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CN-121975266-A - Insulating material for substrate packaging, preparation method and application thereof

CN121975266ACN 121975266 ACN121975266 ACN 121975266ACN-121975266-A

Abstract

The invention discloses an insulating material for substrate packaging, which comprises the following components in percentage by weight, 5-50wt% of first epoxy resin; the invention combines the synergistic effect of important components such as bisphenol fluorene epoxy compound, bisphenol A epoxy compound, 4-amino/1-hydroxy benzocyclobutene, BCB or derivatives thereof, such as surface functionalization PNF, silicon dioxide and the like, and the invention successfully prepares the high-performance insulating material with high glass transition temperature Tg, good peeling strength, good flame retardance, low dielectric constant, low dielectric loss, good cold and hot circulation resistance, high reliability, and the combination property is far superior to the conventional formula, and the prepared circuit board structure has stable performance and reliable quality by the way.

Inventors

  • YIN CHUNBIAO

Assignees

  • 苏州熙禾电子新材料科技有限公司

Dates

Publication Date
20260505
Application Date
20260112

Claims (9)

  1. 1. An insulating material for substrate packaging is characterized by comprising the following components in percentage by weight: 5-50wt% of first epoxy resin; 5-50wt% of a second epoxy resin; 0.1-10wt% of curing agent; 5-50wt% of inorganic filler; 0.2-20wt% of interface modifier; 0.1-10wt% of surface functionalized nano-reinforced fiber; 1-30wt% of solvent; 0.1-10wt% of auxiliary agent.
  2. 2. An insulating material for substrate packaging as claimed in claim 1, wherein the first epoxy resin is preferably a bisphenol fluorene epoxy compound and the second epoxy resin is preferably a bisphenol A epoxy compound.
  3. 3. The insulating material for substrate packaging as claimed in claim 1, wherein the curing agent is an amine curing agent and the inorganic filler is silica.
  4. 4. The insulating material for substrate packaging as recited in claim 1, wherein the interface modifier comprises at least one of an amino compound and a hydroxy compound containing a benzocyclobutene group.
  5. 5. An insulating material for substrate packaging as claimed in claim 4, wherein the amino compound containing a benzocyclobutene group is preferably 4-aminobenzocyclobutene and the hydroxy compound containing a benzocyclobutene group is preferably 1-hydroxy-benzocyclobutene.
  6. 6. The insulating material for substrate packaging according to claim 1, wherein the surface-functionalized nano-reinforcing fiber is a polybenzobisoxazole nanofiber surface-modified with benzocyclobutene or a derivative thereof.
  7. 7. The insulating material for substrate packaging according to claim 6, wherein the benzocyclobutene derivative has A structure selected from BCB-B-A-B-BCB bilateral symmetry structural general formulA, and the central functional group A comprises any one of A connecting group selected from-CH 2 -、-C 6 H 2 -、-C 6 H 4 -, -O-, -S-, -NH-, -CO-, -COO-and-CONH-; the pendant functional group B includes, but is not limited to, either -NH 2 、-Si(CH 3 ) 2 -、-OH、-COOH、-CH=CH 2 、-OCH 3 、-OC 2 H 5 or-c≡ch functional groups.
  8. 8. The method for preparing an insulating material for substrate packaging according to any of claims 1 to 7, comprising the steps of: (1) Feeding the polybenzobisoxazole nanofiber PNF and benzocyclobutene or a derivative thereof into a reaction kettle according to a mass ratio of 1:1; (2) Adding a proper amount of organic solvent into a reaction kettle, wherein the organic solvent is selected from one or more of alcohols, ketones or dimethylbenzene; (3) Heating the reaction mixture to 160 ℃ under stirring, and keeping reflux reaction for 1-2 hours at the temperature, so as to realize functional modification of the surface of the reaction mixture; (4) Naturally cooling to room temperature after the reaction is finished, filtering and separating to obtain a solid product, washing the solid product with a solvent for multiple times, and drying the obtained solid in a vacuum oven at 80-100 ℃ to constant weight to obtain the polybenzobisoxazole nanofiber subjected to surface functionalization modification by using benzocyclobutene or a derivative thereof; (5) And (3) mixing the polybenzobisoxazole nanofiber which is obtained in the step (4) and is subjected to surface functionalization modification by using benzocyclobutene or a derivative thereof, a first epoxy resin, a second epoxy resin, a curing agent, an inorganic filler, an interface modifier, a solvent and an auxiliary agent according to mass percent, stirring for at least 1 hour at 1200rpm by using a stirrer, grinding or sanding and dispersing by using a three-roller grinder or a sand grinder, filtering to obtain slurry with the maximum particle size of not more than 25 mu m, namely the insulating material disclosed by the invention, coating the slurry on a PET film, drying to obtain a laminated dry film, and then continuously hot-stamping a layer of PP or PE protective film above the laminated dry film obtained by drying the insulating material, thereby forming a sandwich structure of the PET-INK insulating material-PP/PE.
  9. 9. The use of an insulating material for substrate packaging according to claim 1-7 for build-up of insulating medium in a packaging substrate for CPU, GPU, AI acceleration chips, high-end network processors.

Description

Insulating material for substrate packaging, preparation method and application thereof Technical Field The invention relates to the technical field of insulating materials, in particular to an insulating material for substrate packaging, a preparation method and application thereof. Background With the rapid development of artificial intelligence, 5G communication and big data application in recent years, chips are developing towards higher computation power, higher bandwidth and higher integration, the trend is synchronously pushing the rapid iteration of advanced packaging technology, the IC carrier board is used as a core carrier for connecting the chips and the printed circuit board, the performance of the IC carrier board is crucial, particularly in 2.5D/3D advanced packaging, insulating materials for bearing the multilayer wiring function become the key for determining the reliability of a packaging structure, and the core performance requirements of the insulating materials in the industry are mainly represented by dielectric constant, dielectric loss, glass transition temperature, peeling strength, cold and heat cycle resistance and long-term use reliability. In order to meet the above requirements, ABF (Ajinomoto Build-up Film) materials developed by japan taste element companies have become indispensable Build-up insulating materials in chip packages such as high-end CPU, GPU, AI accelerators and the like due to their excellent comprehensive properties, and are dominant in the global market, and ABF materials can realize extremely fine lines and have advantages of low dielectric loss, easy processing and the like, so that they are almost nouns of high-performance Build-up insulating films. However, there are still a number of bottleneck problems to be solved in the current technical system represented by ABF, which leaves room for the following technical innovation: 1. Although ABF materials have excellent dielectric properties, there is room for improvement in some models for their glass transition temperature Tg, and too low a Tg may result in softening of the material under high temperature applications, affecting long term reliability. 2. To achieve lower dielectric constants, high levels of inorganic fillers such as silica are typically incorporated, but this tends to result in reduced toughness and poor processability of the composite, and stress concentrations at the interface, affecting peel strength; 3. the current ABF material market is highly monopoly by japan's plain company, its global market occupancy exceeds 90%, and this single supply pattern brings potential supply chain security risks and cost pressures to the global semiconductor industry chain, especially the fast-growing chinese semiconductor industry. Based on the technical research and the industrial difficulties, development of a new insulating material for substrate packaging is needed, and a scheme for balancing comprehensive properties such as low dielectric property, good flame retardance, high peeling strength, cooling heat cycle resistance and the like is provided. Disclosure of Invention The invention mainly solves the technical problem of providing an insulating material for substrate encapsulation, a preparation method and application thereof by means of high-performance resin compounding, reactive interface enhancement and functionalized nanofiber synergistic modification. In order to solve the technical problems, the invention adopts a technical scheme that an insulating material for substrate encapsulation is provided, and comprises the following components in percentage by weight: 5-50wt% of first epoxy resin; 5-50wt% of a second epoxy resin; 0.1-10wt% of curing agent; 5-50wt% of inorganic filler; 0.2-20wt% of interface modifier; 0.1-10wt% of surface functionalized nano-reinforced fiber; 1-30wt% of solvent; 0.1-10wt% of auxiliary agent. Preferably, the first epoxy resin is preferably bisphenol fluorene epoxy compound, and the second epoxy resin is preferably bisphenol a epoxy compound. Preferably, the curing agent is an amine curing agent, and the inorganic filler is silicon dioxide. Preferably, the interface modifier includes at least one of an amino compound and a hydroxy compound containing a benzocyclobutene group. Preferably, the amino compound containing a benzocyclobutene group is preferably 4-aminobenzocyclobutene, and the hydroxy compound containing a benzocyclobutene group is preferably 1-hydroxy-benzocyclobutene. Preferably, the surface-functionalized nano-reinforcing fiber is a polybenzobisoxazole nanofiber surface-modified with benzocyclobutene or a derivative thereof. The structure of the benzocyclobutene derivative is selected as A structural general formulA of bilateral symmetry of BCB-B-A-B-BCB, the central functional group A comprises any connecting group of-CH 2-、-C6H2-、-C6H4 -, -O-, -S-, -NH-, -CO-, -COO-or-CONH-, and the side functional group B comprises any functional group of- -NH2、-Si(C