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CN-121977191-A - High-light-efficiency LED lighting device and manufacturing method thereof

CN121977191ACN 121977191 ACN121977191 ACN 121977191ACN-121977191-A

Abstract

The application discloses a high-light-efficiency LED lighting device and a manufacturing method thereof, and relates to the technical field of lighting, the high-light-efficiency LED lighting device comprises a shell, wherein a heat dissipation module for avoiding acceleration of light attenuation is arranged in the shell, the heat dissipation module comprises a ceramic heat dissipation plate and an aluminum substrate which are arranged in the shell, and the heat dissipation surface of the ceramic heat dissipation plate is provided with concave-convex textures; the application forms a low thermal resistance heat conduction path between the aluminum substrate and the ceramic heat dissipation plate through a welding layer, strengthens convection heat exchange by utilizing concave-convex textures on the surface of the ceramic heat dissipation plate to delay light attenuation, and independently adjusts driving current through a power management system to realize fine reconstruction of spectrum, wherein the anti-dazzle component realizes glare inhibition under low light loss through micro-structure textures of a lens light-emitting surface and light diffusion particles filled in a central area.

Inventors

  • LIU ZHONGQIANG
  • SHI GUANG

Assignees

  • 上海朗锐管道工程有限公司

Dates

Publication Date
20260505
Application Date
20260401

Claims (10)

  1. 1. The high-light-efficiency LED lighting device is characterized by comprising a shell (1), wherein a heat radiation module (2) for preventing light attenuation acceleration is arranged in the shell (1), the heat radiation module (2) comprises a ceramic heat radiation plate (21) and an aluminum substrate (22) which are arranged in the shell (1), a welding layer (23) is arranged between the ceramic heat radiation plate (21) and the aluminum substrate (22), and a concave-convex texture (24) is arranged on the heat radiation surface of the ceramic heat radiation plate (21); The LED light source comprises an aluminum substrate (22), wherein a multichannel component (3) for avoiding overall light effect reduction is arranged on the aluminum substrate (22), the multichannel component (3) comprises a first blue light chip set (31), a second blue light chip set (32) and a third blue light chip set (33), a power management system (34) is arranged in a shell (1), and the power management system (34) is respectively and electrically connected with the first blue light chip set (31), the second blue light chip set (32) and the third blue light chip set (33) and is used for independently regulating driving current of each channel; The anti-dazzle assembly is characterized in that an anti-dazzle assembly (4) for inhibiting glare under low light loss is arranged at the opening of the shell (1), the anti-dazzle assembly (4) comprises a gland (44) in threaded connection with the shell (1), a lens (41) is arranged between the gland (44) and the shell (1), the lens (41) is covered below the multichannel assembly (3), a microstructure texture (43) is arranged on the light emergent surface of the lens (41), and light diffusion particles (42) are filled in the central area of the microstructure texture (43).
  2. 2. A high light efficiency LED lighting apparatus as set forth in claim 1 wherein the first blue light chipset (31) has a dominant wavelength in the range of 430-450nm, the second blue light chipset (32) has a dominant wavelength in the range of 450-460nm, and the third blue light chipset (33) has a dominant wavelength in the range of 470-480nm.
  3. 3. The high-light-efficiency LED lighting device according to claim 1, further comprising a temperature sensor (6) arranged on the aluminum substrate (22), wherein the temperature sensor (6) is used for collecting junction temperature data of the multi-channel assembly (3) in real time, a control unit (5) which is electrically connected with the temperature sensor (6) and the power management system (34) respectively is arranged in the shell (1), a temperature spectrum compensation model is pre-stored in the control unit (5), and the driving current proportion of the power management system (34) to each channel is adjusted in real time according to the junction temperature data so as to maintain the color rendering index of an output spectrum.
  4. 4. The high-light-efficiency LED lighting device of claim 3, wherein through grooves (8) are symmetrically formed in the shell (1), clamping blocks (7) are arranged in the through grooves (8) in a sliding mode, inclined planes are formed in one ends of the clamping blocks (7) located in the shell (1), side grooves (9) are formed in two sides of the through grooves (8), side plates (10) fixedly connected with the clamping blocks (7) are arranged in the side grooves (9) in a sliding mode, limiting columns (12) are fixedly arranged on the side plates (10), and reset springs (11) sleeved on the limiting columns (12) are fixedly arranged between the side plates (10) and the side grooves (9).
  5. 5. The high-light-efficiency LED lighting device of claim 1, wherein the ceramic heat dissipation plate (21) is an aluminum oxide ceramic heat dissipation plate, the depth of the surface concave-convex texture (24) is 10-50 μm, and the concave-convex texture (24) is a bionic honeycomb hexagon pit array.
  6. 6. A high light efficiency LED lighting apparatus as set forth in claim 2 wherein the upper surfaces of the first blue light chip set (31), the second blue light chip set (32) and the third blue light chip set (33) are covered with a full spectrum phosphor layer comprising red phosphor, green phosphor and yellow phosphor, the excitation spectrum of which is matched with the wavelength of the three-channel blue light.
  7. 7. The LED lighting device with high luminous efficiency according to claim 1, wherein the light diffusion particles (42) are made of silicon dioxide, and the light diffusion particles (42) are distributed in a symmetrical arc shape in the central area of the lens (41).
  8. 8. The high light efficiency LED lighting device as set forth in claim 5, wherein the soldering layer (23) is a metallized soldering layer (23), an integrated structure is formed between the lower surface of the aluminum substrate (22) and the upper surface of the ceramic heat dissipation plate (21) through the metallized soldering layer (23), and the soldering layer (23) is formed by an active metal soldering process.
  9. 9. A high light efficiency LED lighting apparatus as set forth in claim 7 wherein the microstructure texture (43) is comprised of a plurality of concentric rings, each ring having an asymmetric triangle in cross-section.
  10. 10. A method of manufacturing a high light efficiency LED lighting device as set forth in any one of claims 1 to 9, comprising the steps of: S1, adopting an active metal brazing process to weld an aluminum substrate (22) and a ceramic heat dissipation plate (21) with concave-convex textures (24) to form a composite heat dissipation base; S2, mounting a multichannel assembly (3) and a temperature sensor (6) on an aluminum substrate (22) through an SMT process; s3, coating and curing full-spectrum fluorescent powder layers above the first blue light chip set (31), the second blue light chip set (32) and the third blue light chip set (33), pushing the assembled heat dissipation module (2) into the shell (1), and fixing the heat dissipation module (2) through the clamping blocks (7); S4, fixing a lens (41) filled with light diffusion particles (42) and formed with micro-structural textures (43) in an opening of a shell (1) through a gland (44), and covering the lens (41) above the multichannel assembly (3); and S5, installing a control unit (5) in the shell (1), electrically connecting the temperature sensor (6) with the control unit (5), and electrically connecting the control unit (5) with a power management system (34).

Description

High-light-efficiency LED lighting device and manufacturing method thereof Technical Field The application relates to the technical field of illumination, in particular to a high-light-efficiency LED illumination device and a manufacturing method thereof. Background LED lighting technology is rapidly evolving towards high power, high quality, high reliability. In application scenarios such as municipal roads, commercial spaces, and industrial sites, the lighting device not only needs to provide high light efficiency to achieve the energy-saving goal, but also must have excellent thermal management capability, precise optical control, and long service life. The traditional LED lighting device adopts a scheme that a single-band blue light chip excites yellow fluorescent powder, although the technology is mature and the cost is low, the red light component in the spectrum is seriously lost, the color rendering index (Ra) is low, the red fluorescent powder or the red light chip is introduced for improving the color rendering property, the overall light efficiency of the system is reduced due to the difference of the electro-optic conversion efficiency, when a high-power LED works, the internal quantum efficiency is directly reduced and the light attenuation is accelerated due to the rise of the junction temperature of the chip, and secondly, the LED is used as a typical point light source, the extremely high surface brightness of the LED is the main cause of glare, and the traditional anti-dazzle scheme adopts an additional soft light plate or a diffusion cover, so that the glare can be reduced, but the light efficiency of the system is obviously sacrificed. Disclosure of Invention The application provides a high-light-efficiency LED lighting device and a manufacturing method thereof, in order to solve the problem of mutual restriction among high light efficiency, high color rendering, long service life and low glare. The application provides a high-light-efficiency LED lighting device and a manufacturing method thereof, which adopts the following technical scheme: The high-light-efficiency LED lighting device comprises a shell, wherein a heat radiation module used for avoiding acceleration of light attenuation is arranged in the shell, the heat radiation module comprises a ceramic heat radiation plate and an aluminum substrate which are arranged in the shell, a welding layer is arranged between the ceramic heat radiation plate and the aluminum substrate, and the heat radiation surface of the ceramic heat radiation plate is provided with concave-convex textures; The LED display device comprises an aluminum substrate, wherein a multi-channel component for avoiding the decline of the overall light effect is arranged on the aluminum substrate, the multi-channel component comprises a first blue light chip set, a second blue light chip set and a third blue light chip set, a power management system is arranged in a shell, and the power management system is respectively and electrically connected with the first blue light chip set, the second blue light chip set and the third blue light chip set and is used for independently regulating the driving current of each channel; The anti-dazzle assembly is used for suppressing glare under low light loss, the anti-dazzle assembly comprises a gland in threaded connection with the shell, a lens is arranged between the gland and the shell, the lens is covered below the multichannel assembly, a microstructure texture is arranged on the light emergent surface of the lens, and light diffusion particles are filled in the central area of the microstructure texture. Through adopting above-mentioned technical scheme, the casing is as whole bearing structure, inside sets up the heat dissipation module, it forms low thermal resistance heat conduction path with aluminium base board and ceramic heating panel through the weld layer, and utilize the unsmooth texture on ceramic heating panel surface to strengthen convection heat transfer in order to delay light decay, multichannel subassembly that sets up on the aluminium base board passes through the power management system and independently adjusts the drive current of first blue light chipset, second blue light chipset and third blue light chipset in order to realize the smart reconfiguration of spectrum, casing opening part passes through threaded connection's gland fixed lens, utilize the micro-structure texture of lens play plain noodles and the light diffusion granule that central zone filled to realize the glare suppression under low light loss. Preferably, the dominant wavelength of the first blue light chip set ranges from 430 nm to 450nm, the dominant wavelength of the second blue light chip set ranges from 450nm to 460nm, and the dominant wavelength of the third blue light chip set ranges from 470 nm to 480nm. Through adopting above-mentioned technical scheme, first blue light chipset dominant wavelength 430-450nm is used for exci