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CN-121975488-A - LED packaging colloid presenting non-luminous color and preparation method thereof

CN121975488ACN 121975488 ACN121975488 ACN 121975488ACN-121975488-A

Abstract

The invention discloses an LED packaging colloid presenting non-luminous color and a preparation method thereof, belonging to the technical field of semiconductor device packaging. The packaging colloid consists of a colloid substrate and inorganic color paste uniformly dispersed in the colloid substrate. The inorganic color paste is uniformly mixed and solidified in the colloid through a specific preparation method, which comprises the steps of material preparation, premixing, vacuum stirring and defoaming, dispensing, solidification and the like. The LED device using the colloid can display stable preset color when not electrified, and the light emitted by the electrified colloid is transmitted through the colloid, so that the light emitting color is consistent with the natural color vision of the colloid. The invention realizes the integration of the coloring effect and the packaging body, solves the problems of easy falling off, color change and influence on the light effect of external coloring, and has the advantages of firm coloring, strong weather resistance, good process compatibility, environmental protection, reliability and the like.

Inventors

  • HUANG HONGTIAN
  • ZHU ZHENGFEI

Assignees

  • 贵州旭鼎光电科技有限公司

Dates

Publication Date
20260505
Application Date
20260320

Claims (8)

  1. 1. An LED encapsulant exhibiting a non-luminescent color, comprising: A gel base material (1); Inorganic color paste (2) uniformly dispersed inside the solidified colloid substrate (1); the inorganic color paste (2) is used for enabling the LED packaging colloid to present a preset color in a non-electrified state, and transmitting light rays emitted by the LED chip (3) in the electrified state, so that the color in the non-electrified state is consistent with the color in the electrified state.
  2. 2. An LED packaging colloid exhibiting non-luminescent color according to claim 1, characterized in that the mass ratio of the inorganic color paste (2) is 0.1% to 5% of the total mass of the colloid substrate (1) and inorganic color paste (2).
  3. 3. An LED encapsulation colloid exhibiting non-luminescent color according to claim 1, characterized in that the inorganic color paste (2) is an inorganic pigment dispersion resistant to high temperature and ultraviolet rays, the particle size of which is 0.1 μm to 10 μm.
  4. 4. The LED packaging gel exhibiting non-luminescent color according to claim 1, wherein the gel base material (1) is one or a combination of more of silicone gel, epoxy resin, modified silicone gel.
  5. 5. A method for preparing the LED encapsulant exhibiting a non-luminescent color as claimed in any one of claims 1 to 4, comprising the steps of: S1, preparing materials, and weighing an A component, a B component and an inorganic color paste (2) of a colloid substrate (1) according to a proportion; s2, premixing, namely primarily mixing the inorganic color paste (2) with one of the A component or the B component of the colloid substrate (1) to obtain a premix; S3, stirring and defoaming in vacuum, namely placing the premix and the other component of the colloid substrate (1) in a vacuum environment together for stirring and mixing, so that the inorganic color paste (2) is uniformly dispersed in the mixture, and removing bubbles; And S4, dispensing and curing, namely injecting the mixture processed in the step S3 into a packaging mold or dispensing the mixture on the surface of the LED chip (3), and heating and curing the mixture to form the solid packaging colloid with the inorganic color paste (2) uniformly dispersed therein.
  6. 6. The method according to claim 5, wherein in step S3, the vacuum degree of the vacuum environment is-0.095 MPa to-0.1 MPa, and the stirring time is 10 to 30 minutes.
  7. 7. The method according to claim 5, wherein in step S4, the heat curing temperature is 100 ℃ to 150 ℃ and the curing time is 1 to 4 hours.
  8. 8. An LED device, comprising: An LED chip (3); -an LED encapsulant (100) exhibiting a non-luminescent color according to any of claims 1-4 coating the LED chip (3); The LED packaging colloid (100) is combined with the surface of the LED chip (3) in a gapless way to form a sealing protection layer.

Description

LED packaging colloid presenting non-luminous color and preparation method thereof Technical Field The invention relates to the technical field of semiconductor device packaging, in particular to an LED packaging colloid presenting non-luminous color and a preparation method thereof. Background LED devices have been widely used in the fields of lighting, display, backlight, and the like because of their advantages of energy saving, long life, high brightness, and the like. With the increasing demands of the market for the individualization and the attractive appearance of products, the demands for coloring the LED devices (especially the encapsulation colloid parts thereof) are increasing. The traditional LED packaging colloid coloring or appearance treatment modes mainly have the following defects: external post-treatment coloring, such as spraying, coating a colored coating or attaching a colored film on the surface of the formed colorless transparent packaging colloid. The method has the main defects that the binding force between the coloring layer and the colloid substrate is weak, and the coating is easy to peel off, crack or fade after long-term use or under the high temperature and ultraviolet irradiation environment generated by the working of the LED, so that the attractive appearance is influenced, and the reliability and the service life of the product are reduced. In addition, the outer coating may be non-uniform, affecting product appearance consistency. Adding organic pigment or dye, and directly mixing the organic pigment into the packaging colloid raw material. Although the coloring process is relatively simple, most organic colorants have poor heat resistance, ultraviolet (UV) aging resistance. Under the high temperature generated by long-term working of the LED chip and the radiation of short-wave light (especially blue light and ultraviolet light) emitted by the LED chip, the molecular structure of the organic pigment is easy to be damaged, so that the color is fast faded and yellow, and the requirement of long service life of the LED device cannot be met. Meanwhile, part of the organic dye may be decomposed during aging to generate harmful substances. Impact on optical performance both of the above approaches may adversely affect the optical performance of the LED. The external coating or some organic pigments can absorb and scatter part of light, so that the light-emitting efficiency (light efficiency) of the LED is reduced, the light-emitting angle is changed, or the emitted light color is deviated, and the design goal that the appearance color when not lightened is consistent with the emitted light color when lightened is visually achieved is difficult. Therefore, a new LED packaging colloid coloring scheme is urgently needed in the art, which is required to have a firm, durable and stable coloring effect, can resist the working environment of high temperature and high irradiation of the LED, does not affect the original optical performance and reliability of the LED, and has simple and environment-friendly process and compatibility with the existing production line. Disclosure of Invention Aiming at the defects of the prior art, the invention aims to provide an LED packaging colloid presenting non-luminous color and a preparation method thereof, so as to solve the problems in the prior art. In order to achieve the above purpose, a specific embodiment of the present invention provides an LED packaging colloid exhibiting a non-light-emitting color, which includes a colloid substrate, and an inorganic color paste uniformly dispersed inside the solidified colloid substrate, wherein the inorganic color paste is used to make the LED packaging colloid exhibit a preset color in a non-power-on state, and transmit light emitted by an LED chip in a power-on state, so that the color in the non-power-on state is consistent with the color in the power-on state. According to the LED packaging colloid presenting the non-luminous color and the preparation method thereof, the LED packaging colloid can present stable and uniform preset color when not electrified, the color can be kept consistent with transmitted light visually when electrified and luminous, and the light transmittance, the mechanical strength and the luminous efficiency and the service life of the LED of the colloid are not influenced in the coloring process. In addition, the LED packaging colloid presenting the non-luminescent color and the preparation method thereof according to the present application may further have the following additional technical features: in one embodiment of the present application, the mass ratio of the inorganic color paste is 0.1% to 5% of the total mass of the colloidal substrate and inorganic color paste. In one embodiment of the present application, the inorganic color paste is a high temperature and ultraviolet resistant inorganic pigment dispersion having a particle size of 0.1 μm to 10 μm. In one e