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CN-121977074-A - Ventilated magnetic fluid sealing transmission device for semiconductor

CN121977074ACN 121977074 ACN121977074 ACN 121977074ACN-121977074-A

Abstract

The invention discloses a ventilation type magnetic fluid seal transmission device for a semiconductor, which comprises a main shaft and a shell, wherein a magnetic fluid seal structure is formed between the main shaft and the shell through a magnetic fluid seal assembly, a gas circulation seal assembly is arranged on the main shaft at the middle position of the magnetic fluid seal assembly, an air inlet buffer labyrinth structure is arranged between the gas circulation seal assembly and the magnetic fluid seal assembly, and a buffer air inlet channel is arranged among the shell, the gas circulation seal assembly and the main shaft. According to the transmission device, the gas circulation sealing assembly is additionally arranged between the main shaft and the shell, the buffer air inlet channel is arranged between the gas circulation sealing assembly and the shell as well as between the main shaft, and the air inlet buffer labyrinth structure is arranged between the gas circulation sealing assembly and the magnetic fluid sealing assembly, so that the buffer of gas in the process of introducing high-pressure gas is realized, the magnetic fluid is prevented from being flushed into the vacuum cavity by the high-pressure gas, the sealing performance of the magnetic fluid sealing transmission device is not influenced, the magnetic fluid is not lost to pollute the semiconductor in the vacuum cavity, and the quality of the semiconductor is not influenced. It is proved that the sealing performance and the effective ventilation function are good.

Inventors

  • CHEN JUN
  • XIE RUYING
  • WU FANGYI

Assignees

  • 杭州大和热磁电子有限公司

Dates

Publication Date
20260505
Application Date
20251125

Claims (10)

  1. 1. The ventilation type magnetic fluid sealing transmission device for the semiconductor comprises a main shaft (1) and a shell (2), wherein a magnetic fluid sealing structure is formed between the main shaft (1) and the shell (2) through a magnetic fluid sealing assembly (3), and the ventilation type magnetic fluid sealing transmission device is characterized in that a gas circulation sealing assembly (4) is arranged on the main shaft (1) at the middle position of the magnetic fluid sealing assembly (3), an air inlet buffer labyrinth structure (9) is arranged between the gas circulation sealing assembly (4) and the magnetic fluid sealing assembly (3), and a buffer air inlet channel is arranged among the shell (2), the gas circulation sealing assembly (4) and the main shaft (1).
  2. 2. The device of claim 1, wherein the buffer air inlet channel comprises a multi-stage buffer air inlet hole (212) arranged on the shell (2), a gas circulation air inlet buffer hole (40) arranged on the gas circulation sealing assembly (4) and a main shaft air inlet hole (16) arranged on the main shaft (1).
  3. 3. The ventilation type magnetic fluid seal transmission device for the semiconductor is characterized in that the gas circulation seal assembly (4) comprises an air inlet support ring (5) and an air inlet buffer ring (6), static sealing is achieved between the air inlet buffer ring (6) and a main shaft (1) through a main shaft seal piece (18) arranged on the main shaft (1), the air inlet buffer ring (6) rotates along with the main shaft (1), and an axial positioning structure is formed between the air inlet support ring (5) and the magnetic fluid seal assembly (3).
  4. 4. The ventilation type magnetic fluid seal transmission device for the semiconductor is characterized in that the air inlet buffer labyrinth structure (9) is formed between the air inlet buffer ring (6) and the magnetic fluid seal assembly (3) and between the air inlet buffer ring (5).
  5. 5. A semiconductor-use ventilating magnetic fluid seal transmission device according to claim 3, wherein the air circulation intake buffer hole (40) comprises a support ring buffer intake structure (50) provided on the intake support ring (5) and an intake buffer stepped intake structure (60) provided on the intake buffer ring (6).
  6. 6. A vented magnetic fluid seal transmission for a semiconductor as defined in claim 5, wherein the support ring buffer inlet structure (50) comprises a buffer inlet ring groove (53) arranged on an outer ring surface of the inlet support ring and a plurality of inclined buffer inlet holes (54) arranged in the buffer inlet ring groove (53), or the support ring buffer inlet structure (50) comprises a buffer inlet ring groove (53) and a plurality of stepped buffer inlet holes (55) arranged in the buffer inlet ring groove (53).
  7. 7. A ventilation type magnetic fluid seal transmission device for a semiconductor as claimed in claim 5, wherein the air intake buffer step air intake structure (60) comprises a buffer labyrinth air intake groove (63) arranged on the outer circumference of an air intake buffer ring, a buffer radial air intake hole (64) arranged in the buffer labyrinth air intake groove and a buffer communication air intake inner groove (65) arranged on the inner wall of the air intake buffer ring, or the air intake buffer step air intake structure (60) comprises a buffer labyrinth air intake groove (63) arranged on the outer circumference of the air intake buffer ring, a buffer radial inclined air intake hole (66) arranged in the buffer labyrinth air intake groove and a buffer communication air intake inner groove (65) arranged on the inner wall of the air intake buffer ring.
  8. 8. The device of claim 2, wherein the housing multi-stage buffer intake (212) comprises a plurality of housing intake holes having diameters decreasing in order and arranged in a stepwise manner from the housing wall to the inner wall.
  9. 9. A ventilated magnetohydrodynamic sealed transmission device for semiconductors according to claim 2, wherein said spindle inlet (16) comprises a spindle radial inlet (161) and a spindle axial inlet (162) which are in communication.
  10. 10. The ventilation type magnetic fluid seal transmission device for the semiconductor according to any one of claims 1 to 9, wherein transmission is realized between the main shaft (1) and the shell (2) through a transmission bearing (10), the magnetic fluid seal assembly (3) comprises a magnetic pole (7), a magnetic block (8) and magnetic liquid, magnetic seal is formed between the magnetic liquid and the main shaft, and static seal is realized between the magnetic fluid seal assembly (3) and the shell (2) through a magnetic pole seal piece (74).

Description

Ventilated magnetic fluid sealing transmission device for semiconductor Technical Field The invention relates to the technical field of magnetic fluid sealing transmission devices, in particular to a ventilation magnetic fluid sealing transmission device for a semiconductor. Background In the semiconductor process manufacturing process, according to production requirements, process gas with certain pressure, such as protective gas helium, nitrogen and the like, is required to be introduced into the vacuum cavity, and as the vacuum cavity is required to ensure high vacuum degree and certain process gas is required to be introduced, the conventional operation at present is that an air inlet is arranged on a shell of a magnetic fluid sealing transmission device, an air inlet channel is arranged on a main shaft of the transmission device, and after the magnetic fluid transmission device is connected with the vacuum cavity, the process gas enters the shell through the air inlet on the shell and enters the vacuum cavity through the air inlet channel on the main shaft and then participates in the semiconductor process manufacturing. Because the magnetic fluid sealing transmission device mainly comprises a shell, a main shaft, a magnetic block, a magnetic pole and other parts. The shell is arranged on the vacuum cavity, the sealing between the shell and the vacuum cavity is realized through a sealing surface on the shell, the static sealing between the shell and the magnetic pole is realized through an O-shaped ring between the magnetic pole and the shell, and the sealing between the main shaft and the magnetic pole is realized through magnetic liquid on a tooth-shaped part on the main shaft. When the process gas enters the magnetic fluid from the shell, the process gas directly passes through the air inlet and enters the air inlet channel on the main shaft, and because the pressure of the external process gas is generally 0.3-0.5MPa, when the process gas enters the magnetic fluid sealing transmission device, a large impact force is generated on the magnetic fluid between the magnetic pole and the main shaft, the impact gas can wash away the magnetic fluid between the magnetic pole and the main shaft, so that the magnetic fluid cannot realize effective sealing, the magnetic fluid sealing device is invalid, and meanwhile, the impacted magnetic fluid can be flushed into the air inlet channel on the main shaft, and then is brought into the reaction vacuum cavity by the process gas, thereby bringing pollution risks to the semiconductor process. In the prior art, although a technical scheme related to a channel arranged inside a magnetic fluid seal transmission device is disclosed in, for example, chinese patent document CN211039684U, which discloses a magnetic fluid seal transmission device with a vacuumizing channel, the technical scheme is not suitable for introducing high-pressure process gas into a vacuum chamber through the magnetic fluid seal transmission device. Therefore, it is necessary to design a ventilation type magnetic fluid sealing transmission device for a semiconductor, which can solve the problem that the magnetic fluid sealing transmission device cannot form effective sealing due to the fact that the magnetic fluid can not form effective sealing due to the fact that the magnetic fluid between the main shaft and the magnetic pole is reduced because the magnetic fluid between the magnetic pole and the main shaft is flushed away by the process gas when the process gas is introduced into the magnetic fluid sealing transmission device. The magnetic liquid can be brought into the vacuum cavity by the process gas, which affects the semiconductor process. Disclosure of Invention The invention aims to solve the problems that in the prior art, in the process of introducing process gas, the process gas can impact magnetic liquid between a magnetic pole and a main shaft, the magnetic liquid between the magnetic pole and the main shaft is washed away, so that the magnetic liquid between the main shaft and the magnetic pole is reduced, the magnetic liquid cannot form effective seal, the magnetic fluid sealing device is invalid in seal, the magnetic liquid can be brought into a vacuum cavity by the process gas, the semiconductor process is influenced, and the like, and the ventilation type magnetic fluid sealing transmission device for the semiconductor is suitable for introducing high-pressure process gas into the vacuum cavity, does not influence the sealing performance of the magnetic fluid sealing transmission device, and also does not cause the magnetic liquid to run away into the vacuum cavity to pollute the semiconductor and influence the quality of the semiconductor. The invention discloses a ventilation type magnetic fluid sealing transmission device for a semiconductor, which comprises a main shaft and a shell, wherein a magnetic fluid sealing structure is formed between the main shaft and the shell throu