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CN-121975586-A - Solvent-free epoxy resin cleaning agent for prepreg production line and preparation method thereof

CN121975586ACN 121975586 ACN121975586 ACN 121975586ACN-121975586-A

Abstract

The invention discloses a solvent-free epoxy resin cleaning agent for a prepreg production line and a preparation method thereof, and relates to the technical field of cleaning agents. The invention firstly introduces hydroxyl on nano white carbon black by using a high-energy ball milling method, then adds 5-amino-2-hydroxybenzoic acid, grafts the 5-amino-2-hydroxybenzoic acid on the nano white carbon black by esterification reaction to prepare modified white carbon black, the grafted white carbon black can be uniformly and stably dispersed in a cleaning agent, then adds the modified white carbon black into the cleaning agent to prepare a solvent-free epoxy resin cleaning agent, the modified nano particles can more easily permeate into microscopic pores of an epoxy resin cured product, and the amino and phenolic hydroxyl on the surface can form strong hydrogen bond action with molecules of the epoxy resin cured product to effectively weaken and destroy interface binding force between a crosslinked network of epoxy resin and a base material, thereby improving the cleaning effect.

Inventors

  • WANG WENZHONG
  • YE XUEJUN
  • ZHANG JUAN
  • ZHAO WEIFENG

Assignees

  • 江苏睿泰飞宇科技有限公司

Dates

Publication Date
20260505
Application Date
20251210

Claims (10)

  1. 1. The solvent-free epoxy resin cleaning agent for the prepreg production line is characterized by comprising, by weight, 20-50% of a low-viscosity epoxy resin diluent, 1-5% of N, N-dimethylglycine, 5-10% of a cleaning auxiliary agent, 1-5% of a surfactant, 0.1-2% of a chelating agent, 0.5-2% of a corrosion inhibitor, 0.3-0.5% of an organosilicon defoaming agent and the balance of water; The cleaning auxiliary agent is modified white carbon black, and the modified white carbon black is prepared by introducing hydroxyl on the white carbon black by a high-energy ball milling method, and then adding 5-amino-2-hydroxybenzoic acid to graft the white carbon black through esterification reaction.
  2. 2. The solvent-free epoxy resin cleaning agent for a prepreg production line according to claim 1, wherein the low-viscosity epoxy resin diluent is one or more of alkylene glycidyl ether, ethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, 1, 4-butanediol diglycidyl ether and o-tolyl glycidyl ether.
  3. 3. The solvent-free epoxy resin cleaning agent for a prepreg production line according to claim 2, wherein the surfactant is one or more of sodium dodecyl benzene sulfonate, sodium dodecyl sulfate, sodium fatty acid methyl ester ethoxysulfonate, ammonium dodecyl bromide and ammonium dodecyl trimethyl bromide.
  4. 4. A solvent-free epoxy resin cleaning agent for a prepreg production line according to claim 3, wherein the chelating agent is ethylenediamine tetraacetic acid and the corrosion inhibitor is benzotriazole.
  5. 5. The preparation method of the solvent-free epoxy resin cleaning agent for the prepreg production line is characterized by comprising the following preparation steps: (1) Placing the gas-phase white carbon black and ethylene glycol in a high-energy ball mill, and performing high-energy ball milling for 0.5-12 h to obtain hydroxylated white carbon black; (2) Placing the hydroxylated white carbon black, 5-amino-2-hydroxybenzoic acid, dimethyl sulfoxide and p-toluenesulfonic acid in a high-energy ball mill, and performing high-energy ball milling for 4-12 hours to obtain modified white carbon black; (3) The solvent-free epoxy resin cleaning agent for the prepreg production line is prepared by mixing, by weight, 20-50% of a low-viscosity epoxy resin diluent, 1-5% of N, N-dimethylglycine, 5-10% of a cleaning auxiliary agent, 1-5% of a surfactant, 0.1-2% of a chelating agent, 0.5-2% of a corrosion inhibitor, 0.3-0.5% of an organosilicon defoamer and the balance of water, and stirring until the materials are uniformly mixed.
  6. 6. The method for preparing the solvent-free epoxy resin cleaning agent for the prepreg production line, which is characterized in that the mass ratio of the gas-phase white carbon black to the ethylene glycol in the step (1) is 1:4-6.
  7. 7. The method for preparing the solvent-free epoxy resin cleaning agent for the prepreg production line, which is characterized in that the high-energy ball milling rotating speed in the step (1) is 100-800 rpm, the ball-to-material ratio is 3:1, and the adopted grinding balls are zirconia microbeads.
  8. 8. The method for preparing the solvent-free epoxy resin cleaning agent for the prepreg production line, which is characterized in that the mass ratio of the hydroxylated white carbon black to the 5-amino-2-hydroxybenzoic acid to the dimethyl sulfoxide to the p-toluenesulfonic acid in the step (2) is 1:0.5-3:3-5:0.01-0.05.
  9. 9. The method for preparing the solvent-free epoxy resin cleaning agent for the prepreg production line, which is characterized in that the high-energy ball milling rotating speed in the step (2) is 500-700 rpm, the ball-to-material ratio is 10-20:1, and the adopted grinding balls are zirconia microbeads.
  10. 10. The method for preparing a solvent-free epoxy resin cleaner for a prepreg production line according to claim 5, wherein the ball milling in the step (2) is performed intermittently for 10 minutes every 30 minutes.

Description

Solvent-free epoxy resin cleaning agent for prepreg production line and preparation method thereof Technical Field The invention relates to the technical field of cleaning agents, in particular to a solvent-free epoxy resin cleaning agent for a prepreg production line and a preparation method thereof. Background The prepreg is a composite material of a uniform and regular prepreg formed by dipping reinforcing materials such as carbon fiber bundles, glass fiber materials and the like in certain resin, has good cohesiveness and flexibility, can be suitable for a layering forming process, can be directly used for manufacturing composite material products with complex structures, and is widely applied to equipment in the industries such as aerospace industry and the like, in particular to materials of aircrafts, wings, fuselages, important bullet shells and the like. The method for producing the prepreg mainly comprises a dry method and a wet method. In the wet-process production line of the prepreg, the epoxy resin dipping link is extremely easy to form intractable chemical residues on the surfaces of equipment such as a coating roller, a resin groove and the like. If these residues are not thoroughly cleaned in time, solidification and accumulation can occur, which directly affects product uniformity, damages equipment accuracy, and even causes production line shutdown. The cleaning agents commonly used at present are classified into solvent type cleaning agents, water-based cleaning agents, environment-friendly solvent cleaning agents and the like. Solvent type cleaning agents often use methylene dichloride, acetone, isopropanol and the like as organic cleaning agents to remove residual epoxy resin on the surface of equipment. However, these conventional cleaning methods have significant drawbacks. For example, solvents such as methylene chloride have extremely high volatility, and a large amount of volatile substances can be released into a working environment during the use process, which poses a serious threat to the health of operators. If water-based cleaning agent or environment-friendly solvent cleaning agent is adopted, the harm to the environment and human body is reduced to a certain extent, but the cleaning effect is unsatisfactory, the residual epoxy resin cannot be thoroughly removed, and the requirement of high-quality production is difficult to meet. Therefore, a solvent-free epoxy resin cleaning agent for prepregs, which can ensure the cleaning effect and has no volatile solvent, is developed. Disclosure of Invention The invention aims to provide a solvent-free epoxy resin cleaning agent for a prepreg production line and a preparation method thereof, so as to solve the problems in the prior art. In order to solve the technical problems, the invention provides a solvent-free epoxy resin cleaning agent for a prepreg production line, which is characterized by comprising, by weight, 20-50% of a low-viscosity epoxy resin diluent, 1-5% of N, N-dimethylglycine, 5-10% of a cleaning auxiliary agent, 1-5% of a surfactant, 0.1-2% of a chelating agent, 0.5-2% of a corrosion inhibitor, 0.3-0.5% of an organosilicon defoamer and the balance of water; The cleaning auxiliary agent is modified white carbon black, and the modified white carbon black is prepared by introducing hydroxyl on the white carbon black by a high-energy ball milling method, and then adding 5-amino-2-hydroxybenzoic acid to graft the white carbon black through esterification reaction. Further, the low-viscosity epoxy resin diluent is one or more of alkylene glycidyl ether, ethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, 1, 4-butanediol diglycidyl ether and o-tolyl glycidyl ether. Further, the surfactant is one or more of sodium dodecyl benzene sulfonate, sodium dodecyl sulfate, fatty acid methyl ester ethoxy sodium sulfonate, dodecyl ammonium bromide and dodecyl trimethyl ammonium bromide. Further, the chelating agent is ethylenediamine tetraacetic acid, and the corrosion inhibitor is benzotriazole. Further, the silicone defoamer is one of paint Yi Le DF-220, di high TEGO810 or Di high TEGO 805. Further, the preparation method of the solvent-free epoxy resin cleaning agent for the prepreg production line comprises the following preparation steps: (1) Placing the gas-phase white carbon black and ethylene glycol in a high-energy ball mill, and performing high-energy ball milling for 0.5-12 h to obtain hydroxylated white carbon black; (2) Placing the hydroxylated white carbon black, 5-amino-2-hydroxybenzoic acid, dimethyl sulfoxide and p-toluenesulfonic acid in a high-energy ball mill, and performing high-energy ball milling for 4-12 hours to obtain modified white carbon black; (3) The solvent-free epoxy resin cleaning agent for the prepreg production line is prepared by mixing, by weight, 20-50% of a low-viscosity epoxy resin diluent, 1-5% of N, N-dimethylglycine, 5-10% of a cleaning auxiliary agent, 1-5% of a surfac