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CN-121975501-A - Preparation method of compressible and rebound graphite heat conduction gasket and graphite heat conduction gasket

CN121975501ACN 121975501 ACN121975501 ACN 121975501ACN-121975501-A

Abstract

A preparation method of a compressible and rebound graphite heat-conducting gasket comprises the steps of preprocessing an artificial graphite film to obtain a preprocessed film, wherein the preprocessing comprises punching, bending, surface grafting and plasma surface treatment, epoxy modified polydimethylsiloxane resin is prepared according to a preset proportion, the preset proportion is 90-98% of epoxy modified polydimethylsiloxane, 2-10% of polydimethylsiloxane and 0.1-0.4% of platinum catalyst in percentage by mass, the epoxy modified polydimethylsiloxane resin is coated on the surface of the preprocessed film, the preprocessed film with a preset layer number is clamped to obtain blocky graphite, and the blocky graphite is sliced and post-treated to obtain the graphite heat-conducting gasket. The epoxy modified polydimethylsiloxane resin with a specific proportion is matched to form a stable cross-linked network structure, so that the structural strength and heat conduction stability of the gasket are further enhanced.

Inventors

  • CHEN WENBIN
  • LUO YUFENG

Assignees

  • 深圳联腾达科技有限公司
  • 广东联腾达科技有限公司

Dates

Publication Date
20260505
Application Date
20260127

Claims (10)

  1. 1. The preparation method of the compressible and resilient graphite heat-conducting gasket is characterized by comprising the following steps: pretreating an artificial graphite film to obtain a pretreated film, wherein the pretreatment comprises punching, bending, surface grafting and plasma surface treatment; preparing epoxy modified polydimethylsiloxane resin according to a preset proportion, wherein the preset proportion is 90-98% of epoxy modified polydimethylsiloxane, 2-10% of polydimethylsiloxane and 0.1-0.4% of platinum catalyst by mass percent; Coating the epoxy modified polydimethylsiloxane resin on the surface of the pretreatment film, and closing the pretreatment film with a preset layer number to obtain blocky graphite; slicing and post-processing the blocky graphite to obtain the graphite heat-conducting gasket.
  2. 2. The method of claim 1, wherein the pretreatment of the artificial graphite film to obtain a pretreated film, wherein the pretreatment comprises the steps of punching, bending, surface grafting and plasma surface treatment, and comprises the following steps: Carrying out laser drilling on the artificial graphite film to obtain a perforated artificial graphite film; pressing the perforated artificial graphite film by a bending die to obtain a semicircular, triangular or tooth-shaped bent artificial graphite film; surface grafting is carried out on the bent artificial graphite film through 3- (2, 3-glycidoxy) propyl trimethoxy silane to obtain a grafted artificial graphite film; And carrying out plasma treatment on the grafted artificial graphite film to obtain a pretreatment film, wherein the plasma treatment power is 3-20KW, the output voltage is 5-20KV, and the single-sided treatment time is 1-10S.
  3. 3. The preparation method of the thermal conductive gasket according to claim 2, wherein the step of carrying out laser drilling on the artificial graphite membrane to obtain the perforated artificial graphite membrane is characterized in that the diameter of the pore diameter is 0.1-1mm, the diameter of the pore diameter is less than or equal to the thickness of the thermal conductive gasket of the finished product graphite, and the distance between the pore diameters is 1-30mm.
  4. 4. The method according to claim 2, wherein the step of surface grafting the bent artificial graphite film with 3- (2, 3-glycidoxy) propyltrimethoxysilane to obtain a grafted artificial graphite film comprises: Placing the bent artificial graphite film at 150-350 ℃ for 10-60min, taking out, and cooling to room temperature; mixing 1-5% of 3- (2, 3-glycidoxy) propyl trimethoxy silane and 95-99% of distilled water according to the mass ratio to obtain a treatment solution; and (3) placing the bent artificial graphite film in the treatment liquid, soaking for 30-360min at 15-100 ℃, and drying at 50-80 ℃ after soaking.
  5. 5. The method according to claim 1, wherein the step of applying the epoxy-modified polydimethylsiloxane resin on the surface of the pretreatment film and closing the pretreatment film with a predetermined number of layers to obtain graphite blocks comprises: uniformly coating the epoxy modified polydimethylsiloxane resin on the surface of the pretreatment film; Closing the die of the pretreatment film with the preset layer number, wherein the die closing pressure is 0.2-50Mpa, the die pressing temperature is 130-180 ℃, and the curing time is 30-300min, so that the blocky graphite is obtained; slicing the blocky graphite along the vertical direction of bending to obtain the graphite heat-conducting gasket to be shaped.
  6. 6. The method of claim 5, wherein the step of post-treating the bulk graphite to obtain a graphite thermal pad comprises: Cleaning the graphite heat-conducting gasket to be shaped by a cleaning solvent, wherein the cleaning solvent is one or more of water, ethanol, petroleum ether and n-hexane; performing surface leveling on the graphite heat-conducting gasket to be shaped, wherein the plane polishing precision is less than 0.01mm, and obtaining the graphite heat-conducting gasket; And carrying out secondary cleaning and drying on the graphite heat conduction gasket through the cleaning solvent.
  7. 7. The manufacturing method according to claim 2, wherein the bending die comprises a gear engagement die, an upper and lower die pressing flat die or a combination of the flat die and the gear engagement die, the engagement surface or the die clamping surface of the bending die is provided with continuous grooves and protrusions, the cross-sectional shape of the grooves and the protrusions is one or more of semicircle, triangle or tooth form, the diameter of the semicircle is 0.1-1mm, the triangle is isosceles triangle, the side length on the die pressing surface is 0.1-1mm, the maximum angle is 60-90 degrees, the modulus of the tooth form die is less than 1.0, and the distance between the grooves and the protrusions is 0.1-1mm.
  8. 8. The method according to claim 1, further comprising pre-pressing the pre-treated film before laminating the artificial graphite film, so that the resin uniformly permeates into the pores and the interlayer gaps of the pre-treated film.
  9. 9. A compressible resilient graphite thermal pad prepared by the method of preparing a graphite thermal pad according to any one of claims 1 to 8.
  10. 10. The graphite heat conducting gasket of claim 9, wherein the graphite heat conducting gasket is prepared by an artificial graphite film, and the artificial graphite film is a graphite film coiled material prepared by high-temperature carbonization, graphitization and calendaring of a polyimide film and a polyaromatic oxadiazole film.

Description

Preparation method of compressible and rebound graphite heat conduction gasket and graphite heat conduction gasket Technical Field The invention relates to the technical field of heat-conducting gaskets, in particular to a preparation method of a compressible and resilient graphite heat-conducting gasket and the graphite heat-conducting gasket. Background With the rapid development of the AI intelligent industry, the high-power chip heat conduction requirement is higher. The thermal conductivity coefficient of the artificial graphite film is high and reaches 2100W/m.K, and the prepared graphite thermal conductive gasket has ultrahigh thermal conductivity characteristics theoretically, but the prepared graphite thermal conductive gasket has the following problems that 1, the raw material artificial graphite film is harder and has poorer flexibility, and the graphite gasket prepared by lamination has no compression and rebound resilience performance and is difficult to be applied in practice. 2. The artificial graphite film has low surface activity, poor compatibility with resin and weak adhesive force. 3. The artificial graphite film has poisoning phenomenon to the metal catalyst, and influences the resin curing. Disclosure of Invention In view of the foregoing, the present application has been developed to provide a method of preparing a compressible resilient graphite thermal pad and a graphite thermal pad that overcomes, or at least partially solves, the foregoing problems, including: a preparation method of a compressible and rebound graphite heat-conducting gasket comprises the following steps: pretreating an artificial graphite film to obtain a pretreated film, wherein the pretreatment comprises punching, bending, surface grafting and plasma surface treatment; preparing epoxy modified polydimethylsiloxane resin according to a preset proportion, wherein the preset proportion is 90-98% of epoxy modified polydimethylsiloxane, 2-10% of polydimethylsiloxane and 0.1-0.4% of platinum catalyst by mass percent; Coating the epoxy modified polydimethylsiloxane resin on the surface of the pretreatment film, and closing the pretreatment film with a preset layer number to obtain blocky graphite; slicing and post-processing the blocky graphite to obtain the graphite heat-conducting gasket. Further, the pretreatment of the artificial graphite film is performed to obtain a pretreated film, wherein the pretreatment comprises the steps of punching, bending, surface grafting and plasma surface treatment, and the pretreatment comprises the following steps: Carrying out laser drilling on the artificial graphite film to obtain a perforated artificial graphite film; pressing the perforated artificial graphite film by a bending die to obtain a semicircular, triangular or tooth-shaped bent artificial graphite film; surface grafting is carried out on the bent artificial graphite film through 3- (2, 3-glycidoxy) propyl trimethoxy silane to obtain a grafted artificial graphite film; And carrying out plasma treatment on the grafted artificial graphite film to obtain a pretreatment film, wherein the plasma treatment power is 3-20KW, the output voltage is 5-20KV, and the single-sided treatment time is 1-10S. Further, the step of carrying out laser drilling on the artificial graphite film to obtain a perforated artificial graphite film, wherein the diameter of the aperture is 0.1-1mm, the diameter of the aperture is smaller than or equal to the thickness of the finished graphite heat-conducting gasket, and the distance between the apertures is 1-30mm. Further, the step of grafting the surface of the bent artificial graphite film by 3- (2, 3-glycidoxy) propyl trimethoxy silane to obtain a grafted artificial graphite film comprises the following steps: Placing the bent artificial graphite film at 150-350 ℃ for 10-60min, taking out, and cooling to room temperature; mixing 1-5% of 3- (2, 3-glycidoxy) propyl trimethoxy silane and 95-99% of distilled water according to the mass ratio to obtain a treatment solution; and (3) placing the bent artificial graphite film in the treatment liquid, soaking for 30-360min at the soaking temperature of 15-100 ℃, and drying at the soaking temperature of 50-80 ℃. Further, the step of coating the epoxy modified polydimethylsiloxane resin on the surface of the pretreatment film and closing the pretreatment film with a preset layer number to obtain massive graphite comprises the following steps: uniformly coating the epoxy modified polydimethylsiloxane resin on the surface of the pretreatment film; Closing the die of the pretreatment film with the preset layer number, wherein the die closing pressure is 0.2-50Mpa, the die pressing temperature is 130-180 ℃, and the curing time is 30-300min, so that the blocky graphite is obtained; slicing the blocky graphite along the vertical direction of bending to obtain the graphite heat-conducting gasket to be shaped. Further, the step of post-treating the massive graphi