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CN-121975066-A - Insulating resin composition and product thereof

CN121975066ACN 121975066 ACN121975066 ACN 121975066ACN-121975066-A

Abstract

The invention discloses an insulating resin composition which comprises (A) 100 parts by weight of polyphenyl ether resin and/or maleimide resin containing unsaturated carbon-carbon double bonds, and (B) 10-65 parts by weight of phosphorus-containing monomer shown in a formula (1), wherein in the formula (1), R 11 is C2-C4 alkenyl substituted phenyl, and R 12 and R 13 are respectively C1-C4 alkyl, C2-C4 alkenyl, phenyl, C1-C4 alkyl substituted phenyl, C2-C4 alkenyl substituted phenyl, biphenyl or naphthyl independently. In addition, the invention also discloses an article made of the insulating resin composition, which comprises a prepreg, a resin film, a metal foil-clad laminate or a printed circuit board. The product has improved at least one of the properties of in-board flow, edge stripes, flame retardance, peel strength, dielectric loss, Z-axis thermal expansion, etc.

Inventors

  • XUE WENTAO
  • WANG RONGTAO
  • LUO ZHAOPENG
  • Ge Dieqiang

Assignees

  • 台光电子材料(昆山)股份有限公司

Dates

Publication Date
20260505
Application Date
20241025

Claims (11)

  1. 1. An insulating resin composition, characterized in that the insulating resin composition comprises: (A) 100 parts by weight of a polyphenylene ether resin and/or a maleimide resin containing an unsaturated carbon-carbon double bond, and (B) 10 to 65 parts by weight of a phosphorus-containing monomer represented by the formula (1), In formula (1), R 11 is a C2-C4 alkenyl-substituted phenyl group, and R 12 and R 13 are each independently a C1-C4 alkyl group, a C2-C4 alkenyl group, a phenyl group, a C1-C4 alkyl-substituted phenyl group, a C2-C4 alkenyl-substituted phenyl group, a biphenyl group, or a naphthyl group.
  2. 2. The insulating resin composition according to claim 1, wherein the phosphorus-containing monomer represented by the formula (1) comprises any one or a combination of two or more of compounds represented by the formulas (1-1) to (1-10),
  3. 3. The insulating resin composition according to claim 1, wherein the insulating resin composition does not contain a phosphorus-containing monomer represented by formula (1) having one C2 to C4 alkenyl group alone and does not contain a phosphorus-containing monomer represented by formula (1) having three C2 to C4 alkenyl groups alone.
  4. 4. The insulating resin composition according to claim 1, wherein the unsaturated carbon-carbon double bond-containing polyphenylene ether resin comprises any one or a combination of two or more of an ethylene benzyl polyphenylene ether resin, a (meth) acryl polyphenylene ether resin, a vinyl polyphenylene ether resin, and an allyl polyphenylene ether resin.
  5. 5. The insulating resin composition according to claim 1, wherein the maleimide resin comprises one or two or more of 4,4' -diphenylmethane bismaleimide, polyphenylmethane maleimide, bisphenol a diphenyl ether bismaleimide, 3' -dimethyl-5, 5' -diethyl-4, 4' -diphenylmethane bismaleimide, 3' -dimethyl-5, 5' -dipropyl-4, 4' -diphenylmethane bismaleimide, m-phenylene bismaleimide, 4-methyl-1, 3-phenylene bismaleimide, 1, 6-bismaleimide- (2, 4-trimethyl) hexane, N-2, 3-dimethylphenylmaleimide, N-2, 6-dimethylphenylmaleimide, N-phenylmaleimide, vinylbenzyl maleimide, maleimide containing indene structures, maleimide containing isopropyl and meta-arylene structures, maleimide containing biphenyl structures, maleimide containing aliphatic structures having 10 to 50 carbon atoms.
  6. 6. The insulating resin composition according to claim 1, further comprising any one or a combination of two or more of polyolefin, benzoxazine resin, epoxy resin, polyester resin, phenol resin, amine curing agent, polyamide, polyimide, styrene maleic anhydride, cyanate ester, maleimide triazine resin.
  7. 7. The insulating resin composition according to claim 1, further comprising any one or a combination of two or more of a flame retardant, a hardening accelerator, a polymerization inhibitor, an inorganic filler, a solvent, a silane coupling agent, a surfactant, a coloring agent, and a toughening agent, which are different from the phosphorus-containing monomer represented by formula (1).
  8. 8. The insulating resin composition according to claim 7, wherein the flame retardant different from the phosphorus-containing monomer represented by formula (1) comprises a vinyl phosphazene compound, and the weight ratio of the phosphorus-containing monomer represented by formula (1) to the vinyl phosphazene compound is 1:10 to 10:1.
  9. 9. An article made from the insulating resin composition of claim 1, wherein the article comprises a prepreg, a resin film, a metal foil-clad laminate, or a printed circuit board.
  10. 10. The article of claim 9, wherein the article has one or more of the following characteristics: The product has an in-board gumming amount of between 3 and 12 mm; the length of the plate edge stripe of the product is less than or equal to 6 mm; The total burn time of the article measured by the method of reference UL94 is less than or equal to 50 seconds; the dielectric loss coefficient of the product measured by a method according to JIS C2565 is less than or equal to 0.00195; the peel strength of the product measured by the method of referring to IPC-TM-650.2.4.8 is greater than or equal to 3.6lb/in; The Z-axis thermal expansion rate of the product measured by the method of referring to IPC-TM-650.2.4.24.5 is less than or equal to 1.8 percent.
  11. 11. The article of claim 9, wherein the article has more than one of the following properties at the same time: the product has an in-board gumming amount of between 4.0 and 7.5 mm; the length of the plate edge stripe of the product is 0 mm; The total burn time of the article measured by the method of reference UL94 is less than or equal to 50 seconds; the dielectric loss coefficient of the product measured by a method according to JIS C2565 is less than or equal to 0.00192; the peel strength of the product measured by the method of referring to IPC-TM-650.2.4.8 is greater than or equal to 3.6lb/in; the Z-axis thermal expansion rate of the product measured by the method of referring to IPC-TM-650.2.4.24.5 is less than or equal to 1.7 percent.

Description

Insulating resin composition and product thereof Technical Field The present invention relates generally to an insulating resin composition and a product thereof, and more particularly, to an insulating resin composition and a product thereof which can be applied to prepregs, resin films, metal foil-clad laminates and printed circuit boards. Background The Printed Circuit Board (PCB) is used as an electronic basic component, and the application fields comprise a plurality of fields of mobile phones, computers, mobile communication, data centers, automobiles, industrial and medical treatment, aerospace and the like, and the technical level and reliability of the PCB have direct influence on the performance and stability of electronic equipment. With the development of technologies such as mobile communication and AI, the transmission rate and communication frequency of signals are greatly improved. The metal foil-clad laminated board is used as a substrate material of the PCB, and mainly plays roles of interconnection conduction, signal transmission, insulation support and the like on the PCB, and has great influence on the transmission speed, energy loss, characteristic impedance and the like of signals in a circuit. The overall performance, quality, reliability, stability, etc. characteristics of a PCB are largely dependent on the performance and quality of the metal foil clad laminate. Advanced PCB packaging technologies currently face problems in terms of process capability, signal integrity, heat dissipation, stress, etc., and place higher demands on the performance of metal foil clad laminates, such as suitable amounts of in-board glue flow, higher flame retardancy and peel strength, lower dielectric loss coefficients, Z-axis thermal expansion, etc. There is a need in the art to develop insulating resin compositions and articles thereof having suitable in-board flow, higher flame retardancy and peel strength, lower dielectric loss tangent and Z-axis thermal expansion coefficient. Disclosure of Invention Technical problem to be solved by the invention The insulating resin composition and the product thereof have more than one of the characteristics of proper in-board adhesive flow, higher flame retardance, higher peeling strength, lower dielectric loss coefficient, Z-axis thermal expansion rate and the like. Technical proposal for solving the technical problems The present invention has been made in view of the above-described problems, and the inventors have studied on the individual use and the combined use of various unsaturated phosphorus-containing monomers in an insulating resin composition, particularly, the individual use and the combined use of phosphorus-containing monomers having different numbers of unsaturated bonds in an insulating resin composition, and have achieved the technical proposal of the present invention as follows. A first aspect of the present invention provides an insulating resin composition comprising: (A) 100 parts by weight of a polyphenylene ether resin and/or a maleimide resin containing an unsaturated carbon-carbon double bond, and (B) 10 to 65 parts by weight of a phosphorus-containing monomer represented by the formula (1), In formula (1), R 11 is a C2-C4 alkenyl-substituted phenyl group, and R 12 and R 13 are each independently a C1-C4 alkyl group, a C2-C4 alkenyl group, a phenyl group, a C1-C4 alkyl-substituted phenyl group, a C2-C4 alkenyl-substituted phenyl group, a biphenyl group, or a naphthyl group. In a preferred embodiment, the phosphorus-containing monomer represented by the above formula (1) comprises any one or a combination of two or more of the compounds represented by the formulae (1-1) to (1-10), In a preferred embodiment, the insulating resin composition does not contain a phosphorus-containing monomer represented by formula (1) having one C2 to C4 alkenyl group alone and does not contain a phosphorus-containing monomer represented by formula (1) having three C2 to C4 alkenyl groups alone. In a preferred embodiment, the unsaturated carbon-carbon double bond-containing polyphenylene ether resin includes any one or a combination of two or more of a vinylbenzyl polyphenylene ether resin, a (meth) acryl polyphenylene ether resin, a vinyl polyphenylene ether resin, and an allyl polyphenylene ether resin. In a preferred embodiment, the maleimide resin comprises any one or a combination of two or more of 4,4' -diphenylmethane bismaleimide, polyphenylmethane maleimide, bisphenol a diphenyl ether bismaleimide, 3' -dimethyl-5, 5' -diethyl-4, 4' -diphenylmethane bismaleimide, 3' -dimethyl-5, 5' -dipropyl-4, 4' -diphenylmethane bismaleimide, m-phenylene bismaleimide, 4-methyl-1, 3-phenylene bismaleimide, 1, 6-bismaleimide- (2, 4-trimethyl) hexane, N-2, 3-dimethylphenylmaleimide, N-2, 6-dimethylphenylmaleimide, N-phenylmaleimide, vinylbenzyl maleimide, indene-containing maleimide, isopropyl-and meta-arylene-containing maleimide, biphenyl-containing maleimide, and