circular gears (6074) are fixedly connected to the rotating ends of the double conveying belt (6071) and the supporting and cushioning conveying belt (6072), and the two circular gears (6074) are meshed; one end of the guide groove (606) close to the electric sucker (603) is conical, and the double conveying belts (6071) and the supporting and cushioning conveying belts (6072) are symmetrically arranged on the horizontal center line of the guide groove (606). The full-automatic vacuum packaging integrated machine for semiconductor packaging according to claim 5, wherein the arranging mechanism (7) comprises a storage groove (701) which is formed in the manipulator support (4) and is communicated with the guide groove (606), and a baffle plate (702) capable of resetting and moving is fixedly connected to the inner top surface of the storage groove (701); the device comprises a manipulator bracket (4) and one-way rotating containing rollers (703) rotatably arranged on the outer wall of the manipulator bracket, wherein cross-shaped push rods (704) for driving a baffle plate (702) to ascend are fixedly connected to the surface of the containing rollers (703), and the two containing rollers (703) are symmetrically arranged on two sides of the baffle plate (702); The Y-shaped adjusting plate (706) is arranged at the top of the manipulator support (4) in a sliding mode, an adjusting pin (707) for driving the Y-shaped adjusting plate (705) to rotate ninety degrees is arranged at the lower part of the Y-shaped adjusting plate (706) in a unidirectional rotation mode, a wedge-shaped pushing plate (708) for driving the Y-shaped adjusting plate (706) to move downwards is fixedly connected to the upper part of the transfer support (3), and the wedge-shaped pushing plate (708) and the wedge-shaped driving plate (605) are arranged on the same horizontal line.
6. The full-automatic vacuum packaging integrated machine for semiconductor packaging according to claim 6, wherein the upper part of the Y-shaped adjusting plate (706) is symmetrically and slidably provided with a supporting rod, the supporting rod is fixedly connected to the top of the manipulator support (4), and a compression spring (709) matched with the manipulator support (4) is movably sleeved on the surface of the supporting rod; a sinking groove (710) is symmetrically formed in the lower portion of the Y-shaped adjusting plate (706), the adjusting pin (707) is rotatably arranged in the corresponding sinking groove (710), and a reset torsion spring (711) is fixedly connected between the inner wall of the sinking groove (710) and the side wall of the adjusting pin (707); the surface of the manipulator support (4) is provided with a through groove (712) matched with the cross-shaped push rod (704), and the inner wall of the through groove (712) is fixedly connected with a shielding wool top.
7. The full-automatic vacuum packaging integrated machine for packaging semiconductors according to claim 7, wherein the vacuum packaging assembly (5) comprises an electric feeding bracket (501), a packaging bag manipulator (502) and a vacuum packaging machine (503), and the electric feeding bracket (501) is arranged on the right side of the transferring bracket (3) and matched with the manipulator bracket (4) to convey the semiconductors; the packaging bag manipulator (502) is arranged at the output end of the electric feeding bracket (501) and is used for packaging semiconductors conveyed by the electric feeding bracket (501); The vacuum packaging machine (503) is movably arranged on the right side of the packaging bag manipulator (502) and is used for extracting air in the packaging bag and sealing the packaging bag.

Description

Full-automatic vacuum packaging integrated machine for semiconductor packaging Technical Field The invention relates to the field of semiconductor packaging integrated machines, in particular to a full-automatic vacuum packaging integrated machine for semiconductor packaging. Background After packaging, the semiconductor device is generally required to be vacuum packaged to isolate external moisture, oxygen and pollutants, so that the reliability of the product in the transportation and storage processes is ensured, and an information strip (such as a label or a bill) containing key information of batch, model, quantity and the like is often required to be attached to each semiconductor product before or during packaging, so that the subsequent tracing and management are facilitated; Industrial robots take very important roles in the semiconductor production process, while the manipulator is a core execution carrier for realizing high-precision, high-cleanliness and high-repeatability operation in the semiconductor automation production line, at present, a common semi-automatic or quasi-automatic processing mode in the industry generally follows a set of sequential operation flow, namely, firstly, placing an information strip on the top of a semiconductor, then, the manipulator or a pickup device firstly moves the information strip to a fixed scanning station to complete information input, and after the input is completed, the manipulator loses the information strip into a collection box, and then, the manipulator acts again to grasp the semiconductor body and transfer the semiconductor body to a subsequent bagging and vacuum packaging station. In the prior art, the step-by-step serial mode of firstly processing the information strip and then transferring the semiconductor has obvious defects of 1 and process splitting, and low efficiency. The manipulator needs to execute two independent grabbing and placing cycles (one for the information strip and one for the semiconductor) for the same workpiece, the middle is often accompanied with path resetting and idle stroke waiting, the overall operation beat is seriously prolonged, the production line speed is restricted, 2, the information management is rough, the scanned information strip is simply thrown into a collecting box, the stacking disorder is easily caused, the corresponding relation between the information strip and the semiconductor material object is physically cut off, and the inconvenience is brought to the follow-up accurate tracing and file arrangement. Disclosure of Invention The invention aims to provide a full-automatic vacuum packaging integrated machine for semiconductor packaging, which solves the problems in the background technology. The technical scheme is that the full-automatic vacuum packaging integrated machine for semiconductor packaging comprises a machine tool support, wherein a material conveying belt is movably arranged on the left side of the machine tool support, a transfer support matched with the material conveying belt is fixedly connected to the top of the machine tool support, a manipulator support is slidably arranged on the upper part of the transfer support, and a vacuum packaging assembly matched with the manipulator support is arranged on the rear side of the top of the machine tool support; the scanning mechanism is movably arranged at the bottom of the manipulator bracket and is used for scanning the information strip; And the sorting mechanism is movably arranged in the manipulator support and matched with the scanning mechanism and is used for collecting and stacking information strips in sequence. Preferably, the scanning mechanism comprises a groove arranged at the bottom of the manipulator bracket, L-shaped guide grooves are symmetrically arranged on the inner wall of the groove, an electric sucker is slidably arranged between the two L-shaped guide grooves, a driving rod is fixedly connected to the side wall of the electric sucker, and a wedge-shaped driving plate matched with the driving rod is fixedly connected to the upper part of the transfer bracket; The guide groove is formed in the middle of the manipulator support, and a transmission belt group for conveying information strips on the electric sucker is rotatably arranged in the guide groove; the scanner is fixedly connected to the top of the manipulator support, and the scanning end of the scanner extends to the inside of the guide groove. Preferably, an adjusting bracket is slidably arranged on the surface of the transferring bracket, and the top of the manipulator bracket is fixedly connected with the bottom of the adjusting bracket. Preferably, the inner top surface of the groove is fixedly connected with a guide block, the middle part of the guide block is provided with a guide groove, the driving rod is movably inserted into the guide groove, and the surface of the driving rod is movably sleeved with a reset spring matched with the guide block.