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CN-121975268-A - High-flow low-shrinkage epoxy plastic package material for BGA (ball grid array) and preparation method thereof

CN121975268ACN 121975268 ACN121975268 ACN 121975268ACN-121975268-A

Abstract

The invention relates to the technical field of electronic packaging, in particular to a high-flow low-shrinkage epoxy molding compound for BGA and a preparation method thereof, and the epoxy molding compound comprises, by weight, 2.8-5.3 parts of biphenyl type epoxy resin, 0.5-1.5 parts of bisphenol F type epoxy resin, 1.5-2.5 parts of phenol aralkyl type phenolic resin, 0.8-1.8 parts of biphenyl aralkyl type phenolic resin, 87.5-89 parts of silicon dioxide, 0.15-0.35 parts of silane coupling agent and 0.01-0.5 part of additive, wherein the fluidity and shrinkage of a product are balanced on the premise of ensuring the basic performance of the epoxy molding compound by optimizing the selection and the cooperation of the raw materials in a system, so that the warping and line punching problems in the practical application process are solved, and the application requirements of a large-size BGA product are met.

Inventors

  • ZHOU KAI
  • LU HAIPING
  • GU HAIYONG

Assignees

  • 上海道宜半导体材料有限公司

Dates

Publication Date
20260505
Application Date
20260310

Claims (10)

  1. 1. The epoxy plastic package material with high flow and low shrinkage for BGA is characterized by comprising, by weight, 2.8-5.3 parts of biphenyl type epoxy resin, 0.5-1.5 parts of bisphenol F type epoxy resin, 1.5-2.5 parts of phenol aralkyl type phenolic resin, 0.8-1.8 parts of biphenyl aralkyl type phenolic resin, 87.5-89 parts of silicon dioxide, 0.15-0.35 part of silane coupling agent and 0.01-0.5 part of additive.
  2. 2. The epoxy molding compound according to claim 1, wherein the epoxy molding compound comprises, by weight, 3.7-4.5 parts of biphenyl type epoxy resin, 0.7-1 part of bisphenol F type epoxy resin, 1.8-2.3 parts of phenol aralkyl type phenolic resin, 1-1.5 parts of biphenyl aralkyl type phenolic resin, 88-88.5 parts of silicon dioxide, 0.2-0.3 part of silane coupling agent, and 0.2-0.3 part of additive.
  3. 3. The epoxy molding compound according to claim 1, wherein the biphenyl type epoxy resin comprises epoxy resins with the structures shown in the formula (1) and the formula (2) in the mass ratio of (0.8-1.8) (2.5-3.5), Formula (1): ,n =1~3; formula (2): 。
  4. 4. The epoxy molding compound according to claim 1, wherein the bisphenol F type epoxy resin has a structure represented by formula (3), Formula (3): 。
  5. 5. The epoxy molding compound of claim 1, wherein the phenol aralkyl type phenolic resin has a structure represented by formula (4), Formula (4): ,n =1~5。
  6. 6. The epoxy molding compound of claim 1, wherein the biphenyl aralkyl type phenolic resin has a structure shown in formula (5), Formula (5): ,n=2-10。
  7. 7. The epoxy molding compound of claim 1, wherein the silica has a maximum particle size of <55 μm.
  8. 8. The epoxy molding compound of claim 1, wherein the silane coupling agent comprises an epoxy-containing silane coupling agent.
  9. 9. The epoxy molding compound of claim 1, wherein the additive comprises at least one of a mold release agent, an ion scavenger, carbon black, a catalyst, a bonding agent, and a low stress agent.
  10. 10. A method for preparing the epoxy molding compound according to any one of claims 1 to 9, comprising the steps of: The epoxy plastic package material with high flow and low shrinkage rate for BGA is prepared by mixing biphenyl type epoxy resin, bisphenol F type epoxy resin, phenol aralkyl type phenolic resin, biphenyl aralkyl type phenolic resin, silicon dioxide, a silane coupling agent and additives to obtain a mixture, mixing and extruding the mixture, cooling and crushing.

Description

High-flow low-shrinkage epoxy plastic package material for BGA (ball grid array) and preparation method thereof Technical Field The invention relates to the technical field of electronic packaging, in particular to an epoxy plastic packaging material with high flow and low shrinkage for BGA and a preparation method thereof. Background Warpage and wire punching become an increasingly serious problem as the size of BGA (ball grid array) products becomes larger and the wire bonds used become longer. Excessive warpage can affect subsequent upper plate processing, and excessive wire punching can affect electrical performance. Chinese patent (issued publication No. CN 116731653B) discloses a small-space display screen epoxy packaging material, a preparation method and application thereof, wherein different epoxy resins are used in a compounding way, the epoxy resins are modified, the synergistic performance of each component is utilized, the warping property and the shrinkage rate of a product are improved, but the problems of warping and line flushing in the actual application process of the product cannot be effectively solved. Disclosure of Invention In order to solve the problems, the invention provides the high-flow low-shrinkage epoxy molding compound for the BGA, which balances the fluidity and shrinkage of the product on the premise of ensuring the basic performance of the epoxy molding compound by optimizing the selection and the matching of the raw materials in a system, solves the problems of warping and line punching in the practical application process and meets the application requirements of large-size BGA products. The invention provides a high-flow low-shrinkage epoxy molding compound for BGA, which comprises the following raw materials, by weight, 2.8-5.3 parts of biphenyl epoxy resin, 0.5-1.5 parts of bisphenol F epoxy resin, 1.5-2.5 parts of phenol aralkyl type phenolic resin, 0.8-1.8 parts of biphenyl aralkyl type phenolic resin, 87.5-89 parts of silicon dioxide, 0.15-0.35 part of silane coupling agent and 0.01-0.5 part of additive. In one embodiment, the epoxy molding compound comprises, by weight, 3.7-4.5 parts of biphenyl type epoxy resin, 0.7-1 part of bisphenol F type epoxy resin, 1.8-2.3 parts of phenol aralkyl type phenolic resin, 1-1.5 parts of biphenyl aralkyl type phenolic resin, 88-88.5 parts of silicon dioxide, 0.2-0.3 part of silane coupling agent and 0.2-0.3 part of additive. In one embodiment, the biphenyl type epoxy resin comprises epoxy resins with the structures shown in the formula (1) and the formula (2) in the mass ratio of (0.8-1.8): 2.5-3.5, Formula (1):,n =1~3; formula (2): 。 in one embodiment, the mass ratio of the epoxy resins of the structures shown in the formula (1) and the formula (2) is (1-1.5): 2.7-3. In one embodiment, the type of the epoxy resin with the structure shown in the formula (1) is Japanese chemical NC-3000, and the type of the epoxy resin with the structure shown in the formula (2) is Mitsubishi chemical YX-4000. In one embodiment, the bisphenol F type epoxy resin has a structure represented by formula (3), Formula (3):。 In one embodiment, the bisphenol F type epoxy resin is ZLF-160B, available from Nanlon New Material technology (SiAn) Co. In one embodiment, the phenol aralkyl type phenol resin has a structure represented by formula (4), Formula (4):,n =1~5。 In one embodiment, the phenol aralkyl type phenolic resin is MEH-7500, derived from Ming He formation. In one embodiment, the biphenyl aralkyl type phenolic resin has a structure shown in formula (5), Formula (5):,n=2-10。 In one embodiment, the biphenyl aralkyl type phenolic resin is MEH-7851, derived from the Ming He formation. In the development of epoxy molding compound products, there is an inherent conflict between flowability (usually manifested as low melt viscosity, long spiral flow length) and low shrinkage (usually requiring high inorganic filler loadings). Increasing the content of inorganic fillers (e.g., silica) is the most effective means to reduce the coefficient of thermal expansion and shrinkage, but too high a filler content can significantly increase the viscosity of the system, compromising flowability. Conversely, reducing filler content or using low viscosity resins to improve flowability, compromises dimensional stability and mechanical strength. According to the invention, the biphenyl type epoxy resin and the bisphenol F type epoxy resin which comprise structures shown in the formula (1) and the formula (2) are adopted at the same time, the addition amount of the biphenyl type epoxy resin, the bisphenol F type epoxy resin and the bisphenol F type epoxy resin is further controlled, so that a resin system still has excellent flow characteristics (spiral flow length reaches 72-80 inches) under the filling of 87.5-89%, and meanwhile, the molding shrinkage rate of a product is kept between 0.13% and 0.18%, the dimensional stability of a packaged device and the reliability o