CN-121975272-A - Method for improving epoxy resin performance based on honeycomb structure and bionic honeycomb skeleton composite resin

Abstract

The invention relates to a method for improving the performance of epoxy resin based on a honeycomb structure and bionic honeycomb epoxy resin, wherein the improvement method adopts a dual-cured epoxy resin matrix to obtain a metamaterial framework based on the honeycomb structure through 3D printing, and then the metamaterial framework is cast and molded to obtain an oriented bionic honeycomb framework composite resin, and the method comprises the following steps of S1, preparing the dual-cured epoxy resin matrix according to a proportion; S2, selecting the framework shape and the framework filler material, drawing a three-dimensional model of the oriented bionic honeycomb framework, printing and curing the dual-cured epoxy resin matrix by adopting a photo-curing 3D printing technology, and simultaneously arranging the framework filler along the printing direction to obtain the oriented bionic honeycomb framework, and S3, pouring and filling the bionic honeycomb framework by adopting thermosetting resin, curing, and cooling to obtain the oriented bionic honeycomb framework composite resin. The epoxy resin material has higher heat conducting performance under the condition of low filler content, and the mechanical performance of the epoxy resin material is improved to a certain extent by the framework structure.

Inventors

• HUANG ZHENGYONG
• CAI RU
• LI JIAN
• HE RUN
• ZHANG YINGFAN
• LI CHANGHENG
• WANG FEIPENG
• CHEN WEIGEN

Assignees

• 重庆大学

Dates

Publication Date

20260505

Application Date

20250902

Claims (10)

1. 1. The method for improving the performance of the epoxy resin based on the honeycomb structure is characterized in that a metamaterial framework based on the honeycomb structure is obtained by adopting a dual-cured epoxy resin matrix through 3D printing, and then the composite resin of the oriented bionic honeycomb framework is obtained by casting molding, and the preparation method comprises the following specific steps: s1, preparing a dual-cured epoxy resin matrix according to a proportion; S2, selecting a framework shape and a framework filler material, drawing a three-dimensional model of the oriented bionic honeycomb framework, printing and curing a dual-curing epoxy resin matrix by adopting a photo-curing 3D printing technology, and simultaneously arranging the framework filler along a printing direction so as to obtain the oriented bionic honeycomb framework; And S3, pouring and filling the bionic honeycomb skeleton obtained in the step S2 by adopting thermosetting resin, drying and solidifying in vacuum after filling, and cooling to room temperature to obtain the oriented bionic honeycomb skeleton composite resin.
2. 2. The method for improving the performance of epoxy resin based on honeycomb structure according to claim 1, wherein the addition amount of the skeleton filler in the step S2 is 0 to 20wt% of the total mass of the dual-cured epoxy resin and the skeleton filler.
3. 3. The method for improving the performance of the epoxy resin based on the honeycomb structure according to claim 2 is characterized in that in the step S2, flaky hexagonal boron nitride (hBN) is adopted as a skeleton filler, the particle size of the flaky hexagonal boron nitride (hBN) is 40-50 mu m, and the flaky hexagonal boron nitride (hBN) is aligned along the printing direction by photo-curing 3D printing layer by layer, so that the bionic honeycomb skeleton with alignment is obtained.
4. 4. The method for improving the performance of the epoxy resin based on the honeycomb structure according to claim 1, wherein in the step S2, the skeleton shape is selected from regular hexagons as a printing bionic honeycomb skeleton in a single cell shape, the cell wall length of the single cell is 3mm, and the cell wall thickness of the single cell is 0.5mm.
5. 5. The method for improving the performance of the epoxy resin based on the honeycomb structure according to claim 2, wherein the dual-curing epoxy resin matrix in the step S1 comprises a thermosetting resin matrix and a photosensitive resin, and the mass ratio of the thermosetting resin matrix to the photosensitive resin is 3-5:1.
6. 6. The method for improving the performance of epoxy resin based on honeycomb according to claim 4, wherein the thermosetting resin matrix comprises 2-ethyl-4-methylimidazole (2E 4 MI), bisphenol A epoxy monomer (DGEBA) and alicyclic epoxy monomer (C-EP) mixed according to a mass ratio of 2.1:19.53:8.37, and the photosensitive resin comprises tripropylene glycol diacrylate (TPGDA), trimethylol propyl triacrylate (TMPTA), epoxy Acrylate (EA) and photoinitiator 819 (BAPO) mixed according to a mass ratio of 6:1:3:0.05.
7. 7. The method for improving the performance of the epoxy resin based on the honeycomb structure according to claim 1, wherein in the step S3, before casting and filling, the thermosetting resin is vacuumized in a vacuum drying oven at the temperature of 60 ℃ for 15-20 minutes, after casting and filling, the thermosetting resin is transferred into the vacuum drying oven for curing treatment, and is kept for 3 hours at the constant temperature of 80 ℃ to enable the thermosetting resin to be completely cured, and finally, the filled bionic honeycomb skeleton composite epoxy resin with the orientation is cooled to the room temperature.
8. 8. The method for improving the performance of the epoxy resin based on the honeycomb structure according to claim 1, wherein the thickness of the layer of the 3D printing is 40 μm in the step S2, the layer is printed at room temperature and in a dark place, and the light set by the 3D printer is ultraviolet light with the wavelength of 405 nm.
9. 9. The bionic honeycomb skeleton composite resin is characterized by comprising a dual-cured epoxy resin matrix and a bionic honeycomb skeleton, wherein skeleton filler is added in the bionic honeycomb skeleton, the addition amount of the skeleton filler is 0-20wt% of the total mass of the dual-cured epoxy resin and the skeleton filler, the dual-cured resin comprises a thermosetting resin matrix and a photosensitive resin, and the mass ratio of the thermosetting resin matrix to the photosensitive resin is 3-5:1.
10. 10. The bionic honeycomb skeleton composite resin according to claim 9, wherein the skeleton filler is flaky hexagonal boron nitride hBN with a particle size of 40-50 μm.

Description

Method for improving epoxy resin performance based on honeycomb structure and bionic honeycomb skeleton composite resin Technical Field The invention belongs to the field of insulating nonmetallic materials, and particularly relates to a method for improving the performance of epoxy resin based on a honeycomb structure and bionic honeycomb skeleton composite resin. Background Epoxy resins are commonly used insulating materials for solid high voltage devices due to their low cost of manufacture and excellent electrical, mechanical, and interfacial adhesion properties. In the actual operation of the solid high-voltage power equipment, the current-carrying capacity is large, and a large amount of heat is easily generated due to the conductive loss of the epoxy insulating material, so that the temperature of the epoxy resin is increased, the insulation aging is accelerated, and the service life of the equipment is shortened. And when a short circuit fault occurs, a large amount of heat can be generated in a very short time by instantaneous heavy current, and the temperature rise problem of the insulating material can be further aggravated. How to effectively solve the problem of insulation aging acceleration of the epoxy resin material due to temperature rise, and has very important research value for prolonging the service life of solid high-voltage power equipment. At present, two methods for improving the thermal conductivity of epoxy resin are commonly used, namely intrinsic modification and filling modification. The intrinsic heat-conducting polymer generally depends on chemical synthesis, directional stretching, spinning and other means to regulate and control the molecular chain structure, and the technological process is complex, has harsh operation conditions and has high requirements on equipment and technology. The intrinsic polymer material with excellent heat conducting performance is still mainly remained in a laboratory research stage at present due to factors such as raw material cost, preparation process efficiency and the like, and large-scale production is not realized yet, and in practical industrial application, as the feasibility and economy of production are both required, a second filling type modification method is often adopted, and the filling type heat conducting polymer composite material with relatively simple preparation process and better cost control is used. The filling type modification method is to blend and compound a filler with high heat conduction capacity with a polymer, and the heat conduction filler forms a heat conduction network in the polymer, so that the heat conduction of the polymer is improved. As research goes deep, more and more researchers are not simply blending the thermally conductive filler with the polymer to increase the overall thermal conductivity of the material, but rather shift the research center of gravity to the ordered arrangement and orientation control of the filler inside the polymer matrix, aiming at significantly increasing the thermal conductivity of the composite material in a particular direction by building a continuous thermally conductive path in that direction. Common two-dimensional filler orientation methods include a hot pressing method, a suction filtration method, an electrostatic spinning method, a 3D printing method and the like. Research shows that constructing the filler with high orientation can realize the improvement of heat conduction performance, and constructing the three-dimensional framework conduction network of the oriented filler on the basis can further improve the heat conductivity of the composite material. Compared with a simple blending method, the composite material with the three-dimensional network structure shows higher thermal conductivity at a low filling content, and the three-dimensional network can construct a close-contact thermal conduction path, so that scattering of phonons at the interface between the fillers is avoided, and heat transfer is improved. Honeycomb is a natural, typical type of mechanical metamaterial, and researchers have described honeycomb as an "absolutely perfect in terms of labor and wax saving" engineering, and for over two thousand years scientists and philosophy have generated great interest in honeycomb structures in honeycombs. These hexagonal prismatic wax cells built up from bees are used for nesting larvae, storing honey and preserving pollen, are well known as a strong institute of precision engineering and are favored by their elegant geometry. The honeycomb has a two-dimensional array of cells in-plane, with parallel stacks in the out-of-plane direction, characterizing the periodic topological distribution. The topology of the repeating unit cells can significantly affect the mechanical properties of these honeycomb materials, and by properly designing the microstructure and topology can give the honeycomb unprecedented properties such as Negative Poisson's Ratio (