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CN-121975448-A - High-viscosity low-residual-adhesive electronic component fixing adhesive tape and preparation method thereof

CN121975448ACN 121975448 ACN121975448 ACN 121975448ACN-121975448-A

Abstract

The invention provides a high-viscosity low-residual-adhesive electronic element fixing adhesive tape, which comprises an adhesive layer, a buffer layer and a substrate layer, wherein the buffer layer adopts a gradient component gradual change structure, the substrate layer adopts a blend of polyethylene terephthalate and polyethylene naphthalate with a mass ratio of 7:3, and one side of the surface of the substrate layer connected with the buffer layer is provided with a bionic micro-nano structure. According to the invention, through the design of a three-layer structure, the pressure-sensitive adhesive layer provides high-viscosity and low-residue core performance, the gradient transition layer eliminates interface stress, the bionic substrate layer improves structural stability and interface binding force, and the electronic element fixing adhesive tape with high-viscosity, low-residue and wide-temperature-range stability, simple preparation process and controllable cost is developed.

Inventors

  • YAN JIANGANG
  • WANG JITING

Assignees

  • 苏州晋汉元电子科技有限公司

Dates

Publication Date
20260505
Application Date
20260109

Claims (7)

  1. 1. The high-viscosity low-residual-adhesive electronic element fixing adhesive tape is characterized by comprising an adhesive layer, a buffer layer and a substrate layer, wherein the buffer layer adopts a gradient component gradual change structure, the substrate layer adopts a blend of polyethylene terephthalate and polyethylene naphthalate with a mass ratio of 7:3, and one side of the surface of the substrate layer connected with the buffer layer is provided with a bionic micro-nano structure.
  2. 2. The high-viscosity low-residual adhesive electronic component fixing tape of claim 1, wherein the adhesive in the adhesive layer comprises the following components in parts by weight: 85-90 parts of acrylic ester-organic silicon graft copolymer, 5-8 parts of polyurethane coated rosin resin microcapsule, 0.5-1 part of polyether modified polydimethylsiloxane, 0.3-0.5 part of hindered amine light stabilizer, 110-130 parts of ethyl acetate-butyl acetate mixed solvent and 0.2-0.4 part of polyoxyethylene sorbitan monooleate in a mass ratio of 4:1; The preparation method of the acrylic ester-organic silicon graft copolymer comprises the following steps: Adding methyl methacrylate, butyl acrylate and gamma-methacryloxypropyl trimethoxy silane into a reaction kettle, adding a mixed solvent of ethyl acetate and butyl acetate with the mass ratio of 4:1, stirring uniformly, simultaneously adding an initiator of azobisisobutyronitrile and dodecyl mercaptan, wherein the weight ratio of the methyl methacrylate to the butyl acrylate to the gamma-methacryloxypropyl trimethoxy silane to the mixed solvent to the initiator to the dodecyl mercaptan is 30:70:5-8:110-130:0.5-1:0.1-0.3, heating the reaction kettle to 60-80 ℃, introducing nitrogen to remove air, stirring at constant temperature for 5-8 h, and cooling the system to room temperature after the reaction is finished to obtain the acrylate-organosilicon graft copolymer.
  3. 3. The high-viscosity low-residual adhesive electronic component fixing tape according to claim 2, wherein the buffer layer adopts a gradient component gradual change structure and comprises a glue layer side layer, an intermediate layer and a substrate side layer; The raw materials of the glue layer side layer comprise, by weight, 60 parts of hydrogenated nitrile rubber, 20 parts of liquid epoxy soybean oil, 15 parts of phenolic resin and 2 parts of vulcanizing agent; The intermediate layer raw materials comprise, by weight, 40 parts of hydrogenated nitrile rubber, 30 parts of polyimide micro powder, 15 parts of liquid epoxy soybean oil, 12 parts of phenolic resin and 2 parts of vulcanizing agent; the substrate side layer raw material comprises, by weight, 50 parts of polyimide micro powder, 30 parts of hydrogenated nitrile butadiene rubber, 10 parts of liquid epoxy soybean oil, 8 parts of phenolic resin and 2 parts of vulcanizing agent.
  4. 4. The method for preparing the high-viscosity low-residual-adhesive electronic component fixing tape according to claim 3, comprising the steps of: s1, hot-pressing a substrate layer by adopting a template with grooves, wherein the diameter of the grooves is 5-8 mu m, the depth is 2-3 mu m, the distance is 10-12 mu m, the hot-pressing temperature is 120-140 ℃, the pressure is 0.8-1.2 MPa, the pressure maintaining time is 30-60S, the surface of the substrate is enabled to form a micro-convex structure, then plasma etching is carried out on one side of the substrate with the convex structure, the etching power is 80-120W, the etching time is 10-20S, and nano grooves are formed on the surface of the convex structure, so that the substrate with the bionic micro-nano structure is obtained; s2, coating the buffer layer on one side of the substrate layer with the bionic micro-nano structure according to the substrate layer side layer, wherein the intermediate layer and the adhesive layer side layer are sequentially coated on one side of the substrate layer with the bionic micro-nano structure, and vulcanizing after pre-curing to obtain the buffer layer; And S3, coating the adhesive on the surface of the release layer, predrying for 10min at 80 ℃, transferring to the surface of the gradient transition layer, and curing for 20min at 110 ℃ to obtain the high-viscosity low-residue electronic element fixing adhesive tape.
  5. 5. The method for preparing a high-viscosity low-residual-adhesive electronic component fixing tape according to claim 4, wherein the pre-curing temperature is 120 ℃, the time is 10-15 min, the curing temperature is 150 ℃ and the time is 30-40 min.
  6. 6. The high-tackiness low-residual-adhesive electronic part fixing tape according to claim 2, wherein the preparation method of the polyurethane-coated rosin resin microcapsule comprises the steps of: Preparing an aqueous phase, namely mixing sodium dodecyl sulfate, polyvinyl alcohol and water according to a mass ratio of 0.5-1:0.3-0.5:100, and stirring to form a uniform aqueous phase; The preparation of an oil phase, namely mixing hydrogenated rosin resin, ethyl acetate and polyhexamethylene adipamide according to the mass ratio of 20-30:15-25:5-8, and uniformly stirring to form the oil phase; emulsion dispersion, namely slowly dripping the oil phase into the water phase, and stirring and emulsifying for 15-20 min at the rotating speed of 1500-2000 r/min to form oil/water emulsion; And forming the microcapsule, namely dripping adipoyl chloride into the emulsion, stirring at the rotation speed of 800-1000 r/min, reacting for 2-3 h at the reaction temperature of 40-50 ℃, and obtaining the microcapsule.
  7. 7. The electronic component fixing tape with high tackiness and low residual adhesive according to claim 1, wherein the thickness of the adhesive layer is 12-18 μm, the thickness of the buffer layer is 8-15 μm and the thickness of the base material layer is 25-50 μm.

Description

High-viscosity low-residual-adhesive electronic component fixing adhesive tape and preparation method thereof Technical Field The invention relates to the field of adhesive tapes, in particular to a high-viscosity low-residual-adhesive electronic component fixing adhesive tape and a preparation method thereof. Background Along with the rapid development of the electronic information industry towards miniaturization, high precision and high reliability, the packaging and assembly process of high-end electronic components such as semiconductor chips, flexible circuit boards (FPCs), micro sensors and the like has placed severe demands on auxiliary fixing materials. The electronic component fixing adhesive tape is used as a core auxiliary material, and has the core effects of realizing the precise temporary fixing or permanent positioning of the electronic component in the processes of surface mounting, high-temperature welding, packaging positioning, equipment repairing and the like, ensuring no residual adhesive residue during subsequent stripping, and avoiding the pollution to the conductive contact or packaging surface of the component to cause fatal faults such as short circuit, poor contact and the like. Therefore, "high adhesion" and "low residue" are key performance requirements of electronic component mounting tapes, and the synergistic balance of the two is a key direction of industry technical attack. In the prior art, the adhesive layer of the electronic component fixing adhesive tape is mainly divided into three systems of acrylic esters, organic silicon and composite materials, but the technical bottlenecks of high viscosity and low residue are difficult to achieve, namely, the traditional acrylic ester pressure-sensitive adhesive tape has excellent initial adhesion and high adhesion holding capacity, can meet the requirement of quick component fixing, but has high cohesive strength and interface compatibility regulation difficulty, the problems of adhesive layer fracture, adhesion promotion and precipitation and the like are easy to occur after aging in a high-temperature high-humidity environment or in a stripping process, residual adhesive residues pollute a precise electronic component, the organic silicon adhesive tape has low surface energy characteristics, the stripping residual adhesive risk is low, the viscosity is generally insufficient, the initial adhesion is particularly low in a low-temperature environment, the stable fixing of the component is difficult to achieve, the cost of an organic silicon material is high, the large-scale application of the adhesive tape is limited, and the traditional composite adhesive layer adhesive tape adopts a simple physical blending mode to compound acrylic ester and organic silicon, has poor compatibility, the phase separation phenomenon occurs, the adhesive tape performance is unstable, and the adhesion is easy to be directly added, and the residual adhesive is easy to be further moved and precipitated. Besides the defect of adhesive layer formula, the design of the existing multi-layer structure adhesive tape has obvious defects that most products adopt a binary simple structure of an adhesive layer-base material, or a single-performance transition layer is additionally arranged, the difference of modulus between the adhesive layer and the base material is not considered, so that interface stress is concentrated, interface peeling is easy to occur under the action of a high-temperature process or external force, and further adhesive failure or adhesive residue is caused, meanwhile, the surface of the base material is of a smooth structure, the combination of the adhesive layer and the transition layer or the adhesive layer only depends on the acting force between interface molecules, the combination strength is insufficient, layering is easy to occur under a high-temperature and high-humidity environment, and the application of the adhesive tape in a high-end electronic manufacturing scene is further limited. In addition, part of the high-viscosity low-residue adhesive tapes in the prior art rely on a complex dynamic crosslinking system or an external triggering stripping technology (such as UV curing and high Wen Jienian), and can balance the performance to a certain extent, but the problems of complex process, large equipment investment, narrow suitability and the like exist, so that the requirements of industrialized mass production and the process compatibility of different electronic elements are difficult to meet. Therefore, developing an electronic component fixing adhesive tape which has high viscosity, low residue and wide temperature range stability, has simple preparation process and controllable cost becomes an urgent need for solving the pain point of the current industry and promoting the development of the high-end electronic manufacturing industry. Disclosure of Invention The invention aims to provide a high-viscosity low-residual-a