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CN-121975241-A - Low-dielectric-constant high-heat-conductivity all-hydrocarbon polymer matrix composite material and preparation and application thereof

CN121975241ACN 121975241 ACN121975241 ACN 121975241ACN-121975241-A

Abstract

The invention discloses a low-dielectric constant and high-heat-conductivity full-hydrocarbon polymer matrix composite material which is characterized by comprising, by mass, 70-90% of a polymer matrix and 10-30% of a heat-conductive filler; the invention relates to a preparation method of a full hydrocarbon polymer matrix composite material, which is characterized in that poly (1- (4-vinyl phenyl) -2- (4-benzocycloalkenyl) ethylene is used as a matrix, a silane coupling agent KH560 surface modified hexagonal boron nitride or boron nitride nanowire is used as a heat conducting filler, and the process of 'acoustic resonance mixing-powder pressing-stepped hot press curing' is adopted to form the composite material, so that the heat conducting performance of the composite material is obviously improved while the low dielectric constant is maintained.

Inventors

  • TANG YUN
  • MA JIAJUN
  • YANG JUNXIAO

Assignees

  • 西南科技大学

Dates

Publication Date
20260505
Application Date
20260306
Priority Date
20251231

Claims (10)

  1. 1. The full hydrocarbon polymer matrix composite with low dielectric constant and high heat conduction is characterized by comprising the following components in percentage by mass: 70-90 wt% of a polymer matrix and 10-30 wt% of a heat conducting filler; Wherein the polymer matrix is poly (1- (4-vinyl phenyl) -2- (4-benzocycloalkenyl) ethylene; the heat conducting filler is modified hexagonal boron nitride and/or modified boron nitride nanowires.
  2. 2. The low dielectric constant, high thermal conductivity all-hydrocarbon polymer matrix composite of claim 1, wherein said poly (1- (4-vinyl phenyl) -2- (4-benzocycloalkenyl) ethylene has a number average molecular weight Mn = 0.8x10 5 ~1.2×10 5 g/mol, a glass transition temperature Tg = 185 ± 5 ℃, and a 5% thermal weight loss temperature T 5% ≡380 ℃.
  3. 3. A method of preparing a low dielectric constant, high thermal conductivity, all-hydrocarbon polymer matrix composite according to any one of claims 1-2, comprising the steps of: Step one, preparing a heat conducting filler; step two, placing the heat conducting filler and the polymer matrix into an acoustic resonance mixer for resonance mixing to obtain a mixture; Pouring the mixture into a mold, performing stepped hot-pressing solidification under vacuum of less than or equal to 100 Pa, and naturally cooling to room temperature to obtain the full hydrocarbon polymer matrix composite with low dielectric constant and high heat conduction.
  4. 4. The method for preparing the full hydrocarbon polymer matrix composite with low dielectric constant and high heat conduction as claimed in claim 3, wherein in the first step, the specific method for preparing the heat conduction filler comprises dispersing hexagonal boron nitride in ethanol water solution, adding gamma-glycidol ether oxypropyl trimethoxysilane, carrying out reflux reaction for 2-5 h at 80-90 ℃, centrifuging, washing with absolute ethanol, and vacuum drying for 6-18 h at 60-100 ℃ to obtain modified hexagonal boron nitride; Dispersing the boron nitride nanowire in an ethanol water solution, adding gamma-glycidol ether oxypropyl trimethoxy silane, carrying out reflux reaction for 2-5 hours at 80-90 ℃, centrifuging, washing with absolute ethanol, and carrying out vacuum drying for 6-18 hours at 60-100 ℃ to obtain a modified boron nitride nanowire; The heat conducting filler is one or two of modified hexagonal boron nitride and modified boron nitride nanowires.
  5. 5. The preparation method of the low-dielectric-constant and high-heat-conductivity all-hydrocarbon polymer matrix composite material is characterized in that hexagonal boron nitride is in a round cake shape, the sheet diameter is 1-5 microns, the thickness is 8-12 nm, the boron nitride nanowire is a cuboid whisker, the diameter is 200-800 nm, and the length-diameter ratio is 10-50.
  6. 6. The preparation method of the low-dielectric-constant and high-heat-conductivity all-hydrocarbon polymer-based composite material is characterized in that the mass volume ratio of the hexagonal boron nitride or boron nitride nanowires to an ethanol aqueous solution is 1 g:10-30 mL, the mass ratio of ethanol to water in the ethanol aqueous solution is 7-9:1-3, and the mass ratio of the hexagonal boron nitride or boron nitride nanowires to gamma-glycidoxypropyl trimethoxysilane is 3-7:1.
  7. 7. The method for preparing the low-dielectric-constant and high-heat-conductivity all-hydrocarbon polymer matrix composite material according to claim 4, wherein when the heat-conducting filler is two kinds of modified hexagonal boron nitride and modified boron nitride nanowires, the mass ratio of the modified hexagonal boron nitride to the modified boron nitride nanowires is 1-3:1.
  8. 8. The preparation method of the full hydrocarbon polymer matrix composite material with low dielectric constant and high heat conduction as claimed in claim 3, wherein in the second step, the specific condition of resonance mixing is that a steel ball with phi of 1-3 mm is added, resonance mixing is carried out for 20-40 min under the conditions of frequency of 40-80 Hz and acceleration of 60-100 g, and the mass ratio of the total mass of the heat conducting filler and the polymer matrix to the steel ball is 1-3:1.
  9. 9. The method for preparing the low-dielectric-constant and high-heat-conductivity all-hydrocarbon polymer-based composite material according to claim 3, wherein in the third step, the step hot-press curing process comprises the steps of heat preservation at 170-190 ℃ for 2-4 h, heat preservation at 200-220 ℃ for 2-4 h, heat preservation at 220-240 ℃ for 2-4 h and whole-course pressure of 5-15 MPa.
  10. 10. Use of an all-hydrocarbon polymer matrix composite prepared by the preparation method according to any one of claims 3-9 as a thermal interface material in 5G chip, power device and/or three-dimensional integrated circuit packages.

Description

Low-dielectric-constant high-heat-conductivity all-hydrocarbon polymer matrix composite material and preparation and application thereof Technical Field The invention belongs to the technical field of polymer composite materials, and particularly relates to an all-hydrocarbon polymer-based composite material with low dielectric constant and high heat conduction, and preparation and application thereof. Background With the rapid development of 5G, artificial intelligence and high power chips, electronic packaging materials are required to simultaneously satisfy low dielectric constant, low loss, high thermal conductivity and low Coefficient of Thermal Expansion (CTE) matched with chips such as silicon, gaN and the like. Although traditional Polyimide (PI), epoxy resin and the like have good insulating performance, the dielectric constant is high (> 3.5), the thermal conductivity is low (< 0.3W m -1K-1), the CTE is large (> 40 ppm K -1), and the requirements of high-density interconnection and high-frequency high-speed signal integrity are difficult to meet. Benzocyclobutene (BCB) based polymer materials are attracting attention because of no byproducts in curing and excellent dielectric properties (ε' ≡2.6), but their intrinsic thermal conductivity is extremely low (0.18W m -1K-1). The introduction of hexagonal boron nitride (h-BN) into BCB can improve the heat conductivity, but BN has poor interfacial compatibility with an all-hydrocarbon matrix, is easy to agglomerate, leads to the simultaneous rise of dielectric constant and loss, and has limited CTE reduction amplitude. Therefore, development of a polymer-based composite material and a scalable preparation method thereof which simultaneously realize low dielectric, high thermal conductivity and low CTE have become urgent demands in the industry. Disclosure of Invention The invention aims to provide an all-hydrocarbon polymer matrix composite with low dielectric constant, high heat conduction and low CTE, so as to solve the problems that the dielectric property and the heat conduction property are difficult to be compatible, the interface thermal resistance is high, the process is complex and the like in the prior art. To achieve these objects and other advantages and in accordance with the purpose of the invention, as embodied and broadly described herein, there is provided a low dielectric constant, high thermal conductivity, all hydrocarbon polymer matrix composite comprising, in mass percent: 70-90 wt% of a polymer matrix and 10-30 wt% of a heat conducting filler; Wherein the polymer matrix is poly (1- (4-vinyl phenyl) -2- (4-benzocycloalkenyl) ethylene; the heat conducting filler is modified hexagonal boron nitride and/or modified boron nitride nanowires. Preferably, the poly (1- (4-vinylphenyl) -2- (4-benzocycloalkenyl) ethylene has a number average molecular weight Mn=0.8X10 5~1.2×105 g/mol, a glass transition temperature Tg=185+ -5 ℃, and a 5% weight loss on heat temperature T 5% not less than 380 ℃. Preferably, the modified hexagonal boron nitride is hexagonal boron nitride surface-modified with gamma-glycidoxypropyl trimethoxysilane (KH 560). Preferably, the modified boron nitride nanowire is a gamma-glycidoxypropyl trimethoxysilane (KH 560) surface modified boron nitride nanowire. A preparation method of a low dielectric constant and high heat conduction all-hydrocarbon polymer matrix composite material comprises the following steps: Step one, preparing a heat conducting filler; step two, placing the heat conducting filler and the polymer matrix into an acoustic resonance mixer for resonance mixing to obtain a mixture; Pouring the mixture into a mold, performing stepped hot-pressing solidification under vacuum of less than or equal to 100 Pa, and naturally cooling to room temperature to obtain the full hydrocarbon polymer matrix composite with low dielectric constant and high heat conduction. Dispersing hexagonal boron nitride in an ethanol aqueous solution, adding gamma-glycidol ether oxypropyl trimethoxy silane, carrying out reflux reaction for 2-5 h at 80-90 ℃, centrifuging, washing with absolute ethanol, and carrying out vacuum drying for 6-18 h at 60-100 ℃ to obtain modified hexagonal boron nitride; Dispersing the boron nitride nanowire in an ethanol water solution, adding gamma-glycidol ether oxypropyl trimethoxy silane, carrying out reflux reaction for 2-5 hours at 80-90 ℃, centrifuging, washing with absolute ethanol, and carrying out vacuum drying for 6-18 hours at 60-100 ℃ to obtain a modified boron nitride nanowire; The heat conducting filler is one or two of modified hexagonal boron nitride and modified boron nitride nanowires. Preferably, the hexagonal boron nitride is in a round cake shape, the sheet diameter is 1-5 mu m, the thickness is 8-12 nm, the boron nitride nanowire is a cuboid whisker, the diameter is 200-800 nm, and the length-diameter ratio is 10-50. Preferably, the mass volume ratio of the hexagonal boron nitride or bor