Search

CN-121975091-A - Reversible crosslinking reaction resin derivative, self-healing SiC chip plastic package material and application thereof

CN121975091ACN 121975091 ACN121975091 ACN 121975091ACN-121975091-A

Abstract

The invention relates to the technical field of semiconductor packaging, in particular to a reversible crosslinking reaction resin derivative, a self-healing SiC chip plastic packaging material and application thereof. The reversible crosslinking reaction resin derivative comprises at least one aromatic compound containing an amido furan functional group and having any one or a combination of at least two of structural formulas shown in the formulas (1) to (4), and a bismaleimide compound having a structure shown in the formula (5). The reversible crosslinking reaction resin derivative is a reversible DA system constructed by an amido furan functional group-containing aromatic compound and a bismaleimide compound, and the amide group accurately regulates the DA reaction temperature to 155-170 ℃ so as to adapt to the junction temperature of a SiC chip 175-200 ℃, thereby solving the problem that the existing material cannot repair cracks due to the inverse DA reaction.

Inventors

  • LU XIANGJUN
  • XIE AN
  • Xiao Yaoyang
  • WANG YIFAN
  • CAO CHUNYAN
  • SUN DONGYA
  • YAN YUJIE
  • HUANG HAI
  • WANG YI

Assignees

  • 厦门理工学院

Dates

Publication Date
20260505
Application Date
20251231

Claims (10)

  1. 1. A reversible crosslinking reaction resin derivative is characterized in that, Comprising the following steps: At least one aromatic compound having an amido furan functional group having any one or a combination of at least two of the structural formulae (1) to (4), and A bismaleimide compound having a structure represented by formula (5); ; ; ; ; ; wherein n is 100-10000, m is 100-10000.
  2. 2. A self-healing SiC chip plastic package material is characterized in that, Comprising the following steps: 10 to 20 mass% of a resin derivative which is a crosslinked product formed by a reversible Diels-Alder reaction between an aromatic compound containing an amidofuran functional group and a bismaleimide compound; 60 to 80 mass% of an inorganic filler; the balance of the auxiliary agent.
  3. 3. The self-healing SiC chip molding compound according to claim 2, wherein, The aromatic compound containing the amido furan functional group is selected from any one or a combination of at least two of structural formulas shown in the formulas (1) to (4): ; ; ; ; wherein n is 100-10000, m is 100-10000.
  4. 4. The self-healing SiC chip molding compound according to claim 2, wherein, The bismaleimide compound has a structure represented by formula (5): 。
  5. 5. The self-healing SiC chip molding compound according to claim 2, wherein, The auxiliary agent comprises at least one of a flame retardant, a release agent, a coupling agent, a colorant, a low stress agent and an ion capturing agent.
  6. 6. The self-healing SiC chip molding compound according to claim 5, wherein, The flame retardant is at least one of brominated epoxy, antimony oxide and metal hydroxide, and/or The release agent is at least one of natural wax and synthetic wax, and/or The coupling agent is silane coupling agent and/or The colorant is insulating carbon black, and/or The low stress agent is at least one of silicone oil and carboxyl terminated nitrile rubber, and/or The ion trapping agent is hydrotalcite.
  7. 7. The self-healing SiC chip molding compound according to claim 5, wherein, The content of the flame retardant is less than 10 mass percent, and/or The content of the release agent is less than 1 mass%, and/or The content of the coupling agent is less than 1 mass percent, and/or The content of the colorant is less than 1 mass percent, and/or The content of the low stress agent is less than 1 mass percent, and/or The content of the ion scavenger is less than 1 mass%.
  8. 8. The self-healing SiC chip molding compound according to claim 2, wherein, The inorganic filler is silicon dioxide.
  9. 9. The self-healing SiC chip molding compound according to claim 2, wherein, The resin derivative is selected from any one or a combination of at least two of structural formulas shown in formulas (6) to (9): ; ; ; ; wherein n is 100-10000, m is 100-10000.
  10. 10. Use of the self-healing SiC chip molding compound of any one of claims 2 to 9 in semiconductor chip packaging.

Description

Reversible crosslinking reaction resin derivative, self-healing SiC chip plastic package material and application thereof Technical Field The invention relates to the technical field of semiconductor packaging, in particular to a reversible crosslinking reaction resin derivative, a self-healing SiC chip plastic packaging material and application thereof. Background SiC (silicon carbide) is used as a core material of a third generation wide bandgap semiconductor, and by virtue of the characteristics of wide bandgap, high breakdown field strength, high thermal conductivity and excellent high temperature resistance, the SiC (silicon carbide) shows performance advantages far exceeding those of the traditional silicon-based material, namely, the SiC (silicon carbide) has higher device efficiency, faster switching speed and higher power density, can be stably served in high-temperature and high-pressure environments, can realize miniaturization and light-weight design of devices, can also remarkably improve the reliability of an overall system, and is a core support device in high-end fields such as a new energy automobile power module, a photovoltaic inverter, an aerospace power system, a rail transit traction converter and the like. However, the high power density and high temperature service characteristics of SiC devices place extremely stringent demands on the packaging materials. The packaging material is used as a key barrier between the device and the external environment, and needs to have excellent insulation property, mechanical support strength, thermal matching property and long-term stability. At present, the field of semiconductor packaging still takes traditional epoxy plastic packaging materials as a main stream, but the materials have the core defects that junction temperature is usually up to 175-200 ℃ when a SiC device works, the continuous high-temperature cycle can cause the mismatch of thermal expansion coefficients between the plastic packaging materials and a chip, a lead frame or a substrate, interface fatigue delamination is caused, an air gap formed by delamination can obstruct heat dissipation, increase local temperature, further cause initiation and expansion of microcracks of the plastic packaging materials, finally cause chip exposure, device insulation breakdown or circuit short circuit, and seriously influence service reliability. Therefore, development of special plastic packaging materials which are adaptive to the high junction temperature characteristic of SiC chips and have an effective self-healing function becomes a key requirement to be solved urgently in the industry. Disclosure of Invention In order to solve the defects in the prior art, the invention provides a reversible crosslinking reaction resin derivative, a self-healing SiC chip plastic package material and application thereof. A first aspect of the present invention provides a reversible crosslinking-reaction resin derivative comprising: At least one aromatic compound having an amido furan functional group having any one or a combination of at least two of the structural formulae (1) to (4), and A bismaleimide compound having a structure represented by formula (5); ; ; ; ; ; wherein n is 100-10000, m is 100-10000. The second aspect of the invention provides a self-healing SiC chip molding compound, comprising: 10 to 20 mass% of a resin derivative which is a crosslinked product formed by a reversible Diels-Alder reaction between an aromatic compound containing an amidofuran functional group and a bismaleimide compound; 60 to 80 mass% of an inorganic filler; the balance of the auxiliary agent. In an embodiment of the present invention, the aromatic compound containing an amide furan functional group is selected from any one or a combination of at least two of structural formulas represented by formula (1) to formula (4): ; ; ; ; wherein n is 100-10000, m is 100-10000. In one embodiment of the present invention, the bismaleimide compound has a structure represented by formula (5): 。 In one embodiment of the present invention, the auxiliary agent includes at least one of a flame retardant, a mold release agent, a coupling agent, a colorant, a low stress agent, and an ion scavenger. In one embodiment of the invention, the flame retardant is at least one of brominated epoxy, antimony oxide, metal hydroxide, and/or The release agent is at least one of natural wax and synthetic wax, and/or The coupling agent is silane coupling agent and/or The colorant is insulating carbon black, and/or The low stress agent is at least one of silicone oil and carboxyl terminated nitrile rubber, and/or The ion trapping agent is hydrotalcite. In one embodiment of the invention, the flame retardant is present in an amount of less than 10 mass%, and/or The content of the release agent is less than 1 mass%, and/or The content of the coupling agent is less than 1 mass percent, and/or The content of the colorant is less than 1 mass percent, an