CN-121975489-A - Electromagnetic shielding organic silicon pressure-sensitive adhesive and preparation method and application thereof

Abstract

The application belongs to the technical field of electromagnetic shielding materials, and particularly relates to an electromagnetic shielding organic silicon pressure-sensitive adhesive, a preparation method and application thereof; according to the electromagnetic shielding organic silicon pressure-sensitive adhesive, the metal doped and modified polyhedral oligomeric silsesquioxane is introduced into the organic silicon pressure-sensitive adhesive component, the characteristics of doped metal, containing a reactive organic group R, a nano cage-shaped structure and the like are adopted, the electromagnetic shielding organic silicon pressure-sensitive adhesive is compounded with components such as chain organopolysiloxane, vinyl MQ silicone resin and the like, the doping amount of the metal doped and modified polyhedral oligomeric silsesquioxane is regulated, so that the electromagnetic shielding organic silicon pressure-sensitive adhesive has excellent comprehensive performance, the requirements of modern electronic components and electronic equipment such as flexible electronic and new energy automobiles are met, and the technical problem that the electromagnetic shielding pressure-sensitive adhesive in the prior art is low in performance is solved.

Inventors

• QU QIONGLI
• ZHANG BIHONG

Assignees

• 佛山市天宝利硅工程科技有限公司

Dates

Publication Date

20260505

Application Date

20260324

Claims (10)

1. 1. An electromagnetic shielding organic silicon pressure sensitive adhesive is characterized by comprising a main agent and an auxiliary agent; the main agent comprises vinyl organopolysiloxane, hydrosilylation inhibitor, MQ silicone resin and metal doped modified polyhedral oligomeric silsesquioxane; the auxiliary agent comprises hydrogen-containing silicone oil, a hydrosilylation catalyst and an adhesion promoter.
2. 2. The electromagnetic shielding silicone pressure sensitive adhesive of claim 1, wherein the vinyl organopolysiloxane in the main agent is selected from at least two of vinyl terminated methyl vinyl polysiloxane, methyl terminated methyl vinyl polysiloxane, vinyl terminated polydimethylsiloxane, vinyl terminated dimethyl methyl vinyl polysiloxane, trimethyl terminated dimethyl-methyl vinyl polysiloxane, vinyl terminated methyl phenyl siloxane, dimethyl vinyl terminated polydimethylsiloxane, dimethyl vinyl terminated dimethyl-methyl vinyl polysiloxane, trimethyl terminated dimethyl-methyl vinyl polysiloxane.
3. 3. The electromagnetic shielding silicone pressure sensitive adhesive of claim 1, wherein the metal-doped modified polyhedral oligomeric silsesquioxane in the main agent is selected from at least one doped modified polyhedral oligomeric silsesquioxane in Al, ti, ni, fe, ag, cu.
4. 4. The electromagnetic shielding silicone pressure sensitive adhesive of claim 1, wherein the polyhedral oligomeric silsesquioxane is selected from polyhedral oligomeric silsesquioxanes containing reactive groups such as silicon hydroxyl groups, alkoxy silicon groups, silicon hydrogen bonds, vinyl groups, allyl groups, epoxy groups, and the like.
5. 5. The electromagnetic shielding silicone pressure sensitive adhesive according to claim 1, wherein the hydrogen-containing silicone oil in the auxiliary agent is selected from at least two of trimethylsilyl (methyl) terminated dimethyl-methyl hydrogen polysiloxane, trimethylsilyl terminated dimethyl-methyl hydrogen-methylphenyl polysiloxane, dimethylsilyl terminated polydimethylsiloxane, dimethylsilyl terminated methylphenyl polysiloxane, dimethylsilyl terminated trifluoropropyl methyl polysiloxane.
6. 6. The electromagnetic shielding silicone pressure sensitive adhesive of claim 1, wherein the MQ silicone resin is selected from at least one of methyl MQ silicone resin, vinyl MQ silicone resin, phenyl vinyl MQ silicone resin.
7. 7. The electromagnetic shielding silicone pressure sensitive adhesive of claim 1, wherein the adhesion promoter is selected from at least one of vinyl triacetoxy silane and glycidoxypropyl trimethoxy silane alkoxy interchange products, epoxy-containing alkoxysilane monomers, gamma- (2, 3-glycidoxypropyl) propyltrimethoxy silane, gamma- (2, 3-glycidoxypropyl) propyltriethoxysilane, gamma- (2, 3-glycidoxypropyl) propylmethyldimethoxy silane, gamma- (2, 3-glycidoxypropyl) propylmethyldiethoxy silane, beta- (3, 4-epoxycyclohexyl) ethyltrimethoxy silane, beta- (3, 4-epoxycyclohexyl) ethyltriethoxy silane.
8. 8. The electromagnetic shielding organic silicon pressure-sensitive adhesive according to claim 1, wherein the electromagnetic shielding organic silicon pressure-sensitive adhesive comprises, by mass, 10-80 parts of vinyl organopolysiloxane, 0.01-0.9 part of hydrosilylation inhibitor, 0.2-10 parts of metal doped modified polyhedral oligomeric silsesquioxane (POSS), 0.2-4 parts of hydrogen-containing silicone oil, 0.1-1 part of hydrosilylation catalyst, 0.3-2 parts of adhesion promoter and 10-60 parts of MQ silicone resin.
9. 9. A method for preparing an electromagnetic shielding organic silicon pressure-sensitive adhesive, which is characterized in that the electromagnetic shielding organic silicon pressure-sensitive adhesive as claimed in any one of claims 1-8 can be prepared, and comprises the following steps: Reacting POSS containing a reactive group with a metal source to obtain metal doped modified polyhedral oligomeric silsesquioxane; mixing metal doped modified polyhedral oligomeric silsesquioxane, vinyl organopolysiloxane, hydrosilylation inhibitor, MQ silicone resin and nonpolar or weakly polar organic solvent to obtain a main agent; and mixing the main agent, the hydrogen-containing silicone oil, the hydrosilylation catalyst and the adhesion promoter to obtain the electromagnetic shielding organic silicon pressure-sensitive adhesive.
10. 10. Use of an electromagnetic shielding silicone pressure sensitive adhesive as defined in any one of claims 1-8 in electronic component or electronic device packaging.

Description

Electromagnetic shielding organic silicon pressure-sensitive adhesive and preparation method and application thereof Technical Field The application belongs to the technical field of electromagnetic shielding materials, and particularly relates to an electromagnetic shielding organic silicon pressure-sensitive adhesive, a preparation method and application thereof. Background The pressure-sensitive adhesive for electromagnetic shielding is an electromagnetic shielding material which has the functions of electromagnetic shielding and adhesion fixation, on one hand, can effectively inhibit electromagnetic interference, on the other hand, has the characteristics of strong weather resistance, good adhesion, higher peel strength, good flexibility and the like, and is suitable for electronic components and electronic equipment with high flexibility requirements such as flexible circuits (FPC), wearable equipment and the like, so that the electronic components and the electronic equipment can still keep good electromagnetic shielding performance and adhesion performance in bending, folding and other states, and have strong tolerance to heat, oxidation, solvents, oils and the like, and have wide application prospect. The traditional pressure-sensitive adhesive for electromagnetic shielding can be doped with metal or metal oxide to provide an electromagnetic shielding function, however, the density of the metal or metal oxide is higher, the absorption bandwidth is narrower, the impedance performance is poor, the corrosion resistance is weaker, the pressure-sensitive adhesive is obviously difficult to be used as a packaging material in the miniaturized and high-density processing process, the traditional pressure-sensitive adhesive for electromagnetic shielding doped with metal or metal oxide is restricted from being applied to the advanced communication technology and miniature electronic devices, besides the metal or metal oxide, the inorganic conductive nano materials such as metal nano particles and carbon nano tubes are required to reach a dispersion threshold value in the filling amount in a pressure-sensitive adhesive polymer matrix, and a uniformly dispersed and continuous network channel with 'electromagnetic wave energy consumption' is formed, so that the electromagnetic shielding function can be effectively exerted, however, the uniform dispersion difficulty of the inorganic conductive nano materials such as metal and carbon is extremely high at present, the inorganic conductive nano materials are easy to be agglomerated in the polymer matrix, the continuity of the network channel with 'electromagnetic wave energy consumption' is destroyed, the original electromagnetic shielding performance for electromagnetic shielding is unfavorable, and when the excessive inorganic conductive nano materials are added, the flexibility, the mechanical shielding performance such as the whole strength of the polymer matrix is also reduced, and the whole mechanical shielding performance is unfavorable for the electromagnetic shielding performance is unfavorable as the packaging material. Therefore, there is a need to develop a novel electromagnetic shielding functional material suitable for pressure-sensitive adhesives for electromagnetic shielding to improve the performance of the pressure-sensitive adhesives for electromagnetic shielding at present. Disclosure of Invention In view of the above, the application provides an electromagnetic shielding organic silicon pressure-sensitive adhesive, a preparation method and application thereof, which are used for solving the technical problem of lower performance of the pressure-sensitive adhesive for electromagnetic shielding in the prior art. The first aspect of the application provides an electromagnetic shielding organic silicon pressure sensitive adhesive, which comprises a main agent and an auxiliary agent; The main agent comprises vinyl organopolysiloxane, hydrosilylation inhibitor and metal-doped modified polyhedral oligomeric silsesquioxane (POSS); the auxiliary agent comprises hydrogen-containing silicone oil, a hydrosilylation catalyst and an adhesion promoter. Preferably, the electromagnetic shielding organic silicon pressure sensitive adhesive further comprises MQ silicone resin. Preferably, the MQ silicone resin is at least one selected from methyl MQ silicone resin, vinyl MQ silicone resin and phenyl vinyl MQ silicone resin, the number average molecular weight of the MQ silicone resin is 3000-8000, and the polydispersity index is less than or equal to 1.6. Preferably, the electromagnetic shielding organic silicon pressure sensitive adhesive further comprises a nonpolar or weak polar organic solvent. Preferably, the nonpolar or weakly polar organic solvent is at least one selected from xylene, toluene, benzene, ethyl acetate, butyl ester, alkane solvent oil, and acetone. Preferably, the vinyl organopolysiloxane in the main agent is at least two selected from vinyl-te