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CN-121976263-A - Monitoring method and device for temperature control process of phase-change copper foil deposition equipment

CN121976263ACN 121976263 ACN121976263 ACN 121976263ACN-121976263-A

Abstract

The application provides a monitoring method and a device for a temperature control process of phase-change copper foil deposition equipment, which comprise the steps of obtaining electrolyte temperature, copper foil surface temperature and heat flux density penetrating through an inactivated product layer, identifying temperature difference change between the electrolyte temperature and the copper foil surface temperature, extracting offset of a temperature difference ratio along with time, performing temperature interval matching on a transition time node time stamp and a phase-change interval reference, determining a starting point of an inactivated product layer entering a buffer layer function, generating a dynamically adjusted temperature control target value, predicting the change trend of the follow-up heat flux density according to the dynamically adjusted temperature control target value, generating a feedback signal, transmitting the feedback signal to deposition equipment control, and realizing real-time compensation on product accumulation influence.

Inventors

  • LI XIANYANG

Assignees

  • 江西铜博科技股份有限公司
  • 深圳晨怡科技有限公司

Dates

Publication Date
20260505
Application Date
20251229

Claims (10)

  1. 1. The method for monitoring the temperature control process of the phase-change copper foil deposition equipment is characterized by comprising the following steps of: Acquiring the temperature of an electrolyte, the surface temperature of a copper foil and the heat flux density passing through an inactivated product layer to form an initial data set; Identifying the temperature difference change between the electrolyte temperature and the copper foil surface temperature according to the initial data set, and extracting the offset of the temperature difference ratio along with time; grouping the offset of the temperature difference ratio along with time according to the thermal resistance change characteristic, distinguishing a thermal resistance increasing stage from a thermal capacity increasing stage, and identifying a transition time node of an inactivated product layer from obstructing heat transfer to a buffer layer; Analyzing response delay time of the thermal resistance increasing stage, identifying inflection points with change rates from increasing to decreasing, extracting corresponding transition time node time stamps, and switching a monitoring reference from electrolyte temperature to copper foil surface temperature; and performing temperature interval matching on the transition time node timestamp and a preset phase change interval reference, determining a starting point of the inactivated product layer entering the buffer layer function, and generating a dynamically adjusted temperature control target value.
  2. 2. The method of monitoring a temperature control process of a phase change copper foil deposition apparatus according to claim 1, wherein the obtaining of the electrolyte temperature, the copper foil surface temperature, and the heat flux density through the deactivated product layer forms an initial data set comprising: a heat flow probe is arranged in the middle of the deposition tank body, the heat flow probe is vertically aligned with the surface of the cathode, and heat flow data passing through the deactivated product layer is collected to form a heat flow density collection result; arranging a temperature sensor at an inlet of an electrolyte circulation pipeline to obtain an electrolyte temperature sequence; Scanning and measuring the temperature of the surface of the copper foil to obtain a copper foil surface temperature sequence; and integrating the heat flux density acquisition result, the electrolyte temperature sequence and the copper foil surface temperature sequence to form an initial data set.
  3. 3. The method for monitoring the temperature control process of the phase-change copper foil deposition apparatus according to claim 1, wherein the step of identifying the temperature difference change between the electrolyte temperature and the copper foil surface temperature from the initial data set, and extracting the offset of the temperature difference ratio with time comprises: Extracting an electrolyte temperature sequence and a copper foil surface temperature sequence from the initial data set, calculating the difference value of the electrolyte temperature sequence and the copper foil surface temperature sequence at each sampling moment to form a temperature difference time sequence, and smoothing the temperature difference sequence by adopting a moving average method to obtain a smooth temperature difference curve; dividing the temperature difference value at each moment in the smooth temperature difference curve by the heat flow density acquisition result at the corresponding moment to obtain a ratio sequence of the temperature difference and the heat flow density, and performing linear fitting on the ratio sequence by a least square method to obtain a slope value and an intercept value of a fitting straight line; And constructing a ratio datum line according to the slope value and the intercept value, calculating the vertical distance between each point in the actual ratio sequence and the datum line as deviation, marking as offset points if the deviation exceeds a preset threshold value, and accumulating the offset values of the offset points in time sequence to obtain the offset of the temperature difference ratio along with time.
  4. 4. The method for monitoring the temperature control process of the phase-change copper foil deposition equipment according to claim 1, wherein the grouping processing is performed on the offset of the temperature difference ratio with time according to the thermal resistance change characteristic, the thermal resistance increasing phase and the thermal capacity increasing phase are distinguished, and the transition time node of the deactivated product layer from the heat transfer inhibition to the buffer layer is identified, comprising: The method comprises the steps of carrying out equal time interval segmentation on a sequence of offset values of temperature difference ratio along with time, calculating average growth rate of the offset values in each segment, and distinguishing a thermal resistance increasing stage from a heat capacity increasing stage according to the average growth rate of the offset values in each segment to form a stage marking sequence; Identifying boundary positions of transition from a thermal resistance increasing stage to a thermal capacity increasing stage from the stage marking sequence, extracting offset data in each preset length interval before and after the boundary positions, and determining a preliminary transition point; And verifying the preliminary transition point, obtaining the standard deviation of the heat flow density in a time window before and after the transition point, extracting the second derivative of the temperature difference ratio in the corresponding period, and if the standard deviation after the transition point is smaller than that before the transition point and the second derivative is changed from positive to negative, confirming that the point is a transition time node of the deactivated product layer from the heat transfer inhibition to the buffer layer.
  5. 5. The method for monitoring the temperature control process of the phase-change copper foil deposition equipment according to claim 4, wherein the analyzing the response delay time of the thermal resistance increasing stage comprises extracting data of each sampling time from a sequence of offsets of the temperature difference ratio of the thermal resistance increasing stage along with time, calculating a change rate value between adjacent times, and calculating a time interval from a start point to a rate start decreasing point of the thermal resistance increasing stage when a continuously preset number of rate values show decreasing trend, so as to obtain the response delay time.
  6. 6. The method for monitoring the temperature control process of the phase-change copper foil deposition equipment according to claim 5, wherein the step of identifying the inflection point of the change rate from the increase to the decrease, extracting the corresponding transition time node time stamp, and switching the monitoring reference from the electrolyte temperature to the copper foil surface temperature comprises the steps of: Performing differential operation on the change rate of the sequence of the offset of the temperature difference ratio along with time, identifying the turning point position of the speed value from increasing to decreasing by comparing the magnitude relation of adjacent speed values, extracting the time stamp information corresponding to the turning point, verifying the effectiveness of the turning point according to the response delay time length, and determining the time stamp of the transition time node; And switching the data source of temperature monitoring from the electrolyte temperature sensor to the copper foil surface temperature sensor at the moment by using the transition time node timestamp as a switching trigger signal, and establishing a new monitoring reference sequence based on the copper foil surface temperature.
  7. 7. The method for monitoring the temperature control process of the phase-change copper foil deposition equipment according to claim 1, wherein the step of performing temperature interval matching between the transition time node time stamp and a preset phase-change interval reference, determining a starting point of an inactive product layer entering a buffer layer function, and generating a dynamically adjusted temperature control target value comprises the steps of: Acquiring a copper foil surface temperature value at a moment corresponding to the transition time node timestamp, comparing the temperature value with the phase change interval reference, and marking the moment as a starting point of the function of entering the inactivated product layer into the buffer layer if the temperature value falls between the upper limit and the lower limit of the phase change interval; calculating the difference between the surface temperature value of the copper foil at the starting point and the lower limit of the phase change section, dividing the difference by the total width of the phase change section to obtain a temperature relative position coefficient, multiplying the original temperature control target value by the temperature relative position coefficient, and adding the offset to generate a dynamically adjusted temperature control target value.
  8. 8. The method for monitoring the temperature control process of the phase-change copper foil deposition equipment according to claim 1, wherein the method further comprises predicting the variation trend of the follow-up heat flux density according to the dynamically adjusted temperature control target value, generating a feedback signal, and transmitting the feedback signal to the deposition equipment to realize real-time compensation of the influence of product accumulation.
  9. 9. The method for monitoring the temperature control process of the phase-change copper foil deposition equipment according to claim 8, wherein the predicting the variation trend of the subsequent heat flux density according to the dynamically adjusted temperature control target value generates a feedback signal to be transmitted to the deposition equipment control, and realizes real-time compensation of the product accumulation influence, and the method comprises the following steps: Calculating a heat flux density predicted value at each moment in a preset time period in the future by adopting a time sequence prediction method based on the dynamically adjusted temperature control target value and the historical heat flux density data to form a predicted heat flux density sequence; acquiring an actual heat flux density acquisition result at a moment corresponding to the predicted heat flux density sequence, calculating a difference value between the predicted value and the actual value point by point, calculating a root mean square error as a deviation value for the difference value sequence, judging that the temperature conduction is in a stable state if the deviation value is smaller than a preset stability threshold value, and judging that the temperature conduction is in an unstable state if the deviation value is larger than the stability threshold value; and generating a digital feedback signal containing specific regulation parameters according to the temperature conduction state, and transmitting the digital feedback signal to a deposition equipment control module.
  10. 10. A monitoring device for a temperature control process of a phase change copper foil deposition apparatus, the device comprising: the data acquisition module is used for acquiring the temperature of the electrolyte, the surface temperature of the copper foil and the heat flux density penetrating through the deactivated product layer to form an initial data set; the temperature difference offset extraction module is used for identifying the temperature difference change between the electrolyte temperature and the surface temperature of the copper foil according to the initial temperature acquisition result and extracting the offset of the temperature difference ratio along with time; the thermal resistance change grouping and transition identification module is used for grouping the offset of the temperature difference ratio along with time according to the thermal resistance change characteristics, distinguishing a thermal resistance increasing stage and a thermal capacity increasing stage, and identifying a transition time node of an inactivation product layer from obstructing heat transfer to a buffer layer; the monitoring reference switching module is used for analyzing the response delay time of the thermal resistance increasing stage, identifying inflection points of which the change rate is changed from increasing to decreasing, extracting corresponding transition time node time stamps, and switching the monitoring reference from the electrolyte temperature to the copper foil surface temperature; And the temperature interval matching and target value generating module is used for performing temperature interval matching on the transition time node timestamp and a preset phase change interval reference, determining the starting point of the inactivated product layer entering the buffer layer function, and generating a dynamically adjusted temperature control target value.

Description

Monitoring method and device for temperature control process of phase-change copper foil deposition equipment Technical Field The invention relates to the technical field of information, in particular to a method and a device for monitoring a temperature control process of phase-change copper foil deposition equipment. Background In the field of industrial production, temperature control of copper foil deposition equipment is an important link for ensuring product quality and production efficiency. The process directly affects the grain structure and performance of the material, and has key significance for manufacturing high-end electronic components. The accurate regulation and control of the temperature is not only a foundation of stable process, but also a core guarantee for avoiding production defects and improving the consistency of products. However, some existing temperature control methods tend to be difficult to adapt to dynamically changing process conditions in the face of complex production environments. Particularly, during the deposition process, the material state and heat transfer characteristics inside the equipment can change significantly with time, but the traditional control mode mostly neglects the deep influence of the changes on the temperature response, so that the accuracy of monitoring and adjustment is insufficient, and the process stability is further influenced. Focusing on specific technical difficulties, the effect of the deactivated product layer formed on the cathode surface during deposition on heat transfer becomes a central problem. The deactivated product layer refers to a layer of byproducts that gradually builds up on the cathode surface, which may both hinder heat transfer and alter the manner in which heat is stored and distributed under certain conditions. The characteristics of this layered structure are not constant, and when the inside of it forms a porous structure and is wetted by the liquid, the heat transfer mode is changed from simple obstruction to a cushioning effect. This dual nature leads to a significant increase in the difficulty of temperature control, as it is not possible to accurately determine whether the deactivated product layer is blocking heat or stabilizing temperature at a certain time, thereby affecting control of the critical temperature interval. Taking an actual production scene as an example, in the copper foil deposition process, the initial stage of an inactivated product layer may cause slow temperature response of the cathode surface, so that an operator is difficult to quickly sense temperature change, and when the layer structure is changed, temperature fluctuation may be excessively smoothed instead, so that real process abnormality is covered. This inconsistent behavior makes the reference for temperature monitoring difficult to determine, and the adjustment of process parameters is therefore lost. Therefore, how to dynamically identify the heat transfer characteristic variation of the deactivated product layer during the deposition process and adjust the temperature monitoring and control strategy accordingly becomes a key issue for ensuring stable grain performance in the copper foil production. Disclosure of Invention The invention provides a method for monitoring a temperature control process of phase-change copper foil deposition equipment, which mainly comprises the following steps: Acquiring the temperature of an electrolyte, the surface temperature of a copper foil and the heat flux density passing through an inactivated product layer to form an initial data set; identifying the temperature difference change between the electrolyte temperature and the copper foil surface temperature according to the initial temperature acquisition result, and extracting the offset of the temperature difference ratio along with time; grouping the offset of the temperature difference ratio along with time according to the thermal resistance change characteristic, distinguishing a thermal resistance increasing stage from a thermal capacity increasing stage, and identifying a transition time node of an inactivated product layer from obstructing heat transfer to a buffer layer; Analyzing response delay time of the thermal resistance increasing stage, identifying inflection points with change rates from increasing to decreasing, extracting corresponding transition time node time stamps, and switching a monitoring reference from electrolyte temperature to copper foil surface temperature; and performing temperature interval matching on the transition time node timestamp and a preset phase change interval reference, determining a starting point of the inactivated product layer entering the buffer layer function, and generating a dynamically adjusted temperature control target value. Further, the obtaining the electrolyte temperature, the copper foil surface temperature, and the heat flux density through the deactivated product layer to form an