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CN-121974560-A - Glass composition, glass fiber and glass filler

CN121974560ACN 121974560 ACN121974560 ACN 121974560ACN-121974560-A

Abstract

The present invention provides a glass composition, glass fiber and glass filler, which have a low linear expansion coefficient and a high Young's modulus and are suitable for mass production. The present invention provides, in mass%, a glass composition containing not more than i) a component containing 56≤SiO 2 ≤70、0.1≤B 2 O 3 ≤8、15≤Al 2 O 3 ≤24、4≤MgO≤14、0≤CaO≤4、0≤ZnO≤10、0≤（Li 2 O＋Na 2 O＋K 2 O）≤4、0.1≤ZrO 2 ≤5 and not substantially containing TiO 2 , a glass composition containing not more than ii) a component containing 56≤SiO 2 ≤70、0.1≤B 2 O 3 ≤8、15≤Al 2 O 3 ≤24、4≤MgO≤14、0≤CaO≤4、0.1≤ZnO≤3、0≤（Li 2 O＋Na 2 O＋K 2 O）≤4 and not substantially containing TiO 2 and ZrO 2 , and a glass composition containing not more than iii) a component containing 56≤SiO 2 ≤70、0.1≤B 2 O 3 ≤8、15≤Al 2 O 3 ≤24、4≤MgO≤14、0≤CaO≤4、0≤ZnO≤10、0≤（Li 2 O＋Na 2 O＋K 2 O）≤4、1≤ZrO 2 ≤5.

Inventors

  • FUJIWARA HIROYASU
  • NAKAMURA AYA
  • Togami Takuma

Assignees

  • 日本板硝子株式会社

Dates

Publication Date
20260505
Application Date
20240605
Priority Date
20230607

Claims (20)

  1. 1. A glass composition comprising, in mass%: 56≤SiO 2 ≤70、 0.1≤B 2 O 3 ≤8、 15≤Al 2 O 3 ≤24、 4≤MgO≤14、 0≤CaO≤4、 0≤ZnO≤10、 0≤(Li 2 O＋Na 2 O＋K 2 O)≤4、 a component having ZrO 2 of 0.1≤ZrO 2 of 5 of below and Substantially free of TiO 2 .
  2. 2. A glass composition comprising, in mass%: 56≤SiO 2 ≤70、 0.1≤B 2 O 3 ≤8、 15≤Al 2 O 3 ≤24、 4≤MgO≤14、 0≤CaO≤4、 0.1≤ZnO≤3、 A component of 0≤Li 2 O＋Na 2 O＋K 2 O≤4, and Substantially free of TiO 2 and ZrO 2 .
  3. 3. A glass composition comprising, in mass%: 56≤SiO 2 ≤70、 0.1≤B 2 O 3 ≤8、 15≤Al 2 O 3 ≤24、 4≤MgO≤14、 0≤CaO≤4、 0≤ZnO≤10、 0≤(Li 2 O＋Na 2 O＋K 2 O)≤4、 a component of ZrO 2 of 1 or less.
  4. 4. The glass composition according to any one of claims 1 to 3, which contains, in mass%, a component of 75≤ (SiO 2 ＋B 2 O 3 ＋Al 2 O 3 +MgO+CaO+ZnO). Ltoreq.99.
  5. 5. The glass composition according to claim 1 or 3, which contains 1≤ZnO+ZrO 2 ≤15 in mass%.
  6. 6. The glass composition according to any one of claim 1 to 3, which contains a component of 1≤Li 2 O＋Na 2 O＋K 2 O＋TiO 2 ＋ZrO 2 ＋T-Fe 2 O 3 ≤19 in mass%, Wherein T-Fe 2 O 3 is the total iron oxide converted to Fe 2 O 3 .
  7. 7. The glass composition according to any one of claims 1 to 3, which contains 2≤B 2 O 3 ≤6 in mass%.
  8. 8. The glass composition according to any one of claims 1 to 3, wherein the glass composition contains 5≤MgO≤13 in mass%.
  9. 9. The glass composition according to any one of claims 1 to 3, wherein the glass composition contains 0≤CaO≤1 in mass%.
  10. 10. The glass composition according to any one of claims 1 to 3, which is substantially free of SrO.
  11. 11. The glass composition according to any one of claims 1 to 3, which is substantially free of BaO.
  12. 12. The glass composition according to claim 1 or 3, which contains 0≤ZnO≤8 in mass%.
  13. 13. The glass composition according to any one of claims 1 to 3, which contains a component of 4≤MgO+ZnO≤17 in mass%.
  14. 14. The glass composition according to any one of claims 1 to 3, which contains 0≤Li 2 O＋Na 2 O＋K 2 O≤1 in mass%.
  15. 15. The glass composition according to any one of claims 1 to 3, which contains a component of 0.1≤Li 2 O＋Na 2 O＋K 2 O≤1 in mass%.
  16. 16. The glass composition according to any one of claims 1 to 3, which contains 0≤Na 2 O＋K 2 O≤1 in mass%.
  17. 17. The glass composition according to claim 1 or 3, which contains 0≤TiO 2 ＋ZrO 2 ≤4 in mass%.
  18. 18. The glass composition according to any one of claim 1 to 3, wherein the glass composition contains 0≤T-Fe 2 O 3 ≤5 in mass%, Wherein T-Fe 2 O 3 is the total iron oxide converted to Fe 2 O 3 .
  19. 19. The glass composition according to any one of claims 1 to 3, which contains 0≤Y 2 O 3 ≤3 in mass%.
  20. 20. The glass composition according to any one of claim 1 to 3, wherein the glass composition contains 0≤T-SnO 2 ≤2 in mass%, Wherein T-SnO 2 is the total tin oxide converted to SnO 2 .

Description

Glass composition, glass fiber and glass filler The application is a divisional application of PCT/JP2024/020548 with the application number 202480004863.8, application date 2024.6.5 and the application name of "glass composition, glass fiber and glass filler". Technical Field The present invention relates to glass compositions, and further relates to glass fibers and glass fillers, and further relates to articles such as shaped bodies comprising glass fibers or glass fillers. Background In electronic devices, resin compositions are widely used for constituting electrically insulating members and mechanism members. Examples of the electric insulating member are SMT (surface mount technology: surface mount technology), FPC (flexible printed circuits: flexible printed circuit), board-to-board connector, connector housing used in CPU (central processing unit: central processing unit) socket, memory card, card edge, optical connector, etc., bobbin for reactance used in LCD (liquid CRYSTAL DISPLAY: liquid crystal display) backlight, coil, flat plate, transformer, magnetic head, etc., relay housing, relay base switch, reflow dip package switch, shutter used in tact switch, etc., sensor housing, condenser housing, potentiometer housing, micro-adjuster housing. Examples of the mechanism members are a lens holder and a pickup base for an optical pickup, an insulator and a terminal for a micro motor, and a drum for a laser printer. The resin composition is also used as a film such as a base film for FPC and a base film for copper-clad laminate. In addition, one of the printed circuit boards printed circuit board included in the electronic device includes a substrate made of a resin composition. There is also a substrate composed of a resin composition in a printed wiring board (PRINTED WIRING board) before mounting electronic components. Hereinafter, in the present specification, both the printed circuit board and the printed wiring board are collectively referred to as "printed board". The resin composition contains a thermoplastic resin and glass fibers, and if necessary, a curing agent, a modifying agent, and the like. The printed circuit board may further contain an inorganic filler. As the inorganic filler, a glass filler is sometimes used. In recent years, in order to cope with the demands for miniaturization of electronic devices and for thinning for high functionality, dimensional stability has been demanded for resin compositions, and accordingly, low thermal expansion coefficients and high elastic moduli have been demanded for constituent materials thereof. Patent document 1 discloses a glass composition having a low coefficient of linear thermal expansion and a high young's modulus, and a glass fiber comprising the glass composition. The glass composition disclosed in the example of patent document 1 contains SiO 2、B2O3、Al2O3, mgO, etc., and contains titanium oxide (TiO 2) in an amount of 0.7% or more and 3.0% or less on a mass basis, and the content of zirconium oxide (ZrO 2) is limited to 0.6% or less. The glass composition disclosed in the example of patent document 2 contains SiO 2、B2O3、Al2O3, mgO, and the like, and contains zinc oxide (ZnO) in an amount of 4.0% or more and 7.5% or less on a mass basis. Patent document 2 does not disclose a glass composition containing zirconia (ZrO 2). The linear thermal expansion coefficient of the E glass in the temperature range (50 to 200 ℃) disclosed in patent document 2 is 53×10 -7/°c (comparative example 1 of patent document 2), but the coefficient of the E glass in a slightly wider temperature range (50 to 350 ℃) described later is slightly larger and is 60×10 -7/°c (comparative example 1 of the present application). Prior art literature Patent literature Patent document 1 Japanese patent application laid-open No. 2011-105554 Patent document 2 International publication No. 2012/104999 Disclosure of Invention Problems to be solved by the invention With the reduction in thickness for the purpose of downsizing and high functionality of electronic devices, dimensional stability is required for resin compositions constituting electronic devices, and low linear thermal expansion coefficients and high elastic moduli are required for glass fibers and glass fillers as constituent materials thereof. It is therefore an object of the present invention to provide a novel glass composition having a low coefficient of linear thermal expansion and a high young's modulus, and which is also suitable for mass production. Means for solving the problems The present invention provides a glass composition comprising, in mass%: 56≤SiO2≤70、 0.1≤B2O3≤8、 15≤Al2O3≤24、 4≤MgO≤14、 0≤CaO≤4、 0≤ZnO≤10、 0≤(Li2O＋Na2O＋K2O)≤4、 a component having ZrO 2 of 0.1≤ZrO 2 of 5 of below and Substantially free of TiO 2. From another aspect, the present invention provides a glass composition comprising, in mass%: 56≤SiO2≤70、 0.1≤B2O3≤8、 15≤Al2O3≤24、 4≤MgO≤14、 0≤CaO≤4、 0.1≤ZnO≤3、 A component of 0≤Li 2O＋Na2O＋K