CN-121977303-A - High-frequency piezoelectric driven cascade annular thermoacoustic stack integrated packaging cooler

CN121977303ACN 121977303 ACN121977303 ACN 121977303ACN-121977303-A

Abstract

The invention discloses a cascade annular thermoacoustic stack integrated packaging cooler driven by high-frequency piezoelectricity, which comprises a high-frequency piezoelectricity driving sound source, a micro-resonant cavity, a first low-temperature heat exchanger, a first multi-pore microstructure stack, a first heat exchange channel, a second multi-pore microstructure stack and a second low-temperature heat exchanger, wherein the high-frequency piezoelectricity driving sound source is arranged at one end of the micro-resonant cavity, the first multi-pore microstructure stack and the second multi-pore microstructure stack are arranged in the micro-resonant cavity at intervals, the outer end of the first low-temperature heat exchanger is connected with a heat source chip, the inner end of the first low-temperature heat exchanger is connected with the first multi-pore microstructure stack, the first heat exchange channel, the second heat exchange channel and the second multi-pore microstructure stack are sequentially connected, the inner end of the second low-temperature heat exchanger is connected with the second multi-pore microstructure stack, and the outer end of the second low-temperature heat exchanger is positioned in an external environment.

Inventors

LING WEISONG
ZHU YI
WANG CHAOFAN
CUI JIARONG
HU ZHANPENG
SUN GUOQIANG
WANG JIN

Assignees

厦门大学

Dates

Publication Date: 20260505
Application Date: 20260122

Claims (10)

1. A high-frequency piezoelectric driven cascade ring-shaped thermoacoustic stack integrated packaging cooler is characterized by comprising a high-frequency piezoelectric driven sound source, a micro resonant cavity, a first low-temperature heat exchanger, a first porous microstructure stack, a first heat exchange channel, a second porous microstructure stack and a second low-temperature heat exchanger, wherein the high-frequency piezoelectric driven sound source is arranged at one end of the micro resonant cavity and is used for exciting a standing wave sound field, the first porous microstructure stack and the second porous microstructure stack are arranged in the micro resonant cavity at intervals, the first low-temperature heat exchanger is arranged at one side of the micro resonant cavity, the outer end of the first low-temperature heat exchanger is connected with a heat source chip, the inner end of the first low-temperature heat exchanger is connected with the first porous microstructure stack, the first heat exchange channel and the second heat exchange channel are respectively arranged in stack areas at two sides of the micro resonant cavity, the first porous microstructure stack, the first heat exchange channel, the second heat exchange channel and the second porous microstructure stack are sequentially connected with each other and are used for realizing heat energy exchange with a cold end and a sound-wave gas when a working medium is high-speed, the first low-temperature stack passes through a cascade ring-shaped thermoacoustic energy stack, the outer end of the resonator is connected with the second low-temperature stack, and the second low-temperature stack is arranged at the outer end of the micro resonant cavity.
2. The cascade annular thermoacoustic stack integrated packaging cooler driven by high-frequency piezoelectricity as claimed in claim 1, wherein the working frequency of the high-frequency piezoelectricity driven sound source is 2k-8kHz, and the cascade annular thermoacoustic stack integrated packaging cooler comprises a piezoelectric ceramic plate and back cavity coupling structure for realizing the back standing wave excitation characteristic.
3. The device of claim 1, wherein the micro-resonant cavity is a racetrack type echo type closed cavity structure and is a closed cavity, the design of lambda/4 standing wave length is provided, two ends of the micro-resonant cavity are provided with reflecting end faces for forming a stable standing wave field and inhibiting high-frequency sound wave attenuation, and the distance between the reflecting end faces and the first porous microstructure stack or the second porous microstructure stack is integer times of lambda/4, so that resonance and standing wave pressure nodes are enhanced to align to the positions of the first porous microstructure stack or the second porous microstructure stack.
4. The device of claim 1, wherein the first porous microstructure stack and the second porous microstructure stack are made of one or more materials selected from the group consisting of copper-doped metal powder reinforced polymer composite materials, porous ceramics and silicon-based microchannel structures, and have a micro-scale gap and hole structure.
5. The device of claim 4, wherein the first and second porous micro-structure stacks have radial and axial micro-channels with a radial array of 200-800 μm holes for uniform pressure distribution of standing waves of the micro-resonator at the stacks and increasing input density of acoustic energy at the stacks.
6. The device of claim 4, wherein the through holes of the first and second porous microstructure stacks are formed by laser processing or MEMS etching, have a porosity greater than a predetermined value and a thermal conductivity lower than a predetermined value, and are used for reducing acoustic-thermal coupling loss of the stacks, and the lengths of the first and second porous microstructure stacks are lambda/10-lambda/4, and the integrated formation of the micro-resonator and the first and second porous microstructure stacks is realized in a 3D printing mode.
7. The cascade annular thermoacoustic stack integrated packaging cooler driven by high-frequency piezoelectricity as claimed in claim 1, wherein the first porous microstructure stack and the second porous microstructure stack are axisymmetrically arranged in a micro resonant cavity, the first heat exchange channel and the second heat exchange channel are in heat symmetrical configuration and are provided with radiating fins for improving the overall heat exchange efficiency, the radiating fins are of corrugated micro fin structures or needle-shaped micro fin structures, and the radiating fins are positioned outside the micro resonant cavity and are used for expanding the effective heat exchange area of a gas and metal interface and improving the flow field disturbance and convection heat exchange efficiency.
8. The device of claim 1, wherein the working medium is any one of air, helium, neon or nitrogen, and the dynamic viscosity and thermal conductivity of the working medium are in the same order of magnitude as the geometric dimensions of the first porous microstructure stack and the second porous microstructure stack, so that the flow resistance and the heat transfer efficiency are balanced to improve the heat sound efficiency.
9. The device of claim 1, wherein the first low-temperature heat exchanger is directly coupled to the heat source chip by flip-chip packaging, and has a total thickness of 2-5 mm.
10. The high-frequency piezoelectric-driven cascade annular thermoacoustic stack integrated packaging cooler is characterized in that a phonon crystal shielding layer is arranged on the inner wall of a region outside a first porous microstructure stack and a second porous microstructure stack of the miniature resonant cavity and used for reducing non-working acoustic power leakage and improving energy utilization rate, and a protective layer is arranged on the outer wall of the miniature resonant cavity and is an aluminum nitride or silicon carbide coating.

Description

High-frequency piezoelectric driven cascade annular thermoacoustic stack integrated packaging cooler Technical Field The invention belongs to the technical field of micro thermoacoustic refrigerating devices, and particularly relates to a cascade annular thermoacoustic stack integrated packaging cooler driven by high-frequency piezoelectricity. Background With the rapid increase of the integration level of semiconductor devices, the power consumption per unit area is rapidly increased, and the thermal management of devices has become a key challenge for the current electronic industry. The traditional air cooling and liquid cooling system has the inherent limitations of huge volume, high complexity, poor layout flexibility and the like, is difficult to adapt to the current miniaturized and modularized advanced packaging system, and has extremely limited applicability especially in application scenes with high heat flux and limited space. The thermo-acoustic refrigeration technology is used as a non-traditional method for realizing heat transmission and cooling by using the thermo-acoustic effect generated when sound waves are transmitted in a gaseous medium, has the remarkable advantages of no moving parts, high reliability, long service life, low noise, no need of chemical refrigerants and the like, and has unique potential in the fields of embedded systems, high-reliability application and strict requirements on environmental friendliness. However, the existing thermoacoustic cooling device mostly adopts a low-frequency mechanical sound source, and the defects of large volume and low acoustic power density generally exist, so that the existing thermoacoustic cooling device is difficult to realize on-chip integration, cannot meet the heat dissipation requirement of a high-power density chip, and is limited to be widely applied to the current high-density integrated electronic products. In order to overcome the defects in the prior art, the invention provides the cascade annular thermoacoustic stack integrated packaging cooler driven by high-frequency piezoelectricity, which realizes a miniaturized and high-efficiency heat dissipation scheme without refrigerants through high-frequency driving, structure optimization and integrated packaging design so as to meet the heat dissipation requirements of high-heat flux and volume-limited electronic devices. Disclosure of Invention The invention aims to solve the problems that the existing low-frequency thermoacoustic cooling device is large in size and low in sound power density, and is difficult to adapt to the heat dissipation requirements of a high-heat-flux and space-limited electronic device, and provides a cascade annular thermoacoustic stack integrated packaging cooler driven by high-frequency piezoelectricity, so that a miniaturized, high-efficiency, refrigerant-free and high-reliability heat dissipation solution is realized. In order to achieve the above purpose, the present invention adopts the following technical scheme: The cascade ring type thermoacoustic stack integrated packaging cooler driven by high-frequency piezoelectricity comprises a high-frequency piezoelectricity driving sound source, a miniature resonant cavity, a first low-temperature heat exchanger, a first multi-pore microstructure stack, a first heat exchange channel, a second multi-pore microstructure stack and a second low-temperature heat exchanger, wherein the high-frequency piezoelectricity driving sound source is arranged at one end of the miniature resonant cavity and is used for exciting a standing wave sound field, the first multi-pore microstructure stack and the second multi-pore microstructure stack are arranged in the miniature resonant cavity at intervals, the first low-temperature heat exchanger is arranged at one side of the miniature resonant cavity, the outer end of the first low-temperature heat exchanger is connected with a heat source chip, the inner end of the first low-temperature heat exchanger is connected with the first multi-pore microstructure stack, the first heat exchange channel and the second heat exchange channel are respectively arranged in stack areas at two sides of the miniature resonant cavity, the first multi-pore microstructure stack, the first heat exchange channel, the second heat exchange channel and the second multi-pore microstructure stack are sequentially connected with each other and are used for realizing heat exchange with a cold end when a working medium is high-sound velocity gas, and pass through the cascade ring type thermoacoustic energy, and the second low-temperature resonator is connected with the outer end of the second low-temperature resonator. Preferably, the working frequency of the high-frequency piezoelectric driving sound source is 2k-8kHz, and the high-frequency piezoelectric driving sound source comprises a piezoelectric ceramic plate and back cavity coupling structure for realizing the back standing wave excitation cha