Search

CN-121975384-A - Protective coating for electronic component surface and preparation method thereof

CN121975384ACN 121975384 ACN121975384 ACN 121975384ACN-121975384-A

Abstract

The invention discloses a protective coating for the surface of an electronic component and a preparation method thereof, and relates to the technical field of coatings. The invention comprises the following raw materials, by mass, 100 parts of epoxy modified acrylic ester copolymer, 8-9 parts of butyl acetate, 6-7 parts of propylene glycol methyl ether acetate, 6-7 parts of isododecane, 4-6 parts of modified boron nitride nanotubes, 3-5 parts of synergistic agent, 0.2-0.4 part of 2-methylimidazole, 0.1-0.3 part of defoaming agent, 0.2-0.4 part of leveling agent and 0.1-0.3 part of bactericide. The epoxy modified acrylic ester copolymer, the modified boron nitride nano tube, the synergist and other components are introduced, so that the weldability of leads of electronic components is not affected, and meanwhile, the adhesive force, the impact resistance, the wear resistance, the weather resistance, the aging resistance, the dielectric strength, the volume resistivity and the high-frequency signal suitability of the protective coating are also effectively improved. Therefore, the invention has wider application prospect.

Inventors

  • LI CHANGHONG
  • LIU XINYU

Assignees

  • 重庆新原港科技发展有限公司

Dates

Publication Date
20260505
Application Date
20260319

Claims (10)

  1. 1. The protective coating for the surface of the electronic component is characterized by comprising the following raw materials, by mass, 100 parts of an epoxy modified acrylic ester copolymer, 8-9 parts of butyl acetate, 6-7 parts of propylene glycol methyl ether acetate, 6-7 parts of isododecane, 4-6 parts of modified boron nitride nanotubes, 3-5 parts of a synergistic agent, 0.2-0.4 part of 2-methylimidazole, 0.1-0.3 part of a defoaming agent, 0.2-0.4 part of a leveling agent and 0.1-0.3 part of a bactericide; the modified boron nitride nanotube is prepared by carrying out high-temperature reflux hydroxylation modification on the boron nitride nanotube by a sodium hydroxide aqueous solution, carrying out hydrothermal compound modification on boric acid and urea, and then carrying out grafting modification on gamma-glycidol ether oxypropyl trimethoxy silane; The synergist is prepared from aminopropyl isobutyl cage polysilsesquioxane, hexachlorocyclotriphosphazene, 2-amino ethanol and triethylamine.
  2. 2. The protective coating for the surface of an electronic component according to claim 1, wherein the preparation method of the epoxy-modified acrylate copolymer is as follows: A1, uniformly mixing methyl methacrylate, butyl acrylate, isooctyl acrylate, hydroxyethyl methacrylate, glycidyl methacrylate, azodiisobutyronitrile and dodecyl mercaptan to obtain a premixed monomer solution; A2, adding butyl acetate and propylene glycol methyl ether acetate into a reaction kettle under the nitrogen atmosphere, heating to 82 ℃ after sealing, dripping a premixed monomer solution, stirring for 6-7h, adding azodiisobutyronitrile, stirring for 2-3h, and filtering to obtain the epoxy modified acrylate copolymer.
  3. 3. The protective coating for the surface of an electronic component according to claim 2, wherein the mass ratio of methyl methacrylate, butyl acrylate, isooctyl acrylate, hydroxyethyl methacrylate, glycidyl methacrylate, azobisisobutyronitrile, and dodecyl mercaptan in A1 is 35-42:25-30:15-18:10-12:15-18:0.8-1:0.2; The mass ratio of the butyl acetate to the propylene glycol methyl ether acetate to the premixed monomer solution to the azodiisobutyronitrile in the A2 is 50-55:50-55:100-110:0.1.
  4. 4. The protective coating for the surface of an electronic component according to claim 2, wherein the modified boron nitride nanotube is prepared by the following method: B1, adding boron nitride nanotubes into sodium hydroxide aqueous solution, stirring and refluxing for 12-14 hours at 80 ℃, cooling, filtering, washing and drying to obtain hydroxylated boron nitride nanotubes; b2, adding the hydroxylated boron nitride nanotube, boric acid and urea into deionized water, performing ultrasonic treatment at 2-6 ℃ for 2 hours, sealing, reacting at 200 ℃ for 24-26 hours, cooling, centrifugally washing and drying to obtain the composite treatment boron nitride nanotube; And B3, adding the composite treatment boron nitride nanotube into absolute ethyl alcohol, performing ultrasonic dispersion for 1h, adding deionized water and glacial acetic acid, adjusting the pH to 4.5-5.0, stirring for 30-40min, adding gamma-glycidol ether oxypropyl trimethoxysilane, stirring and refluxing for 6-8h under the nitrogen atmosphere at 60 ℃, cooling, filtering, washing and drying to obtain the modified boron nitride nanotube.
  5. 5. The protective coating for the surface of an electronic component according to claim 4, wherein the dosage ratio of the aqueous sodium hydroxide solution to the boron nitride nanotube in the B1 is 500-550 mL/10 g; The concentration of the sodium hydroxide aqueous solution in the step B1 is 2mol/L; And B2, wherein the mass ratio of the deionized water to the hydroxylated boron nitride nano tube to the boric acid to the urea is 400-420:5:3:2.
  6. 6. The protective coating for the surface of an electronic component according to claim 4, wherein the dosage ratio of the absolute ethyl alcohol, the composite boron nitride nanotube, the deionized water, the glacial acetic acid and the gamma-glycidoxypropyl trimethoxysilane in the B3 is 500-550mL:5g:10g:0.5g:2g.
  7. 7. The protective coating for the surface of an electronic component according to claim 1, wherein the preparation method of the synergist is as follows: c1, dissolving aminopropyl isobutyl cage-shaped polysilsesquioxane and triethylamine in anhydrous 1, 4-dioxane to obtain a composite solution; dissolving hexachlorocyclotriphosphazene in anhydrous 1, 4-dioxane under the protection of nitrogen, dripping the compound solution at 0 ℃, reacting for 8 hours at 25 ℃, filtering, adding 2-amino ethanol 1 and triethylamine 1 into the filtrate, stirring for 24-26 hours under the nitrogen atmosphere at 60 ℃, adding 2-amino ethanol 2 and triethylamine 2, stirring for 12-14 hours at 40 ℃, cooling, filtering, dripping the filtrate into n-hexane, standing for 6-8 hours, filtering, and drying to precipitate to obtain the synergist.
  8. 8. The protective coating for the surface of an electronic component according to claim 7, wherein the amount of the aminopropyl isobutyl cage-like polysilsesquioxane, triethylamine and anhydrous 1, 4-dioxane in C1 is 8 g/10 g/200-220 mL.
  9. 9. The protective coating for the surface of an electronic component according to claim 7, wherein the dosage ratio of hexachlorocyclotriphosphazene, anhydrous 1, 4-dioxane, composite solution, 2-aminoethanol 1, triethylamine 1, 2-aminoethanol 2, triethylamine 2, and n-hexane in C2 is 5 g/200 ml:200-220ml:4 g/4 g/3 g/500 ml.
  10. 10. The method for producing a protective coating for electronic component surfaces according to any one of claims 1 to 9, characterized by comprising the steps of: mixing butyl acetate, propylene glycol methyl ether acetate and isododecane uniformly, adding a modified boron nitride nanotube, performing ultrasonic treatment at 0-8 ℃ for 40-60min, adding a synergist and 2-methylimidazole, stirring at 25 ℃ for 1h, dripping the mixture into the epoxy modified acrylate copolymer under a nitrogen atmosphere, stirring for 20-30min, adding a defoaming agent, a flatting agent and a bactericide, stirring for 20-30min, standing for 2h, and filtering to obtain the protective coating for the surface of the electronic component.

Description

Protective coating for electronic component surface and preparation method thereof Technical Field The invention relates to the technical field of coatings, in particular to a protective coating for the surface of an electronic component and a preparation method thereof. Background The electronic component is a core basic element of the electronic information industry, is widely applied to the key fields of consumer electronics, automotive electronics, communication equipment, aerospace and the like, and the operation stability and service life of the electronic component directly determine the use safety and core performance of the terminal equipment. In order to isolate external adverse factors such as water vapor, salt fog, mold, mechanical impact and the like, the surface of the electronic component is usually coated with special protective coating, so that a protective barrier is constructed, and the environmental adaptability and the working reliability of the component are improved. However, in the practical application process, the protective coating for the surface of the electronic component still has the following core performance short plates that firstly, weather resistance and ageing resistance are insufficient, and under severe working conditions such as high-low temperature circulation, damp-heat alternation, ultraviolet irradiation and the like, the coating is easy to generate pulverization, cracking and falling problems, the protective barrier is fast invalid, long-term stable protection cannot be provided for the component, secondly, the suitability of high-frequency signals is insufficient, and in a high-frequency application scene, the coating is easy to cause the increase of standing wave ratio of the signals, the increase of insertion attenuation and the signal transmission precision and efficiency of the interfering component. Therefore, the weather resistance, aging resistance and high-frequency signal suitability of the existing protective coating for the surface of the electronic component still need to be improved. Disclosure of Invention The invention aims to provide a protective coating for the surface of an electronic component and a preparation method thereof, which solve the following technical problems: The existing protective coating for the surface of the electronic component still has the problem of poor weather resistance, ageing resistance and high-frequency signal suitability. The aim of the invention can be achieved by the following technical scheme: The protective coating for the surface of the electronic component comprises the following raw materials, by mass, 100 parts of an epoxy modified acrylic ester copolymer, 8-9 parts of butyl acetate, 6-7 parts of propylene glycol methyl ether acetate, 6-7 parts of isododecane, 4-6 parts of modified boron nitride nanotubes, 3-5 parts of a synergistic agent, 0.2-0.4 part of 2-methylimidazole, 0.1-0.3 part of a defoaming agent BYK-065, 0.2-0.4 part of a leveling agent BYK-333 and 0.1-0.3 part of a bactericide BIT-20; the modified boron nitride nanotube is prepared by carrying out high-temperature reflux hydroxylation modification on the boron nitride nanotube by a sodium hydroxide aqueous solution, carrying out hydrothermal compound modification on boric acid and urea, and then carrying out grafting modification on gamma-glycidol ether oxypropyl trimethoxy silane; The synergist is prepared from aminopropyl isobutyl cage polysilsesquioxane, hexachlorocyclotriphosphazene, 2-amino ethanol and triethylamine. Preferably, the preparation method of the epoxy modified acrylate copolymer comprises the following steps: A1, uniformly mixing methyl methacrylate, butyl acrylate, isooctyl acrylate, hydroxyethyl methacrylate, glycidyl methacrylate, azodiisobutyronitrile and dodecyl mercaptan to obtain a premixed monomer solution; A2, adding butyl acetate and propylene glycol methyl ether acetate into a reaction kettle under the nitrogen atmosphere, heating to 82 ℃ after sealing, dripping the premixed monomer solution at 1g/min, stirring for 6-7h at 82 ℃, adding azodiisobutyronitrile, stirring for 2-3h at 82 ℃, cooling, and filtering with a 300-mesh filter screen to remove precipitate, thus obtaining the epoxy modified acrylate copolymer. Preferably, the mass ratio of the methyl methacrylate, the butyl acrylate, the isooctyl acrylate, the hydroxyethyl methacrylate, the glycidyl methacrylate, the azobisisobutyronitrile and the dodecyl mercaptan in the A1 is 35-42:25-30:15-18:10-12:15-18:0.8-1:0.2; The mass ratio of the butyl acetate to the propylene glycol methyl ether acetate to the premixed monomer solution to the azodiisobutyronitrile in the A2 is 50-55:50-55:100-110:0.1. Preferably, the preparation method of the modified boron nitride nanotube comprises the following steps: b1, adding boron nitride nanotubes into sodium hydroxide aqueous solution, stirring and refluxing for 12-14 hours at 80 ℃, cooling, filtering, centrifugally washing p