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CN-121977495-A - MOD RING product slope angle detection method

CN121977495ACN 121977495 ACN121977495 ACN 121977495ACN-121977495-A

Abstract

The invention discloses a method for detecting a slope angle of an MOD RING product, which can rapidly and effectively realize accurate detection of a slope characteristic distribution angle. In the inspection process, the inner, middle and outer three points are collected at certain angles by the MOD RING product RING, so that a plurality of points are collected, and the characteristics of the plane and the inclined plane of the product are fitted by judging and confirming the points, so that the connection position is detected, and the distribution angle is calculated. The accuracy can be ensured to be within the allowable range of the error. The batch detection of similar products is realized, and the production efficiency is improved. The problems that the slope characteristic distribution angle of the MOD RING product is difficult to detect, the slope angle cannot be effectively detected due to the fact that the thicknesses of the left side and the right side of the plane of the product are different, and the slope is used as the transition of the two thicknesses are solved.

Inventors

  • LI XINYU
  • LI QI
  • CAI DEQI

Assignees

  • 杭州大和江东新材料科技有限公司

Dates

Publication Date
20260505
Application Date
20251229

Claims (10)

  1. 1. A method for detecting the slope angle of an MOD RING product is characterized by comprising the following steps: s1, confirming that an inspection platform of CMM equipment is clean and has no abnormality; s2, confirming that the base of the inspection jig is clean and has no abnormality and the plane is free from variation; s3, placing the detection jig base on an inspection platform of CMM equipment, and ensuring stable placement without shaking; S4, placing the ceramic MOD RING product to be detected on a base of the inspection jig, and ensuring stable placement without shaking; S5, positioning a ceramic MOD RING product to be detected through a CMM equipment program; S6, starting a program of CMM equipment to realize three-coordinate detection of the ceramic MOD RING product to be detected, and obtaining point values corresponding to a plurality of angle positions; and S7, determining angles of the high plane and the low plane corresponding to the slope transition surface according to the detection result and the position of the product plane access inclined plane in a determination mode of the position of the judgment point value.
  2. 2. The method for detecting the slope angle of a MOD RING product according to claim 1, wherein the step S6 of inspecting the ceramic MOD RING product comprises the steps of: s61, respectively acquiring values of points of the inner diameter, the middle diameter and the outer diameter of the ceramic MOD RING RING to be detected at intervals of a certain angle on the ceramic MOD RING RING to be detected, and acquiring point values of a plurality of points on the whole ceramic MOD RING product; S62, fitting the inclined plane characteristics of the plane and the inclined plane transition surface of the ceramic MOD RING product through a plurality of points, detecting the connection position, and calculating the distribution angle.
  3. 3. The method according to claim 2, wherein the distance in step S61 is 0.5 °,1 °,1.5 °,2 °.
  4. 4. The method for detecting the slope angle of a MOD RING product according to claim 1, wherein the step S7 of determining the plane access slope comprises the steps of: S71, finding out four points of the slope transition surface, wherein the four points start to descend, end to descend, start to ascend and end to ascend, and determining which two data are positioned between each point according to the height data; And S72, after finding the point starting to change, estimating the position of the access point according to the data of the point starting to change, wherein if the data after change and the data before change are larger, the access point can be estimated to be close to the previous point, and if the data change of the two points is smaller, the access point can be estimated to be close to the next point.
  5. 5. The method for detecting the slope angle of a MOD RING product according to claim 4, wherein the determining method according to S7 is characterized in that three access points are obtained, wherein the inner RING is located at the rear, the middle RING is located at the middle, the outer RING is located at the front, and the average value of the three access points is taken to obtain the access point value.
  6. 6. The method for detecting the slope angle of a MOD RING product according to claim 4, wherein the determining method according to S7 is characterized in that three access points are obtained, namely, an inner RING is front, a middle RING is middle, an outer RING is back, and an average value of the three access points is taken to obtain the access point value.
  7. 7. The method for detecting the slope angle of a MOD RING product according to claim 4, wherein the determining method according to S7 is characterized in that three access points are obtained, wherein the inner RING is front, the middle RING is rear, the outer RING is front, the outer RING is C-shaped, and the front value of the middle RING is the value of the access point.
  8. 8. The method for detecting the slope angle of a MOD RING product according to claim 4, wherein the determining method according to S7 is characterized in that three access points are obtained, wherein the inner circle is located at the rear, the middle circle is located at the front, the outer circle is located at the rear, and the front value of the middle circle is taken as the value of the access point.
  9. 9. The method for detecting a slope angle of a MOD RING product according to any one of claims 2 to 8, wherein the determination of the value of the access point is performed by focusing on the position of the intersection of two areas, and determining the number of points of the access point.
  10. 10. The method for detecting the slope angle of a MOD RING product according to claim 9, wherein the error of each circle of access points is guaranteed to be within 1 degree by determining two detection points before and after each circle of access points, and the result error can be guaranteed to be within 1 degree under the condition that the angle difference of the three points is guaranteed not to exceed a tolerance when the access points are comprehensively calculated according to the three points.

Description

MOD RING product slope angle detection method Technical Field The invention relates to the technical field of semiconductor product detection, in particular to a method for detecting a slope angle of an MOD RING product. Background In semiconductor devices, MOD RING is a critical consumable component that is used primarily for wafer edge protection and to improve the uniformity of thin film deposition processes. The main function is 1, protecting the electrostatic chuck. In etching and CVD equipment, a wafer is placed on an electrostatic chuck, which holds the wafer firmly by electrostatic force, and its surface is usually made of a high-value, easily damaged material such as ceramic. During processing, the wafer surface, edge, and backside are exposed to plasma and reactive gases. This can lead to particle contamination and electrostatic chuck damage. The MOD RING is mounted slightly above the periphery of the wafer surface to withstand the etching and deposition that would otherwise be experienced by the wafer edge and the electrostatic chuck, thereby protecting the expensive electrostatic chuck from damage and contamination. 2, Improving the process uniformity. In the deposition or etching process, the flow field and electric field distribution of the reaction gas and plasma at the edge of the wafer are different from those of the central area, so that the film thickness or etching rate of the edge area of the wafer is inconsistent with the center, the process result of the area of the outermost few millimeters of the wafer is obviously different from that of the main area, and the partial area is usually discarded, thus reducing the utilization rate of the single wafer. The MOD RING can adjust the air flow and electric field distribution of the wafer edge region through the specific geometric shapes (inner diameter, inclined surface angle and the like) so that the distribution of reactants on the wafer surface is more uniform, the process difference between the center and the edge of the wafer is reduced, the process uniformity of the whole wafer is improved, the effective chip area is increased, and the yield is improved. MOD RING is gradually etched or covered with a thick film during the process and therefore needs to be replaced periodically. It is one of the important consumables in semiconductor devices. Since the thickness of the MOD RING product slope in the semiconductor industry is different between the left side and the right side of the product plane, the slope is used as a transition structure with two plane thicknesses, and the slope condition can influence the performance of the product. The inclined plane is non-planar, and the joint position of the inclined plane and the high and low planes is that the plane gradually transits to the inclined plane, so that the detection is extremely difficult. Chinese patent document CN 120063079A discloses a detection tool and a detection method for detecting the coordinates of inclined points of parts. The detection tool is of a circular ring structure, a circle of bevel opening is formed in the periphery of one side of an opening of the circular ring structure, the angle of the bevel opening is matched with the bevel angle A1 of the measured part, the measurement accuracy is high, the accuracy can reach 0.01 degrees, the size which cannot be detected by a conventional measuring tool can be realized, and the three-coordinate measuring machine can be replaced for detecting the specific part. The method has wide application range, can detect parts with the structure, and is suitable for detecting products with large batches. However, the above technical solution cannot realize the detection of the slope angle of the MOD RING product. Therefore, it is necessary to design a method for detecting the slope angle of the MOD RING product, so that the slope angle can be detected rapidly, efficiently and accurately. Disclosure of Invention The invention aims to solve the problems that in the prior art, the slope characteristic distribution angle of an MOD RING product in the semiconductor industry is difficult to detect, the slope is not effectively detected due to the fact that the thicknesses of the left side and the right side of a product plane are different, and the slope is used as a transition between the two thicknesses, and the like. In the inspection process, the inner, middle and outer three points are collected at certain angles by the MOD RING product RING, so that a plurality of points are collected, and the characteristics of the plane and the inclined plane of the product are fitted by judging and confirming the points, so that the connection position is detected, and the distribution angle is calculated. The technical scheme adopted by the invention for achieving the purpose of the invention is that the method for detecting the slope angle of the MOD RING product comprises the following steps: s1, confirming that an inspection platform of CMM