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CN-121975170-A - Prepreg for electronic product shell and preparation method thereof

CN121975170ACN 121975170 ACN121975170 ACN 121975170ACN-121975170-A

Abstract

The invention relates to the technical field of electronic products, in particular to a prepreg for an electronic product shell and a preparation method thereof, wherein the prepreg is used for carrying out plasma treatment on glass fiber cloth and phosphorus-containing polysiloxane precursor liquid treatment; the preparation method comprises the steps of carrying out phenolic amine modification on a heat conducting filler, then grafting an aldehyde benzophenone derivative to obtain a composite heat conducting filler, mixing epoxy resin, the composite heat conducting filler, a curing agent, an auxiliary agent and a solvent to obtain an epoxy dipping liquid, coating the epoxy dipping liquid on modified glass fiber cloth to obtain a prepreg, taking titanium dioxide modified hexagonal boron nitride as the heat conducting filler, utilizing catechol and polyethyleneimine to codeposit on the surface of the heat conducting filler, then utilizing Schiff base reaction to graft the aldehyde benzophenone derivative prepared from p-hydroxybenzaldehyde, isophthalonitrile diisocyanate and 2-aminobenzophenone as raw materials, endowing the prepreg with long ageing resistance and corrosion resistance, and prolonging the service life of the prepreg.

Inventors

  • Chen Qiachang
  • ZHANG SUPING
  • SHI HAITAO
  • ZENG CHUNYU
  • Yuan Kangcheng

Assignees

  • 江西纵胜新材料有限公司

Dates

Publication Date
20260505
Application Date
20260310

Claims (10)

  1. 1. The preparation method of the prepreg for the electronic product shell is characterized by comprising the following steps of: s1, sequentially carrying out plasma treatment and phosphorus-containing polysiloxane precursor liquid treatment on glass fiber cloth to obtain modified glass fiber cloth; s2, carrying out phenolic amine modification on the heat conducting filler, and then grafting an aldehyde benzophenone derivative to obtain a composite heat conducting filler; S3, mixing epoxy resin, composite heat-conducting filler, curing agent, auxiliary agent and solvent to obtain epoxy gum dipping liquid; And S4, coating the epoxy dipping liquid on the modified glass fiber cloth, and performing semi-curing treatment to obtain the prepreg for the electronic product shell.
  2. 2. The preparation method of the prepreg for the electronic product shell is characterized in that the mass ratio of the composite heat conducting filler to the epoxy resin is (0.1-0.12) 1, the mass ratio of the epoxy resin to the curing agent to the auxiliary agent is 42:5:3, the solid content of the epoxy dipping liquid is 65%, the epoxy resin is obtained by compounding bisphenol A epoxy resin and o-cresol formaldehyde epoxy resin in a mass ratio of 1:2, the curing agent is an amine curing agent, and the auxiliary agent is one or the combination of an imidazole accelerator and a pH regulator.
  3. 3. The method for preparing the prepreg for the electronic product housing according to claim 1, wherein the working condition of the plasma treatment is that the power is 160W, the time is 60-80S, the working gas is oxygen, the coating temperature is 100-110 ℃ in the step S4, and the working condition of the prepreg treatment is that the temperature is 120-130 ℃ and the time is 6-8min.
  4. 4. The method for preparing a prepreg for an electronic product housing according to claim 1, wherein the phosphorus-containing polysiloxane precursor liquid treatment comprises the steps of: Mixing octaaminopropyl POSS and deionized water, adding mixed solution of phosphorous acid and deionized water, adding aqueous solution of formaldehyde at 38-40 ℃, stirring uniformly to obtain phosphorus-containing polysiloxane precursor liquid, immersing the plasma-treated glass fiber cloth in the phosphorus-containing polysiloxane precursor liquid, carrying out ultrasonic treatment for 10-20min, heating to 108-110 ℃, preserving heat for 3-4h, carrying out rotary evaporation, cooling, washing and drying to obtain the modified glass fiber cloth.
  5. 5. The method for preparing a prepreg for an electronic product housing according to claim 4, wherein the molar ratio of octaaminopropyl POSS to phosphorous acid is 1:8.
  6. 6. The preparation method of the prepreg for the electronic product shell according to claim 1, wherein the heat conducting filler is one or more of titanium dioxide modified hexagonal boron nitride, titanium dioxide modified graphene oxide and titanium dioxide modified aluminum oxide.
  7. 7. The method for preparing the prepreg for the electronic product housing according to claim 1, wherein the preparation of the composite heat conductive filler comprises the following steps: 1) Mixing catechol, polyethyleneimine and deionized water, adding tris (hydroxymethyl) aminomethane, adjusting the pH value to 9, adding a mixed solution of a heat conducting filler and deionized water, ultrasonically stirring for 1-2h, and carrying out suction filtration, drying and grinding to obtain a phenolic amine modified heat conducting filler; 2) Mixing the phenolic amine modified heat conducting filler and methanol under the nitrogen atmosphere, adding the aldehyde benzophenone derivative, heating to 55-60 ℃, stirring for 1-2h, centrifuging, washing and drying to obtain the composite heat conducting filler.
  8. 8. The method of claim 7, wherein the mass ratio of phenolic amine modified heat conductive filler to aldehyde benzophenone derivative is 3:2.
  9. 9. The method for preparing prepreg for electronic product housings according to claim 7, wherein the preparation of the aldehyde benzophenone derivative comprises the steps of: Adding isophorone diisocyanate into a reaction kettle, stirring and heating to 58-60 ℃, adding a mixed solution of p-hydroxybenzaldehyde and ethyl acetate, preserving heat for 1-2h, adding 2-aminobenzophenone, continuously preserving heat for 2-3h, cooling, freezing for 8h at-20 ℃, filtering, drying, and preserving heat at 25 ℃ for later use to obtain the aldehyde benzophenone derivative.
  10. 10. A prepreg for an electronic product housing, characterized in that it is prepared by the preparation method according to any one of claims 1-9.

Description

Prepreg for electronic product shell and preparation method thereof Technical Field The invention relates to the technical field of electronic products, in particular to a prepreg for an electronic product shell and a preparation method thereof. Background With the development of electronic products in the directions of high performance, miniaturization and light weight, the shell is used as a key component for physical protection and thermal management of the electronic products, and the performance of the shell affects the reliability, safety and service life of the electronic products. The existing market is used for preparing prepregs from common epoxy resin and glass fiber as a shell material, but the prepregs still have the defects in the aspects of heat conductivity, flame retardance, long-term aging resistance and the like, for example, a resin matrix has lower heat conductivity coefficient, so that heat cannot be dissipated in time, a large amount of inorganic filler is filled to improve the heat dissipation and flame retardance, but the mechanical strength of the prepreg is easily deteriorated, meanwhile, the bonding force between the resin and glass fiber cloth and the inorganic filler is weak, and the prepreg is difficult to meet the requirements of high-end electronic products due to the fact that the prepreg is subjected to illumination, oxidation, damp-heat and other environments for a long time, so that the mechanical properties are degraded, layered and even cracked. Disclosure of Invention The invention aims to provide a prepreg for an electronic product shell and a preparation method thereof, which are used for solving the problems in the prior art. In order to solve the technical problems, the invention provides the following technical scheme: a preparation method of a prepreg for an electronic product shell comprises the following steps: s1, sequentially carrying out plasma treatment and phosphorus-containing polysiloxane precursor liquid treatment on glass fiber cloth to obtain modified glass fiber cloth; s2, carrying out phenolic amine modification on the heat conducting filler, and then grafting an aldehyde benzophenone derivative to obtain a composite heat conducting filler; S3, mixing epoxy resin, composite heat-conducting filler, curing agent, auxiliary agent and solvent to obtain epoxy gum dipping liquid; And S4, coating the epoxy dipping liquid on the modified glass fiber cloth, and performing semi-curing treatment to obtain the prepreg for the electronic product shell. Further, the mass ratio of the composite heat conducting filler to the epoxy resin is (0.1-0.12) 1, the mass ratio of the epoxy resin, the curing agent and the auxiliary agent is 42:5:3, the solid content in the epoxy dipping liquid is 65%, the epoxy resin is bisphenol A type epoxy resin and o-cresol formaldehyde epoxy resin which are compounded according to the mass ratio of 1:2, the curing agent is an amine curing agent, and the auxiliary agent is one or the compounding of an imidazole accelerator and a pH regulator. Further, the solvent is compounded by acetone and N, N-dimethylformamide according to a volume ratio of 3:1. Further, the working condition of the plasma treatment is that the power is 160W, the time is 60-80s, and the working gas is oxygen. Further, the phosphorus-containing polysiloxane precursor liquid treatment comprises the following steps: Mixing octaaminopropyl POSS and deionized water, adding mixed solution of phosphorous acid and deionized water, adding aqueous solution of formaldehyde at 38-40 ℃, stirring uniformly to obtain phosphorus-containing polysiloxane precursor liquid, placing the glass fiber cloth subjected to plasma treatment into the phosphorus-containing polysiloxane precursor liquid, carrying out ultrasonic treatment for 10-20min, heating to 108-110 ℃, preserving heat for 3-4h, carrying out rotary steaming, cooling, washing and drying to obtain the modified glass fiber cloth. Further, the molar ratio of the octaaminopropyl POSS to the phosphorous acid is 1:8. Further, the preparation method of the octaaminopropyl POSS comprises the following steps of mixing methanol and 3-aminopropyl trimethoxy silane, transferring the mixture into a three-neck flask, adding hydrochloric acid with the mass concentration of 37%, preserving heat for 18 hours under the conditions of 90 ℃ and condensation reflux, steaming in a rotary mode, pouring tetrahydrofuran, standing for sedimentation, vacuum filtration and cleaning to obtain the octaaminopropyl POSS. Further, the heat conducting filler is one or more of titanium dioxide modified hexagonal boron nitride, titanium dioxide modified graphene oxide and titanium dioxide modified aluminum oxide. Further, the preparation of the titanium dioxide modified hexagonal boron nitride comprises the following steps: Mixing hexagonal boron nitride and deionized water, performing ultrasonic dispersion for 25-30min, adding a mixed solution of titanium tetrach