Search

CN-121974727-A - Heat-insulating wallboard and preparation method thereof

CN121974727ACN 121974727 ACN121974727 ACN 121974727ACN-121974727-A

Abstract

The invention relates to the technical field of prefabricated inner wall boards and discloses a heat-insulating wall board and a preparation method thereof, wherein the preparation method comprises the steps of taking a magnesium oxide heat-insulating board as a base board, and immersing the base board in a modifying liquid; the preparation method comprises the steps of microwave drying, namely taking out the soaked substrate, microwave drying and cooling to obtain a hydrophobic substrate, coating diatom ooze, namely coating a formed diatom ooze layer on the surface of the hydrophobic substrate to obtain the heat-insulating wallboard, wherein the modifying liquid comprises silica sol, a hydrophobic modifier, a solubilizer and water. The heat insulation board can effectively solve the problem that the heat insulation performance of the conventional diatom ooze composite heat insulation board is obviously reduced in a humid environment, and the humidity adjustment capability of diatom ooze components is not affected. The magnesium oxide base plate is soaked in the modified liquid containing the silica sol and the hydrophobic modifier, and is subjected to microwave drying treatment, so that the nano porous silica three-dimensional network structure similar to aerogel is formed in the base plate, the overall heat insulation performance is remarkably improved, and the heat insulation wallboard has good industrial application and popularization values.

Inventors

  • CHEN FANGGEN
  • YUAN HONG
  • WANG GANGGANG
  • LIU CHANG
  • LI LIFANG

Assignees

  • 佛山石湾鹰牌陶瓷有限公司

Dates

Publication Date
20260505
Application Date
20260122

Claims (10)

  1. 1. The preparation process of the heat-insulating wallboard is characterized by comprising the following steps of: s1, modifying a base plate, namely taking a magnesium oxide heat insulation plate as the base plate, and soaking the base plate in a modifying liquid; s2, microwave drying, namely taking out the soaked substrate, microwave drying, and cooling to obtain a hydrophobic substrate; s3, diatom ooze coating, namely coating a formed diatom ooze layer on the surface of the hydrophobic substrate to prepare the heat-insulating wallboard; The modifying liquid comprises silica sol, a hydrophobic modifier, a solubilizer and water.
  2. 2. The process for preparing the heat-insulating wallboard according to claim 1, wherein the raw materials of the diatom ooze layer comprise 5-10 parts by weight of bentonite and 1-5 parts by weight of heat-insulating microbeads.
  3. 3. The process for preparing the heat-insulating wallboard of claim 1, wherein the diatom ooze layer comprises 70-90 parts by weight of diatom ooze, 15-25 parts by weight of inorganic cementing material and the balance of water.
  4. 4. The process for preparing the heat-insulating wallboard according to claim 1, wherein the silica sol is alkaline silica sol, and the dosage is 5-30% of the total weight of the modified liquid.
  5. 5. The process for preparing a heat-insulating wall panel according to claim 1, wherein in the step S1, the soaking thickness of the substrate is 50-70% of the whole thickness.
  6. 6. The process for preparing the heat-insulating wallboard of claim 1, wherein the pH value of the modifying liquid is 9-11, and the pH regulator is ammonia water and acetic acid.
  7. 7. The process for preparing the heat-insulating wallboard according to claim 1, wherein the hydrophobic modifier is a silane coupling agent, and the dosage of the hydrophobic modifier is 0.5-2% of the total weight of the modified liquid.
  8. 8. The process for preparing the heat-insulating wallboard according to claim 1, wherein the solubilizing agent is alcohol, and the dosage is 10-40% of the total weight of the modifying liquid.
  9. 9. The process for preparing heat-insulating wall panel according to claim 1, wherein the solubilizing agent is propylene glycol.
  10. 10. A heat-insulating wallboard is characterized by adopting the preparation process of the heat-insulating wallboard according to any one of claims 1-9, wherein the heat-insulating wallboard comprises a diatom ooze layer and a hydrophobic substrate and is used for heat insulation in an indoor humid environment.

Description

Heat-insulating wallboard and preparation method thereof Technical Field The invention relates to the technical field of prefabricated inner wall boards, in particular to a heat-insulating wall board and a preparation method thereof. Background With the increasing awareness of environmental protection, building energy conservation has become an important trend in the current building industry development. The heat-insulating wallboard is used as one of key materials for realizing energy conservation of a building, and can effectively block heat transfer and remarkably reduce energy consumption of the building, so that the purposes of energy conservation and emission reduction are achieved. The diatom ooze has the advantages that the diatom ooze has a natural porous structure, so that indoor humidity can be effectively regulated, comfort level of living environment is improved, harmful substances in air can be adsorbed, indoor air is purified, and the diatom ooze has certain functions of resisting bacteria, preventing mildew, absorbing sound and reducing noise, and provides a comprehensive solution for health, comfort and energy conservation for modern buildings. In the selection of the base materials of the heat-insulating wallboard, the magnesium oxide board is favored because of the excellent characteristics of fire resistance, moisture resistance, high strength and the like. In recent years, with the progress of materials, high-quality magnesium oxide boards have successfully solved the problems of halogen return, corrosion and the like caused by the excessively high content of chloride ions in the traditional magnesium oxide boards, so that the magnesium oxide boards can be more stably applied to various humid environments. Through the foaming technology, the internal pore structure of the magnesium oxide board is optimized, the heat insulation performance of the magnesium oxide board is obviously improved, and meanwhile, the overall density of the board is greatly reduced, so that the wallboard is lighter. In addition, the good processability of the magnesium oxide board also makes the magnesium oxide board very suitable for being used as a base material of a prefabricated wallboard, and meets the development requirements of modern building industrialization and assembly. However, while both high quality magnesia insulation panels and diatom ooze materials exhibit good insulation properties in the dry state, they still present significant challenges in practical applications, particularly in the high humidity environments typically used for diatom ooze products. Conventional magnesia board and diatom ooze materials are generally water absorbent, and once the environment is wet, moisture can penetrate and fill the microporous structure inside the material. Since the thermal conductivity of water is much higher than that of air and most solid insulating materials, this permeated moisture can form a "thermal bridge" which significantly increases the overall thermal conductivity of the material. The heat insulation performance of the wallboard is greatly reduced, the energy-saving effect of the wallboard is weakened, and the temperature sensing degree of the indoor environment is greatly fluctuated due to the combined action of the high-humidity environment and the reduced heat insulation effect, so that the overall health comfort is even influenced. Disclosure of Invention Aiming at the defects, the invention aims to provide a heat-insulating wallboard and a preparation method thereof, which solve the problem of heat-insulating property attenuation of a conventional diatom ooze composite heat-insulating wallboard in a humid environment. To achieve the purpose, the invention adopts the following technical scheme: A preparation process of a heat-insulating wallboard comprises the following steps: s1, modifying a base plate, namely taking a magnesium oxide heat insulation plate as the base plate, and soaking the base plate in a modifying liquid; s2, microwave drying, namely taking out the soaked substrate, microwave drying, and cooling to obtain a hydrophobic substrate; s3, diatom ooze coating, namely coating a formed diatom ooze layer on the surface of the hydrophobic substrate to prepare the heat-insulating wallboard; The modifying liquid comprises silica sol, a hydrophobic modifier, a solubilizer and water. Preferably, the raw materials of the diatom ooze layer comprise 5-10 parts by weight of bentonite and 1-5 parts by weight of heat-insulating microbeads. Preferably, the raw materials of the diatom ooze layer comprise 70-90 parts by weight of diatom ooze, 15-25 parts by weight of inorganic cementing material and the balance of water. Preferably, the silica sol is alkaline silica sol, and the dosage is 5-30% of the total weight of the modified liquid. Preferably, in step S1, the soaking thickness of the substrate is 50-70% of the total thickness. Preferably, the pH value of the modified liquid is 9-11, a