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CN-121976072-A - Layered gradient copper-silver alloy composite material and preparation method and application thereof

CN121976072ACN 121976072 ACN121976072 ACN 121976072ACN-121976072-A

Abstract

The invention provides a layered gradient copper-silver alloy composite material and a preparation method and application thereof, wherein the preparation method comprises the following steps of mixing silver powder and copper powder according to different mass ratios to prepare AgCu alloy powder; sequentially filling silver powder, agCu alloy powder and copper powder into a die to obtain layered powder, forming the layered powder by adopting a cold isostatic pressing process to obtain a green body, performing pressure sintering on the green body under inert gas to obtain a sintered blank, and performing hot isostatic pressing treatment on the sintered blank to obtain the layered gradient copper-silver alloy composite material. According to the invention, through the design of descending gradient distribution of silver powder mass content from inside to outside, the overall strength of the layered gradient copper-silver alloy composite material is improved through the outer copper powder while the high conductivity of the inner layer is ensured, and then the layered gradient copper-silver alloy composite material is accurately matched with each process, so that the cooperative improvement of conductivity and mechanical property is realized, and meanwhile, the interface bonding strength is improved.

Inventors

  • CHU ZHUQI
  • DING JINPENG
  • ZHANG XIAYU
  • FANG FEI
  • WEI CHENLONG
  • LIU JUNSONG
  • WEI SHUCHENG
  • WANG HAO
  • WANG TENGYUE
  • WANG YANYU

Assignees

  • 安庆师范大学

Dates

Publication Date
20260505
Application Date
20260130

Claims (10)

  1. 1. The preparation method of the layered gradient copper-silver alloy composite material is characterized by comprising the following steps of: Mixing silver powder and copper powder according to different mass ratios to prepare AgCu alloy powder, sequentially filling the silver powder, the AgCu alloy powder and the copper powder into a die to obtain layered powder, wherein the layered powder comprises a silver powder layer, an AgCu alloy powder layer and a copper powder layer, and the mass of the silver powder in the AgCu alloy powder layer decreases along the direction away from the silver powder layer; s2, adopting a cold isostatic pressing process to mold the layered powder to obtain a green body, the pressure of the cold isostatic pressing is 60-80 MPa, the cold isostatic pressing time is 5 min-10 min; S3, carrying out pressure sintering on the green body under inert gas to obtain a sintered body, wherein the pressure sintering temperature is 800-1000 ℃, the pressure of the pressure sintering is 40-80 MPa, and the pressure of the inert gas is 0.1-0.3 MPa; And S4, carrying out hot isostatic pressing treatment on the sintered blank to obtain the layered gradient copper-silver alloy composite material, wherein the temperature of the hot isostatic pressing is 850-950 ℃, and the pressure of the hot isostatic pressing is 100-150 MPa.
  2. 2. The method for preparing the layered gradient copper-silver alloy composite material according to claim 1, wherein the purities of the silver powder and the copper powder are both equal to or more than 99.9%.
  3. 3. The method for preparing the layered gradient copper-silver alloy composite material according to claim 1, wherein the particle sizes of the silver powder and the copper powder are 10-45 μm.
  4. 4. The method for preparing the layered gradient copper-silver alloy composite material according to claim 1, wherein the mixing mode is mechanical mixing or ball milling mixing.
  5. 5. The preparation method of the layered gradient copper-silver alloy composite material is characterized by mixing silver powder and copper powder to obtain three AgCu alloy powders with different silver powder mass contents, wherein the mass ratio of the silver powder to the copper powder in the three AgCu alloy powders is 17-16:3-4, 6-5:5-4 and 3-2:8-7 respectively.
  6. 6. The method for preparing the layered gradient copper-silver alloy composite material according to claim 1, wherein the silver powder layer accounts for 20% -25% of the layered powder.
  7. 7. The preparation method of the layered gradient copper-silver alloy composite material according to claim 1, wherein the time of pressure sintering is 1-3 h.
  8. 8. The method for preparing the layered gradient copper-silver alloy composite material according to claim 1, wherein the time of hot isostatic pressing is 1-2 h.
  9. 9. A layered gradient copper-silver alloy composite material prepared by the method for preparing a layered gradient copper-silver alloy composite material according to any one of claims 1 to 8.
  10. 10. Use of a layered gradient copper-silver alloy composite material according to any one of claims 1 to 8 in high frequency electronics or aerospace wires or electrical connection parts.

Description

Layered gradient copper-silver alloy composite material and preparation method and application thereof Technical Field The invention belongs to the technical field of metal matrix composite materials, and particularly relates to a layered gradient copper-silver alloy composite material, and a preparation method and application thereof. Background In the field of modern electronic information and high-end equipment manufacturing, performance optimization of metal matrix composite materials is always a key driving force for technical development. Copper-silver alloy is widely used in the fields of high-frequency electronic devices, aerospace wires, high-reliability electrical connection parts and the like by virtue of excellent electrical conductivity, good thermal conductivity and machining performance. For example, in a signal transmission system of a 5G communication base station, a wire material needs to meet both low resistance loss and high mechanical strength, and in an aerospace device, an electrical connection part needs to have good and stable electrical conductivity. However, most of the traditional copper-silver alloy materials are of uniform components or simple layered composite structures, and the diversified requirements on the material performance under the complex working conditions are difficult to meet. On one hand, the copper-silver alloy with uniform components has the problem that the conductivity and the strength are difficult to be compatible, namely, the tensile strength and the processing plasticity of the material can be reduced while the conductivity can be enhanced by increasing the silver content, and on the other hand, the stress concentration is easy to occur at the interface joint part of the simple layered composite material due to the mutation of interlayer components, so that the defects of cracks, layering and the like are easy to occur at the interface under the thermal cycle or mechanical vibration environment, and the reliability and the service life of the material are seriously influenced. The existing preparation processes such as the traditional powder metallurgy method, the electrodeposition method and the hot rolling composite technology have obvious limitations. The copper-silver alloy prepared by the traditional powder metallurgy method requires high-temperature and high-pressure treatment to realize densification due to weak binding force among powder particles, but the high temperature is easy to cause uneven diffusion of metal silver and destroy a gradient structure, the electrodeposition method can realize accurate control of components, but has low production efficiency and high cost, the requirement of industrialized mass production is difficult to meet, and the hot rolling composite technology is difficult to form continuous and stable component gradient due to the deformation amount and the interfacial diffusion degree of materials. Therefore, developing a copper-silver alloy composite material which has excellent conductivity, high strength and good interface bonding performance and is suitable for industrial production and a preparation method thereof become a technical problem to be solved in the field of the current metal matrix composite material. Disclosure of Invention The invention aims to solve the technical problem of improving the conductivity, mechanical strength and interface bonding strength of the copper-silver alloy composite material. The invention solves the technical problems by the following technical means: The invention provides a preparation method of a layered gradient copper-silver alloy composite material, which comprises the following steps: Mixing silver powder and copper powder according to different mass ratios to prepare AgCu alloy powder, sequentially filling the silver powder, the AgCu alloy powder and the copper powder into a die to obtain layered powder, wherein the layered powder comprises a silver powder layer, an AgCu alloy powder layer and a copper powder layer, and the mass of the silver powder in the AgCu alloy powder layer decreases along the direction away from the silver powder layer; s2, adopting a cold isostatic pressing process to mold the layered powder to obtain a green body, the pressure of the cold isostatic pressing is 60-80 MPa, the cold isostatic pressing time is 5 min-10 min; S3, carrying out pressure sintering on the green body under inert gas to obtain a sintered body, wherein the pressure sintering temperature is 800-1000 ℃, the pressure of the pressure sintering is 40-80 MPa, and the pressure of the inert gas is 0.1-0.3 MPa; And S4, carrying out hot isostatic pressing treatment on the sintered blank to obtain the layered gradient copper-silver alloy composite material, wherein the temperature of the hot isostatic pressing is 850-950 ℃, and the pressure of the hot isostatic pressing is 100-150 MPa. The silver powder composite material has the beneficial effects that through the design of gradual