CN-121975442-A - Low-warpage chip adhesive composition, preparation method and application

Abstract

The invention provides a low-warpage chip adhesive composition, a preparation method and application thereof, wherein the low-warpage chip adhesive composition comprises, by mass, 10-25 parts of acrylic ester, 2-8 parts of hydroxy acrylic ester, 5-20 parts of acrylic ester oligomer, 10-25 parts of BMI, 1-5 parts of peroxide, 20-60 parts of filler and 0.2-1 part of anti-precipitation aid. The low-warpage chip adhesive disclosed by the invention adopts components with specific content, realizes better overall interaction, has the characteristics of quick solidification, good adhesive property and no resin precipitation, greatly improves the warpage problem after large-size chip mounting, and is suitable for the field of large-chip mounting adhesives such as camera modules.

Inventors

• JIANG CHAO
• SONG QI
• HE DANWEI
• CHEN DAN
• TAO XIAOLE
• HE YONGFU

Assignees

• 杭州之江有机硅化工有限公司
• 杭州之江新材料有限公司

Dates

Publication Date

20260505

Application Date

20251225

Claims (10)

1. 1. The low-warpage chip adhesive composition is characterized by comprising, by mass, 10-25 parts of acrylic ester, 2-8 parts of hydroxy acrylic ester, 5-20 parts of acrylic ester oligomer, 10-25 parts of BMI, 1-5 parts of peroxide, 20-60 parts of filler and 0.2-1 part of anti-precipitation auxiliary agent; The acrylate oligomer comprises at least 1 epoxy group and 1 acrylate group.
2. 2. The low-warpage chip adhesive composition of claim 1, wherein the acrylate oligomer is selected from epoxy acrylate oligomers having acrylate groups and epoxy functional groups on the same main chain, and has a viscosity of 1000-8000 mPa.s at 60 ℃.
3. 3. The low-warpage chip adhesive composition according to claim 1, wherein the acrylic acid ester is a monofunctional monomer, and is at least one selected from the group consisting of isodecyl acrylate, dicyclopentenyl ethoxylated acrylic acid ester, cetyl acrylate, stearyl acrylate, lauryl acrylate and lauryl methacrylate.
4. 4. The low-warpage chip adhesive composition according to claim 1, wherein the hydroxy acrylate is at least one selected from the group consisting of di-trimethylolpropane tetraacrylate, trimethylolpropane trimethacrylate and tris (2-hydroxyethyl) isocyanurate triacrylate.
5. 5. The low warpage chip adhesive composition as set forth in claim 1, wherein the BMI is at least one selected from the group consisting of UMI-0, BMI-TCD and BMI-968.
6. 6. The low warpage chip adhesive composition according to claim 1, wherein the peroxide is at least one selected from the group consisting of bis (4-tert-butylcyclohexyl) peroxydicarbonate, dibenzoyl peroxide, tert-butyl peroxy-2-ethylhexanoate, dicumyl peroxide and dicetyl peroxydicarbonate.
7. 7. The low-warpage chip adhesive composition according to claim 1, wherein the filler is at least one selected from the group consisting of silica powder, alumina, calcium carbonate, talc and fumed silica.
8. 8. The low-warpage chip adhesive composition according to claim 1, wherein the anti-precipitation aid is at least one selected from the group consisting of perfluoropolyether diol and fluorocarbon surfactant.
9. 9. The preparation method of the low-warpage chip adhesive is characterized by comprising the following steps of: (1) The acrylic ester, the hydroxy acrylic ester, the acrylic ester oligomer, the BMI and the anti-precipitation auxiliary agent in the low-warpage chip adhesive composition according to the mass part ratio are stirred and dissolved, and the resin mother solution is obtained by cooling and then adding the peroxide and uniformly stirring; (2) Adding filler into the obtained resin mother liquor, uniformly mixing, and then defoaming for 15-25 min under the vacuum degree of less than or equal to-0.095 MPa to obtain the low-warpage chip adhesive.
10. 10. The use of the low-warpage chip adhesive prepared by the preparation method of the low-warpage chip adhesive in large-size chip packaging.

Description

Low-warpage chip adhesive composition, preparation method and application Technical Field The invention belongs to the technical field of chip packaging, and particularly relates to a low-warpage chip adhesive composition, a preparation method and application. Background As semiconductor chip packaging requirements increase, chip attach materials are required to have higher performance. The epoxy resin adhesive is widely applied to the industrial field due to the excellent physical and chemical properties, but has the problems of high curing temperature and long curing time, and is difficult to meet the requirements of low-temperature sensitive devices and automatic production. In recent years, epoxy resin adhesives which are rapidly cured at low temperature are focused, and rapid curing at low temperature can be realized, but mainly rigid epoxy resins such as bisphenol A and the like are used, and when flexible plastics or large chips are bonded, the deformation after curing is large, the warping rate is high, and the application of the epoxy resin adhesives in bonding large chips is limited. To solve these problems, developing a chip adhesive that can be cured quickly and maintain good adhesion while having low warpage is a challenge. The existing chip adhesive mainly comprises epoxy resin and acrylic resin, but the epoxy resin and the acrylic resin have the limitations that the epoxy resin is small in deformation after being cured and poor in flexibility, and the acrylic resin is good in flexibility and insufficient in interface bonding strength and large in curing shrinkage rate. Therefore, the novel low-warpage chip adhesive can meet the requirement of quick solidification, can effectively control warpage, has good adhesive property and interface combination property, and has important significance for improving the reliability and efficiency of chip packaging. Disclosure of Invention The first object of the present invention is to provide a low warpage chip adhesive composition. For this purpose, the above object of the present invention is achieved by the following technical solutions: The low-warpage chip adhesive composition comprises, by mass, 10-25 parts of acrylic ester, 2-8 parts of hydroxy acrylic ester, 5-20 parts of acrylic ester oligomer, 10-25 parts of BMI, 1-5 parts of peroxide, 20-60 parts of filler and 0.2-1 part of anti-precipitation auxiliary agent; The acrylate oligomer comprises at least 1 epoxy group and 1 acrylate group. The invention can also adopt or combine the following technical proposal when adopting the technical proposal: as a preferable technical scheme of the invention, the acrylic ester oligomer is selected from epoxy acrylic ester oligomer with acrylic ester groups and epoxy functional groups on the same main chain, and the viscosity of the epoxy acrylic ester oligomer is 1000-8000 mPas at 60 ℃. As a preferable technical scheme, the acrylic ester is a monofunctional monomer and is at least one selected from isodecyl acrylate, dicyclopentenyl ethoxylated acrylic ester, cetyl acrylate, stearyl acrylate, lauryl acrylate and lauryl methacrylate. As a preferable technical scheme of the invention, the hydroxy acrylic ester is at least one selected from di-trimethylolpropane tetraacrylate, trimethylolpropane trimethacrylate and tris (2-hydroxyethyl) isocyanurate triacrylate. As a preferable technical scheme of the invention, the BMI is at least one selected from UMI-0, BMI-TCD and BMI-968. The BMI material is introduced into an acrylic ester curing system as a high-temperature-resistant modifier, and has the main functions of improving processing compatibility by utilizing the liquid property of the BMI material, and obviously improving the heat resistance, high-temperature mechanical property and dimensional stability of the cured material by copolymerizing with an acrylic ester network or forming an interpenetrating network. BMI is used as one of matrix resins, and has the advantages of rapid solidification, low stress and good high-temperature adhesion. As a preferable technical scheme of the invention, the peroxide is at least one selected from bis (4-tert-butylcyclohexyl) peroxydicarbonate, dibenzoyl peroxide, tert-butyl peroxy-2-ethylhexanoate, dicumyl peroxide and dicetyl peroxydicarbonate. As a preferable technical scheme of the invention, the filler is at least one selected from silica micropowder, alumina, calcium carbonate, talcum powder and fumed silica. As a preferable technical scheme of the invention, the anti-precipitation auxiliary agent is at least one selected from perfluoropolyether glycol and fluorocarbon surfactant. The second object of the invention is to provide a preparation method of the low-warpage chip adhesive. For this purpose, the above object of the present invention is achieved by the following technical solutions: the preparation method of the low-warpage chip adhesive comprises the following steps of: (1) The acrylic ester, the hydroxy acryl