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CN-121975468-A - Low-stress flexible packaging adhesive, preparation method thereof and application thereof in bendable electronic device

CN121975468ACN 121975468 ACN121975468 ACN 121975468ACN-121975468-A

Abstract

The invention belongs to the technical field of packaging adhesives, and particularly relates to a low-stress flexible packaging adhesive, a preparation method thereof and application thereof in a bendable electronic device. The preparation method of the low-stress flexible packaging adhesive comprises the following steps of heating 80-100 parts of modified epoxy resin to 50-60 ℃, adding 100-120 parts of filler and 0.6-1.2 parts of antioxidant, stirring for 20-30 min, adding 20-30 parts of curing agent, 4-8 parts of curing accelerator and 1.2-1.8 parts of defoamer, stirring for 10-20 min, and obtaining the low-stress flexible packaging adhesive, wherein the flexibility of a material is effectively improved, and meanwhile, the lower internal stress is guaranteed, and the material is applied to a bendable electronic device.

Inventors

  • LIU KANGZHONG
  • WANG SHIYU
  • LV YONG
  • CUI CAOXIANG
  • ZHANG CHUNYANG
  • GUO BAIJUN
  • ZHANG FUXUAN

Assignees

  • 国鲸合创(青岛)科技有限公司

Dates

Publication Date
20260505
Application Date
20260116

Claims (10)

  1. 1. A low-stress flexible packaging adhesive is characterized in that, The modified epoxy resin comprises, by weight, 80-100 parts of modified epoxy resin, 100-120 parts of filler, 20-30 parts of curing agent, 4-8 parts of curing accelerator, 1.2-1.8 parts of defoamer and 0.6-1.2 parts of antioxidant; The preparation method of the modified epoxy resin comprises the steps of preparing the modified epoxy resin through an addition reaction by taking ethyl tri (dimethyl siloxane) silane and allyl glycidyl ether as raw materials and chloroplatinic acid as a catalyst.
  2. 2. A low stress flexible encapsulant as defined in claim 1, wherein, The addition reaction comprises the steps of stirring and heating 50-60 parts by weight of ethyl tri (dimethylsiloxane) silane to 100-110 ℃, preserving heat for 20-30 min, cooling to 80-90 ℃, adding 0.2-0.6 part of chloroplatinic acid catalyst and 60-80 parts of allyl glycidyl ether, and carrying out the addition reaction for 2-4 h at 100-110 ℃ to obtain the modified epoxy resin.
  3. 3. A low stress flexible encapsulant as defined in claim 1, wherein, The filler is hollow mesoporous silica and PEG modified silica.
  4. 4. A low stress flexible encapsulant as defined in claim 3, wherein, The mass ratio of the hollow mesoporous silica to the PEG modified silica is (1-2): 1.
  5. 5. A low stress flexible encapsulant as defined in claim 1, wherein, The curing agent is carboxyl-terminated hyperbranched polyester curing agent.
  6. 6. A low stress flexible encapsulant as defined in claim 5, wherein, The carboxyl-terminated hyperbranched polyester curing agent has the carboxyl number of 6/mol, the acid value of 340mg KOH/g, the hydroxyl value of <15mg KOH/g and the molecular weight of 950g/mol.
  7. 7. A low stress flexible encapsulant as defined in claim 1, wherein, The curing accelerator is selected from one or more of 2-ethyl-4-methylimidazole, 2-phenylimidazole and 1-cyanoethyl-2-ethyl-4-methylimidazole.
  8. 8. A low stress flexible encapsulant as defined in claim 1, wherein, The defoamer is one or more selected from the group consisting of basf FoamStar SI, 2292, winning wound TEGO Airex, and Zhanxin ADDITOL VXW 6210N.
  9. 9. A method of preparing the low stress flexible packaging adhesive of any of claims 1-8, comprising the steps of: And heating 80-100 parts of modified epoxy resin to 50-60 ℃ in parts by weight, adding 100-120 parts of filler and 0.6-1.2 parts of antioxidant, stirring for 20-30 min, adding 20-30 parts of curing agent, 4-8 parts of curing accelerator and 1.2-1.8 parts of defoamer, and stirring for 10-20 min to obtain the low-stress flexible packaging adhesive.
  10. 10. Use of a low stress flexible encapsulant as claimed in any of claims 1-8 in a flexible electronic device.

Description

Low-stress flexible packaging adhesive, preparation method thereof and application thereof in bendable electronic device Technical Field The invention belongs to the technical field of packaging adhesives, and particularly relates to a low-stress flexible packaging adhesive, a preparation method thereof and application thereof in a bendable electronic device. Background In the information age today, with the rapid development of portable mobile communication, computer and military electronic technologies, the demand for integrated circuits has increased dramatically, which has led to the rapid development of microelectronic packaging technologies, whose important support is electronic packaging materials. For integrated circuit, the electronic packaging material is a package (sealing body), and the packaging measures are adopted to physically support and protect the chip, so that the chip can avoid pollution and corrosion of impurities, water vapor and various chemical atmospheres in the atmosphere, the integrated circuit chip can play a role under stable conditions, and the packaging material plays an important role in the key performances such as thermal performance, even reliability and the like of devices and circuits. The flexible packaging adhesive is one of core materials of flexible electronic devices (such as flexible displays, wearable devices, electronic skins, flexible sensors, implantable medical devices and the like), and is required to meet special requirements which are not possessed by traditional rigid packaging, and particularly can reliably protect internal precise electronic elements from environmental factors (moisture, oxygen, dust, chemical substances, mechanical damage) under the mechanical deformation of repeated bending, stretching, twisting and the like. The invention discloses a low-stress packaging adhesive for a mini LED screen and a preparation method thereof, wherein the packaging adhesive takes epoxy resin as a matrix, active silicon micropowder and a toughening agent are added to jointly reduce the internal stress of the packaging adhesive, the toughening agent is a flexible polymer molecular chain, is easy to wind and act with the matrix (epoxy resin) chain, plays roles of toughening modification and plasticization, can effectively reduce the internal stress of the epoxy resin, and the active silicon micropowder has the characteristics of low thermal expansion coefficient and good temperature resistance, can improve the interface compatibility with the epoxy resin matrix and promote dispersion and reduce the internal stress of sizing materials under the action of the toughening agent. However, the invention requires additional toughening agent, and the preparation method of the toughening agent is complex. Therefore, on the basis of not adding a special toughening agent, the components are optimized and modified, and the filler is compounded, so that the low-stress packaging adhesive is prepared, and good flexibility is ensured, and can be smoothly applied to bendable electronic devices. Disclosure of Invention The invention aims to provide a low-stress flexible packaging adhesive, a preparation method thereof and application thereof in a bendable electronic device, wherein modified epoxy resin is prepared through addition reaction of ethyl tri (dimethyl siloxane) silane and allyl glycidyl ether, and the packaging adhesive is obtained by matching components such as compound filler, carboxyl-terminated hyperbranched polyester curing agent and the like, so that the flexibility of the material is effectively improved, and meanwhile, lower internal stress is ensured and the material is applied to the bendable electronic device. In order to achieve the above object, the present invention provides the following technical solutions: the invention provides a low-stress flexible packaging adhesive which comprises, by weight, 80-100 parts of modified epoxy resin, 100-120 parts of filler, 20-30 parts of curing agent, 4-8 parts of curing accelerator, 1.2-1.8 parts of defoaming agent and 0.6-1.2 parts of antioxidant. As a preferred embodiment, the weight part of the modified epoxy resin in the present invention may be 80 parts, 85 parts, 90 parts, 95 parts, 100 parts, or the like. As a preferred embodiment, the filler in the present invention may be 100 parts by weight, 105 parts by weight, 110 parts by weight, 115 parts by weight, 120 parts by weight, or the like. As a preferred embodiment, the curing agent of the present invention may be 20 parts by weight, 22 parts by weight, 24 parts by weight, 26 parts by weight, 28 parts by weight, 30 parts by weight, or the like. As a preferred embodiment, the weight part of the curing accelerator in the present invention may be 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, or the like. As a preferred embodiment, the defoaming agent of the present invention may be 1.2 parts, 1.3 parts, 1.4 parts, 1.5 parts, 1.6 parts, 1.7 parts, 1.8 parts, etc.