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CN-121975486-A - Organic silicon packaging adhesive film for space photovoltaic module and preparation method

CN121975486ACN 121975486 ACN121975486 ACN 121975486ACN-121975486-A

Abstract

The invention belongs to the field of photovoltaic packaging, and relates to an organic silicon packaging adhesive film for a space photovoltaic module and a preparation method thereof, wherein the organic silicon packaging adhesive film is prepared by coating a substrate film and performing heat curing, and comprises a composite matrix and a composite irradiation-resistant agent, wherein the composite matrix comprises linear silicone oil containing phenyl and body type silicone resin containing phenyl, which is in chemical connection with the linear silicone oil, the composite irradiation-resistant agent comprises titanate modified nano cerium oxide and silane modified nano zirconium oxide with synergistic effect, the ultraviolet irradiation resistance of the adhesive film obtained by compounding the composite matrix and the composite irradiation-resistant agent is 11000ESH, the electron irradiation resistance of the adhesive film is 1x10 15 e/cm 2 , and the temperature resistance range of the adhesive film is-196 ℃ to 400 ℃.

Inventors

  • Ke Jiexi
  • LI MIN

Assignees

  • 上饶海优威应用薄膜有限公司
  • 上海海优威新材料股份有限公司
  • 泰州海优威应用材料有限公司
  • 成都海优威新材料技术有限公司

Dates

Publication Date
20260505
Application Date
20260130

Claims (12)

  1. 1. The organic silicon packaging adhesive film for the space photovoltaic module is characterized by comprising the following components: a composite matrix comprising a phenyl-containing linear silicone oil, and a phenyl-containing bulk silicone resin chemically bonded to the linear silicone oil, and The composite radiation resistant agent is distributed in the composite matrix and comprises titanate modified nano cerium oxide and silane modified nano zirconium oxide with synergistic effect; Through the combination of the phenyl group in the composite matrix, the connection of the linear silicone oil and the bulk silicone resin and the cooperation of the titanate modified nano cerium oxide and the silane modified nano zirconium oxide, the ultraviolet radiation resistant amount of the organic silicon packaging adhesive film is 11000ESH, the electron radiation resistant amount is 1x10 15 e/cm 2 , and the temperature resistant range of the organic silicon packaging adhesive film is-196 ℃ to 400 ℃.
  2. 2. The silicone packaging adhesive film for a space photovoltaic module according to claim 1, wherein the linear silicone oil is vinyl-terminated methylphenyl silicone oil, and the phenyl content is 30.0-40.0wt%.
  3. 3. The organic silicon packaging adhesive film for a space photovoltaic module according to claim 1 or 2, wherein the bulk silicone resin is transparent vinyl methyl phenyl silicone resin, and the phenyl content is 10.0-30.0wt% and the vinyl content is 0.60-12.00wt%.
  4. 4. The organic silicon packaging adhesive film for the space photovoltaic module according to claim 3, wherein the particle size of the titanate modified nano zirconia is less than or equal to 50.0nm.
  5. 5. The organic silicon packaging adhesive film for the space photovoltaic module according to claim 3, wherein the particle size of the silane modified nano zirconia is 10.0-20.0 nm.
  6. 6. The silicone packaging adhesive film for a space photovoltaic module according to claim 3, further comprising hydrophobically modified fumed silica, wherein the particle size of the hydrophobically modified fumed silica is 10.0-20.0 nm.
  7. 7. The silicone packaging adhesive film for a space photovoltaic module according to claim 6, further comprising hydrogen-containing silicone oil, a transparent platinum catalyst, an inhibitor, a silane coupling agent and an ultraviolet absorber.
  8. 8. A preparation method of an organic silicon packaging adhesive film is characterized by comprising premix preparation, coating forming and heat curing preforming.
  9. 9. The method of claim 8, wherein the premix comprises titanate modified nano cerium oxide, silane modified nano zirconium oxide, composite radiation resistant agent, matrix mixture and cross-linked system dispersion.
  10. 10. The method of claim 8, wherein the coating comprises glue preparation and wet film preparation.
  11. 11. The method for preparing the organic silicon packaging adhesive film according to claim 10, wherein the wet film is prepared by uniformly coating the adhesive solution on a substrate film by adopting precise doctor blade coating or spraying equipment, wherein the coating thickness is set to be 0.05-0.20 mm, and the coating speed is set to be 0.6-1.2 m/min, so that the wet film attached to the surface of the substrate film is obtained.
  12. 12. The method for preparing a silicone packaging adhesive film according to claim 11, wherein the thermal curing preforming is that the wet film is heated and preformed, the heating temperature is set to be 80-120 ℃, and the heat preservation time is 10-50 minutes, so that the preformed silicone adhesive film is obtained.

Description

Organic silicon packaging adhesive film for space photovoltaic module and preparation method Technical Field The invention relates to the technical field of photovoltaic module packaging materials, in particular to an organic silicon packaging adhesive film for a space photovoltaic module and a preparation method thereof. Background Along with the continuous promotion of space exploration technology, the photovoltaic module is used as a core energy supply part of space equipment, and the long-term reliability of the photovoltaic module directly determines the success or failure of space tasks. The space environment has extremely harsh characteristics, the temperature fluctuation range is extremely large, such as a deep space low-temperature environment, a near-ground orbit insolation environment and a planetary surface high-temperature environment, and meanwhile, strong high-energy radiation such as gamma rays, high-energy ultraviolet rays and the like exists, so that the severe requirements of far-beyond-ground application are provided for the packaging adhesive film of the photovoltaic module. The conventional EVA and POE adhesive films for the ground photovoltaic module have weak irradiation resistance of C-C bonds in molecular chains, are easy to degrade and age under strong space irradiation, have poor high and low temperature resistance, are easy to be fragile and broken in an ultralow temperature environment, can be rapidly decomposed and flow at high temperature, and cannot be completely suitable for the extreme temperature environment of space. The conventional organic silica gel film has excellent temperature resistance by virtue of high bond energy (452 kJ/mol) of a Si-O-Si main chain, can resist a wider temperature range, has single molecular structure design, only depends on a basic organic silicon skeleton, cannot meet the requirements of radiation resistance and high temperature resistance at the same time, and can still generate molecular chain fracture and crosslinking degradation under the combined action of high Wen Jijiang radiation, so that the mechanical property and the optical property are attenuated sharply. Part of the prior art attempts to improve the radiation resistance of the organic silicon material by adding the radiation resistant auxiliary agent, but most of the materials are simply mixed, the radiation resistant auxiliary agent structure is not optimized, the problems of uneven dispersion of the auxiliary agent, poor compatibility with the organic silicon substrate and the like are easily caused, the light transmittance of a glue film is reduced, the photoelectric conversion efficiency of a photovoltaic module is affected, long-time radiation resistant protection cannot be formed, and the long-time service requirement of a space photovoltaic module is difficult to meet. Meanwhile, in the photovoltaic field, the adopted organic silicon material exists in a liquid form, the photovoltaic module is encapsulated in a potting mode, the problems of uneven film thickness, low production efficiency, easiness in generating structural defects such as bubbles and the like exist, the bubbles become starting points of irradiation degradation, and the reliability of the film in the space environment is further reduced. Although there are also methods for preparing solid-form silicone films, such as UV curing, thermal curing or a combination of both, the silicone films prepared by such methods have problems of low production efficiency, difficulty in weight reduction, low light transmittance, uneven thickness, etc., and the radiation resistance and temperature resistance of such silicone films cannot meet the demands of space photovoltaic modules. Disclosure of Invention Aiming at the defects of the prior art, the invention provides an organic silicon packaging adhesive film for a space photovoltaic module and a preparation method thereof, wherein the organic silicon packaging adhesive film can bear the temperature change of-196 ℃ to 400 ℃ in a space environment, has the ultraviolet radiation resistance of 11000ESH and the electron radiation resistance of 1x10 15e/cm2 and can not influence the light transmittance of the adhesive film through the combined scheme of optimizing a composite matrix molecular structure, radiation resistant agent compounding and advanced forming process. In one aspect, the invention provides an organic silicon packaging adhesive film for a space photovoltaic module, which has the following technical scheme: The organic silicon packaging adhesive film comprises a composite matrix and a composite radiation-resistant agent dispersed in the composite matrix, wherein the composite matrix comprises linear silicone oil containing phenyl groups and bulk silicone resin containing phenyl groups, the bulk silicone resin is in chemical connection with the linear silicone oil, the composite radiation-resistant agent comprises titanate modified nano cerium oxide and silane mo