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CN-121975591-A - Chip packaging cleaning agent and preparation method and application thereof

CN121975591ACN 121975591 ACN121975591 ACN 121975591ACN-121975591-A

Abstract

The invention relates to the technical field of chip cleaning, in particular to a chip packaging cleaning agent and a preparation method and application thereof, wherein the chip packaging cleaning agent comprises, by weight, 25-50% of a normal-temperature active solvent, 4-8% of a composite saponification agent, 18-32% of a normal-temperature foamless emulsifier, 3-7% of a pH regulator, 0.8-2% of a corrosion inhibitor, 0.5-2% of a functional dispersing agent and the balance of deionized water. The chip packaging cleaning agent prepared by the invention has excellent cleaning effect, is green and environment-friendly, and can avoid oxidation and corrosion of a substrate.

Inventors

  • FAN BAOAN
  • REN FAN
  • ZHANG SHENGLU

Assignees

  • 氟相新材料(常州)有限责任公司

Dates

Publication Date
20260505
Application Date
20260227

Claims (10)

  1. 1. The chip packaging cleaning agent is characterized by comprising, by weight, 25-50% of a normal-temperature active solvent, 4-8% of a composite saponification agent, 18-32% of a normal-temperature foamless emulsifier, 3-7% of a pH regulator, 0.8-2% of a corrosion inhibitor, 0.5-2% of a functional dispersing agent and the balance of deionized water.
  2. 2. The chip packaging cleaning agent according to claim 1, wherein the normal temperature active solvent is one or more of ethylene glycol monobutyl ether, ethylene glycol monomethyl ether, propylene glycol diethyl ether and propylene glycol methyl ether.
  3. 3. The chip packaging cleaning agent according to claim 1, wherein the compound saponification agent is a compound of sodium hydroxide and sodium bicarbonate, and the mass ratio of the compound saponification agent to the sodium hydroxide to the sodium bicarbonate is 1 (0.8-1.2).
  4. 4. The chip packaging cleaning agent according to claim 1, wherein the normal temperature type foamless emulsifier is a compound of isotridecyl alcohol polyoxyethylene ether and polyether modified silicone oil.
  5. 5. The chip packaging cleaning agent according to claim 1, wherein the corrosion inhibitor is one or more of benzotriazole, methylbenzotriazole, carboxybenzotriazole and hydroxybenzotriazole.
  6. 6. The chip package cleaning agent according to claim 1, wherein the preparation method of the functional dispersant comprises the following steps: A1, adding 1, 5-dimethyl-2-phenyl-4-amino-3-pyrazolone, acrylic acid, a catalyst and a polymerization inhibitor into toluene, heating to 110-120 ℃ for reaction for 4-8 hours, cooling to room temperature, washing, adding a desiccant for drying, filtering, and steaming to obtain a compound; a2, dissolving the compound obtained in the step A1 in isopropanol to obtain a mixed solution, adding the mixed solution into deionized water, heating to 75-80 ℃, dropwise adding an acrylic acid and an initiator aqueous solution, after 3-4h of dropwise adding, continuing to react for 3-4h, cooling to 30-45 ℃, adding a sodium hydroxide aqueous solution with the concentration of 25-35wt%, regulating the pH to 7-8, performing rotary evaporation, and drying at 55-65 ℃ to obtain the functional dispersing agent.
  7. 7. The die package cleaning agent according to claim 6, wherein the mass ratio of 1, 5-dimethyl-2-phenyl-4-amino-3-pyrazolone to acrylic acid in step A1 is 1 (0.36-0.4).
  8. 8. The cleaning agent for chip packages according to claim 6, wherein the mass ratio of the compound, isopropyl alcohol and acrylic acid in the step A2 is (0.08-0.12): 0.15-0.2): 1.
  9. 9. A method for preparing the chip packaging cleaning agent according to any one of claims 1-8, which is characterized by comprising the steps of adding deionized water into a reaction vessel, adding a pH regulator under stirring, stirring for 5-8min, slowly adding a compound saponification agent, stirring for 10-15min at a feeding rate of 1-2g/s, adding a normal-temperature active solvent at 23-27 ℃, stirring for 600-800r/min for 15-20min, reducing to 400-500r/min, sequentially adding a normal-temperature foamless emulsifier and a corrosion inhibitor, stirring for 8-12min, stirring for 20-25min, and filtering for later use.
  10. 10. The use of the chip packaging cleaning agent according to any one of claims 1 to 8 or the chip packaging cleaning agent obtained by the preparation method according to claim 9, characterized in that the use method of the chip packaging cleaning agent comprises the following steps: firstly, primarily flushing and draining the chip packaging piece by deionized water; Pouring a cleaning agent into a cleaning tank, immersing a chip, and cleaning for 10-15 minutes at room temperature under the ultrasonic conditions of 200-300W of power and 35-45kHz of frequency; Step C, rinsing with deionized water for 2-3 times, each time for 3-7min; And D, ventilating and drying at room temperature for 30-40 min.

Description

Chip packaging cleaning agent and preparation method and application thereof Technical Field The invention relates to the technical field of chip cleaning, in particular to a chip packaging cleaning agent and a preparation method and application thereof. Background In the existing chip packaging process, auxiliary materials such as solder paste, soldering flux and the like are required, and pollutants such as rosin residues, solder paste residues, soldering flux resin acids and the like are easy to generate. The current cleaning scheme is mainly divided into two types, namely a high-temperature cleaning agent (50-80 ℃) which relies on high temperature to improve the activity of a solvent to remove residues, but the high temperature is easy to cause deformation of a thermosensitive chip packaging colloid and lead bonding failure, and a product containing phosphorus and nitrogen auxiliary agents is easy to release harmful volatile matters at high temperature to pollute the environment, and a common normal-temperature cleaning agent which mostly adopts a single solvent to match with a conventional emulsifier, so that the problems of weak residual dissolution capacity of rosin (the cleaning rate is generally lower than 75%), insufficient protection of copper, tin and other metal substrates (easy oxidation, discoloration and quality loss) exist, and the cleaning requirement of the precise chip packaging is difficult to meet. In addition, both cleaning agents have the limitation of process suitability, high-temperature energy consumption and poor normal-temperature effect, and cannot meet the multiple requirements of high efficiency, environmental protection, substrate protection and low-temperature adaptation. In the prior art, patent CN112266832B discloses a semiconductor chip cleaning agent, a preparation method and application thereof, wherein the cleaning agent comprises a wetting stripping composition consisting of a wetting stripping agent and perfluoro-terminal polyoxyethylene ether, and can also comprise a penetrating agent, a solubilizer, a composite functional agent, a nitrogen-containing complexing agent, a polyalcohol amine compound and ultrapure water. However, perfluoro-terminated polyoxyethylene ether in the system is difficult to degrade, and the nitrogen-containing complexing agent and the polyalcohol amine compound can slightly corrode an aluminum layer, a metal welding spot and the like on the surface of the chip, so that the service life and the reliability of the chip are affected. The patent CN116496851B discloses a semiconductor chip cleaning agent and a preparation method thereof, wherein the cleaning agent comprises, by mass, 3-6% of a sulfonic acid type fluorine-containing surfactant, 6-10% of a nonionic surfactant, 0.2-1% of a complexing agent, 0-3% of ethanol, 3-8% of diethylene glycol monobutyl ether and the balance of deionized water. The cleaning agent can effectively remove tin paste, soldering flux residues and the like on a semiconductor chip, and the residues on the surface of the chip after cleaning are few, but the sulfonic acid type fluorine-containing surfactant has potential toxicity and is difficult to degrade. Therefore, there is a need in the market for a cleaning agent for chip packaging that is environmentally friendly and can avoid oxidation and corrosion of the substrate. Disclosure of Invention Aiming at the problems in the prior art, the invention aims to obtain the chip packaging cleaning agent which has excellent cleaning effect under the normal temperature condition, is green and environment-friendly and can avoid oxidation and corrosion of a substrate. In order to achieve the above purpose, the technical scheme adopted by the invention is as follows: The first aspect of the invention provides a chip packaging cleaning agent, which comprises, by weight, 25-50% of a normal-temperature active solvent, 4-8% of a composite saponification agent, 18-32% of a normal-temperature foamless emulsifier, 3-7% of a pH regulator, 0.8-2% of a corrosion inhibitor, 0.5-2% of a functional dispersing agent and the balance of deionized water. The chip packaging cleaning agent obtained by mixing the normal-temperature active solvent, the composite saponification agent, the normal-temperature foamless emulsifier, the pH regulator, the corrosion inhibitor, the functional dispersing agent and the deionized water has excellent stability, has excellent cleaning effect and the functions of avoiding oxidation and corrosion of a substrate, and is simple in preparation method and environment-friendly. Wherein, the normal temperature active solvent, the composite saponifier and the functional dispersant play a synergistic role, the abietic acid and the resin polymer can be rapidly dissolved without heating, and the corrosion inhibitor has a strong protection effect on copper and tin base materials. The cleaning agent prepared by the application does not need heating equipment when in use, the