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CN-121976164-A - Multi-chamber semiconductor substrate coating device based on mechanical claw transfer

CN121976164ACN 121976164 ACN121976164 ACN 121976164ACN-121976164-A

Abstract

The invention discloses a multi-chamber semiconductor substrate coating device based on mechanical claw transfer, which belongs to the technical field of semiconductor manufacturing and comprises a machine body and a carrying plate, wherein a main electric push rod is fixedly arranged on the machine body, a discharging cavity is fixedly connected above the machine body, a pushing block pushes a strip-shaped groove wall to enable a disc to rotate, and the disc drives a fixing frame to rotate through a connecting rod, so that the orientation of a clamping claw is adjusted, the clamping claw sequentially approaches a plasma cleaning cavity, a coating cavity and a cooling post-treatment cavity, when the clamping claw carries the carrying plate to a target cavity, a sector block can be abutted against the inner side of the arc plate, the rotation limit of the disc is realized, the precise alignment is ensured, the sequential transfer work of the carrying plate in the plasma cleaning cavity, the coating cavity and the cooling post-treatment cavity is realized, the manual transfer operation is omitted, and the situation of pollution of semiconductor substrates caused by artificial contact or environmental interference in the traditional manual transfer process is avoided.

Inventors

  • ZHOU YANWEN
  • ZHANG JIPENG
  • LIU CHEN

Assignees

  • 武汉麦韦光学科技有限公司

Dates

Publication Date
20260505
Application Date
20260129

Claims (8)

  1. 1. The multi-chamber semiconductor substrate coating device based on mechanical claw transfer comprises a machine body (1) and a carrying plate (2) and is characterized in that a main electric push rod (3) is fixedly arranged on the machine body (1), a discharging cavity (4) is fixedly connected above the machine body (1), the main electric push rod (3) is arranged in the discharging cavity (4), a sealing door (5) is arranged on the discharging cavity (4), a working cavity (6) is fixedly connected above the discharging cavity (4), and a protective cover (7) is fixedly connected above the working cavity (6); A plurality of air pumps (8) are fixedly arranged on the outer side wall body of the working cavity (6), a plasma cleaning cavity (9), a coating cavity (10) and a cooling post-treatment cavity (11) are fixedly arranged in the working cavity (6) at equal intervals, a connecting rod (12) is rotatably connected above the working cavity (6) through a bearing, one end of the connecting rod (12) is fixedly connected with a disc (13), the other end of the connecting rod (12) is fixedly connected with a fixing frame (14), and a driving motor (15) is fixedly arranged on one side of the fixing frame (14); The driving motor (15) is connected with a threaded rod (16) at an output shaft, a movable block (17) is arranged on the threaded rod (16) in a penetrating and sliding manner, a threaded sleeve (18) is fixedly connected inside the movable block (17), a connecting arm (19) is fixedly connected below the movable block (17), an open slot (20) is formed in the connecting arm (19), limit rods (21) are fixedly connected to two sides of the connecting arm (19), and an auxiliary electric push rod (22) is fixedly arranged inside the connecting arm (19); The movable end of the auxiliary electric push rod (22) is fixedly connected with a push plate (23), two sides of the push plate (23) are rotationally connected with a hinge rod (24) through a pin shaft, one end of the hinge rod (24) is rotationally connected with a connecting block (25) through the pin shaft, a through hole (26) is formed in the connecting block (25), one side of the connecting block (25) is connected with a clamping claw (27), two positioning holes (28) are formed in the lower portion of the carrying plate (2), and grooves (29) are formed in two sides of the carrying plate (2); The novel multifunctional automatic feeding device is characterized in that a bottom plate (30) is fixedly connected below the carrying plate (2), a storage plate (31) is fixedly connected above the carrying plate (2), a screwing block (32) is rotationally connected between the bottom plate (30) and the storage plate (31), a screw (33) is fixedly connected to one side below the screwing block (32), hinge plates (34) are rotationally connected to two sides of the screwing block (32) through hinge pins, a slotted plate (35) is rotationally connected to one end of each hinge plate (34) through the hinge pins, and a connecting groove (36) is formed in each slotted plate (35); The connecting groove (36) is connected with a sliding block (37) in a sliding manner, a clamping block (38) is fixedly connected above the sliding block (37), a fixed block (39) is fixedly connected below the sliding block (37), a working motor (40) is fixedly installed above the protective cover (7), a fixed rod (41) is rotatably connected to one side of the protective cover (7) located on the working motor (40) through a bearing, and a connecting shaft (42) is connected to an output shaft of the working motor (40); The novel connecting device is characterized in that one end of the connecting shaft (42) is fixedly connected with the main gear (43), the fixed rod (41) is fixedly connected with the auxiliary gear (44), one end of the fixed rod (41) is fixedly connected with the fixed plate (45), the pushing block (46) is fixedly connected below the fixed plate (45), and one side of the fixed plate (45) is fixedly connected with the sector block (47).
  2. 2. The multi-chamber semiconductor substrate film plating device based on mechanical claw transfer according to claim 1, wherein a secondary electric push rod (48) is fixedly arranged in each of the plasma cleaning chamber (9), the film plating chamber (10) and the cooling post-treatment chamber (11), a sealing door (49) is fixedly connected to the movable end of the secondary electric push rod (48), object carrying discs (50) are fixedly connected to the ends of the primary electric push rod (3) and the secondary electric push rod (48), and two positioning blocks (51) are fixedly connected to the upper parts of the object carrying discs (50).
  3. 3. The multi-chamber semiconductor substrate film plating device based on mechanical gripper transferring as claimed in claim 2, wherein the sealing door (49) penetrates through the lower portion of the working chamber (6) and slides in the working chamber (6), a sealing strip (52) is fixedly connected to the sealing door (49), sealing grooves (53) are formed in the walls of the plasma cleaning chamber (9), the film plating chamber (10) and the cooling post-treatment chamber (11), the sealing strip (52) is in sliding fit with the sealing grooves (53), connecting pipes (54) are connected to the plasma cleaning chamber (9), the film plating chamber (10) and the cooling post-treatment chamber (11) in a communicating mode, and one end of each connecting pipe (54) penetrates through the working chamber (6) and is connected with the air pump (8).
  4. 4. The multi-chamber semiconductor substrate film plating device based on mechanical claw transfer according to claim 2, wherein two positioning holes (28) below the carrying plate (2) are distributed in a diagonal manner, the positioning blocks (51) are in plug-in fit with the positioning holes (28), a plurality of guide grooves (55) are formed in the carrying plate (31), a plurality of limit grooves (56) are formed in the bottom plate (30), the guide grooves (55) and the limit grooves (56) are distributed in a central symmetry manner, and the sliding blocks (37) and the fixing blocks (39) slide in the guide grooves (55) and the limit grooves (56) respectively.
  5. 5. The multi-chamber semiconductor substrate film plating device based on mechanical claw transfer according to claim 1, wherein an arc-shaped groove (57) is formed in the bottom plate (30), the screw rod (33) slides in the arc-shaped groove (57) and is in threaded connection with a threaded cap (58), the grooved plate (35) slides between the bottom plate (30) and the object placing plate (31), two sides of the grooved plate (35) are in contact with the wall body of the bottom plate (30), the upper part of the fixed block (39) is in contact with the grooved plate (35), the lower part of the clamping block (38) is in contact with the object placing plate (31), and a silica gel sleeve (59) is bonded and connected on the clamping block (38).
  6. 6. The multi-chamber semiconductor substrate coating device based on mechanical gripper transferring as set forth in claim 1, wherein the connecting block (25) is slidably connected with the limiting rod (21) through a through hole (26), the pushing plate (23) slides in the open groove (20) and contacts with the groove wall, and the gripper jaw (27) is embedded with the groove (29).
  7. 7. The multi-chamber semiconductor substrate film plating device based on mechanical claw transfer according to claim 1, wherein a guide rod (60) is fixedly connected to the fixed frame (14), a connecting hole (61) is formed in the movable block (17), the guide rod (60) penetrates through the connecting hole (61) to be in sliding fit with the movable block (17), the threaded rod (16) is in threaded fit with the threaded sleeve (18), the threaded rod (16) is rotatably connected with the fixed frame (14) through a bearing, telescopic covers (62) are sleeved at two ends of the threaded rod (16), one end of each telescopic cover (62) is fixedly connected with the fixed frame (14), and the other end of each telescopic cover (62) is fixedly connected with the movable block (17).
  8. 8. The multi-chamber semiconductor substrate film plating device based on mechanical claw transfer according to claim 1, wherein the main gear (43) and the auxiliary gear (44) are meshed with each other and are arranged in the protective cover (7), three strip-shaped grooves (63) are formed in the disc (13), three arc-shaped plates (64) are fixedly connected to the disc (13), the pushing block (46) is in sliding fit with the strip-shaped grooves (63), and the inner sides of the arc-shaped plates (64) are in fit contact with the sector-shaped blocks (47).

Description

Multi-chamber semiconductor substrate coating device based on mechanical claw transfer Technical Field The invention relates to the technical field of semiconductor manufacturing, in particular to a multi-chamber semiconductor substrate coating device based on mechanical claw transfer. Background The semiconductor substrate is a core base material of products such as semiconductor devices, integrated circuits, photovoltaic cells and the like, refers to a base material with semiconductor characteristics, the electrical property of the base material can be regulated and controlled by doping, temperature, illumination and other conditions, the base stone for supporting the development of microelectronics and photoelectronics industry, the semiconductor substrate coating is a key step in the semiconductor manufacturing process, refers to a technology of depositing one or more layers of thin film materials on the surface of the semiconductor substrate by a physical or chemical method, and the coated thin film can realize the functions of electrical isolation, conductive path construction, optical property regulation, mechanical protection and the like and directly influences the performance, reliability and integration degree of the semiconductor devices. The tradition is when carrying out the coating film to the substrate, need artifical substrate transportation link, need the manual transport of operating personnel to the coating film station with the substrate from the pretreatment station, transfer to follow-up other stations from the coating film station again, and in artifical transportation process, operating personnel's hand direct or indirect contact substrate, easily be infected with impurity such as skin secretion, dust to the substrate surface, simultaneously, the substrate exposes in open environment in the artifical transportation process, impurity such as floating dust in the environment, steam also easily adheres to the substrate surface, lead to the semiconductor substrate to receive the pollution, influence follow-up coating film quality and substrate performance. Based on the above, the invention designs a multi-chamber semiconductor substrate coating device based on mechanical claw transfer, so as to solve the problems. Disclosure of Invention The invention aims to provide a multi-chamber semiconductor substrate coating device based on mechanical claw transfer, which solves the problem that the substrate is easy to be polluted in the transfer process when the substrate is moved from other stations to a coating cavity of a coating station for coating in the prior art. In order to achieve the above purpose, the present invention provides the following technical solutions: The multi-chamber semiconductor substrate coating device based on mechanical claw transfer comprises a machine body and a carrying plate, wherein a main electric push rod is fixedly arranged on the machine body, a discharging cavity is fixedly connected above the machine body, the main electric push rod is arranged in the discharging cavity, a sealing door is arranged on the discharging cavity, a working cavity is fixedly connected above the discharging cavity, and a protective cover is fixedly connected above the working cavity; The device comprises a working cavity, a plurality of air pumps, a plasma cleaning cavity, a coating cavity and a cooling post-treatment cavity, wherein the air pumps are fixedly arranged on the outer side wall body of the working cavity; The driving motor is characterized in that the output shaft of the driving motor is connected with a threaded rod, a movable block is arranged on the threaded rod in a penetrating and sliding manner, a threaded sleeve is fixedly connected inside the movable block, a connecting arm is fixedly connected below the movable block, an opening groove is formed in the connecting arm, limit rods are fixedly connected to two sides of the connecting arm, and an auxiliary electric push rod is fixedly arranged inside the connecting arm; the movable end of the auxiliary electric push rod is fixedly connected with a push plate, two sides of the push plate are rotationally connected with a hinge rod through a pin shaft, one end of the hinge rod is rotationally connected with a connecting block through the pin shaft, a through hole is formed in the connecting block, one side of the connecting block is connected with a clamping claw, two positioning holes are formed in the lower portion of the carrying plate, and grooves are formed in two sides of the carrying plate; The device comprises a carrying plate, a base plate, a screwing block, a screw rod, hinge plates, a slotted plate and a connecting groove, wherein the base plate is fixedly connected below the carrying plate, the carrying plate is fixedly connected above the carrying plate, the screwing block is rotationally connected between the base plate and the carrying plate, the screw rod is fixedly connected to one side below the s