CN-121977734-A - Calibration-free stress measurement method and device based on transverse wave birefringence and incremental deformation

CN121977734ACN 121977734 ACN121977734 ACN 121977734ACN-121977734-A

Abstract

The application discloses a calibration-free stress measurement method and device based on transverse wave birefringence and incremental deformation, and relates to the technical field of ultrasonic nondestructive testing, wherein the method comprises the steps of obtaining a first ultrasonic echo time domain signal, a second ultrasonic echo time domain signal and a thickness value at a detection point of a test piece to be detected; the method comprises the steps of determining a first transverse wave propagation time and a second transverse wave propagation time based on the first ultrasonic echo time domain signal and the second ultrasonic echo time domain signal, determining a first propagation speed and a second propagation speed based on the first transverse wave propagation time, the second transverse wave propagation time and a thickness value at a detection point of a test piece to be detected, determining a stress value at the detection point of the test piece to be detected according to the first propagation speed and the second propagation speed, wherein the stress value at the detection point of the test piece to be detected comprises a stress magnitude along an x-axis direction and a stress magnitude along a y-axis direction. The application can effectively overcome the dependence on third-order elastic constant in the stress measurement process.

Inventors

ZHANG BINPENG
ZHENG YANG
TANG KAI
TAN JIDONG

Assignees

中国特种设备检测研究院

Dates

Publication Date: 20260505
Application Date: 20260318

Claims (10)

1. The calibration-free stress measurement method based on transverse wave birefringence and incremental deformation is characterized by comprising the following steps of: the method comprises the steps of obtaining a first ultrasonic echo time domain signal, a second ultrasonic echo time domain signal and a thickness value at a detection point of a test piece to be detected, wherein the first ultrasonic echo time domain signal is an ultrasonic echo time domain signal parallel to the x-axis stress direction at the detection point of the test piece to be detected; Determining a first transverse wave propagation time and a second transverse wave propagation time based on the first ultrasonic echo time domain signal and the second ultrasonic echo time domain signal, wherein the first transverse wave propagation time is a transverse wave propagation time parallel to the x-axis stress direction in the bidirectional stress at the detection point of the test piece to be detected, and the second transverse wave propagation time is a transverse wave propagation time parallel to the y-axis stress direction in the bidirectional stress at the detection point of the test piece to be detected; Determining a first propagation speed and a second propagation speed based on the first transverse wave propagation time, the second transverse wave propagation time and the thickness value at the detection point of the test piece to be detected, wherein the first propagation speed is the propagation speed of the transverse wave parallel to the x-axis stress direction in the stress state in the test piece to be detected, and the second propagation speed is the propagation speed of the transverse wave parallel to the y-axis stress direction in the stress state in the test piece to be detected; And determining a stress value at a detection point of the test piece to be detected according to the first propagation speed and the second propagation speed, wherein the stress value at the detection point of the test piece to be detected comprises a stress magnitude along the x-axis direction and a stress magnitude along the y-axis direction.
2. The shear-birefringence and incremental deformation-based non-calibrated stress measurement method of claim 1, further comprising: And after the stress value is determined, the stress magnitude under different angles is obtained by rotating the angle of the sensor, and the magnitude and the direction of the main stress of the local area are determined by using an analytic method, a graphic method or a Moire circle method.
3. The method for calibrating-free stress measurement based on transverse wave birefringence and incremental deformation according to claim 1, wherein determining a first transverse wave propagation time and a second transverse wave propagation time based on the first ultrasonic echo time domain signal and the second ultrasonic echo time domain signal comprises: dividing the thickness value at the detection point of the test piece to be detected by the first transverse wave propagation time to obtain a first propagation speed; And dividing the thickness value at the detection point of the test piece to be detected by the second transverse wave propagation time to obtain a second propagation speed.
4. The method for measuring the calibration-free stress based on the transverse wave birefringence and the incremental deformation according to claim 1, wherein the step of determining the stress value at the detection point of the test piece to be detected according to the first propagation speed and the second propagation speed comprises the following steps: According to the incremental deformation theory, combining transverse wave polarization splitting characteristics under the action of stress, and determining a transverse wave control equation under the action of stress; determining a stress calculation formula based on the transverse wave control equation, the first propagation speed and the second propagation speed under the stress action; And determining a stress value at a detection point of the test piece to be detected based on the stress calculation formula.
5. The calibration-free stress measurement method based on transverse wave birefringence and incremental deformation according to claim 4, wherein the expression of the transverse wave control equation under the stress is: ; Wherein S xx and S yy are stress data along the x-direction and the y-direction respectively, μ is material pull Mei Jishu; ρ is the density of the material; And Is the transverse wave displacement potential polarized along the x and y directions in the plane wave displacement component, t is time, and z is the derivative direction, namely the change rate of the field quantity along the coordinate direction.
6. The method for calibrating stress-free measurement based on shear wave birefringence and incremental deformation according to claim 4, wherein the expression of the stress calculation formula is: ; Wherein S xx and S yy are stress data along the x-direction and the y-direction respectively, μ is material pull Mei Jishu; Is Laplacian, ρ is the density of the material, v sx is the transverse wave velocity parallel to the x-axis stress direction, and v sy is the transverse wave velocity parallel to the y-axis stress direction.
7. A calibration-free stress measurement device based on transverse wave birefringence and incremental deformation, wherein the calibration-free stress measurement device based on transverse wave birefringence and incremental deformation is used for realizing the calibration-free stress measurement method based on transverse wave birefringence and incremental deformation according to any one of claims 1 to 6, and the calibration-free stress measurement device based on transverse wave birefringence and incremental deformation comprises: the device comprises an excitation sensor, a dual-channel receiving sensor and a processing unit; the excitation sensor is used for sending out ultrasonic transverse waves at a detection point of the to-be-detected test piece subjected to stress as an excitation signal; the first channel of the dual-channel receiving sensor is used for collecting a first ultrasonic echo time domain signal, wherein the first ultrasonic echo time domain signal is an ultrasonic echo time domain signal parallel to the x-axis stress direction at a detection point of a test piece to be detected; The second channel of the double-channel receiving sensor is used for collecting a second ultrasonic echo time domain signal, wherein the second ultrasonic echo time domain signal is an ultrasonic echo time domain signal parallel to the y-axis stress direction at the detection point of the test piece to be detected; The processing unit is used for determining a first transverse wave propagation time and a second transverse wave propagation time based on the first ultrasonic echo time domain signal and the second ultrasonic echo time domain signal, wherein the first transverse wave propagation time is a transverse wave propagation time parallel to the x-axis stress direction in the bidirectional stress at a detection point of the test piece to be detected, the second transverse wave propagation time is a transverse wave propagation time parallel to the y-axis stress direction in the bidirectional stress at the detection point of the test piece to be detected, the first propagation speed and the second propagation speed are determined based on the first transverse wave propagation time, the second transverse wave propagation time and the thickness value at the detection point of the test piece to be detected, the first propagation speed is a propagation speed of a transverse wave parallel to the x-axis stress direction in the stress state in the test piece to be detected, the second propagation speed is a propagation speed of a transverse wave parallel to the y-axis stress direction in the test piece to be detected, the stress value at the test piece to be detected is determined according to the first propagation speed and the second propagation speed, and the stress value at the test piece to be detected comprises a stress magnitude along the x-axis direction and a stress magnitude along the y-axis direction.
8. A computer device comprising a memory, a processor and a computer program stored on the memory and capable of running on the processor, characterized in that the processor executes the computer program to implement the method for calibrating stress free measurement based on transverse wave birefringence and incremental deformation according to any of claims 1-6.
9. A computer readable storage medium having stored thereon a computer program, which when executed by a processor implements the shear wave birefringence and incremental deformation based no calibration stress measurement method according to any of claims 1-6.
10. A computer program product comprising a computer program, characterized in that the computer program, when executed by a processor, implements the calibration-free stress measurement method based on transverse wave birefringence and incremental deformation according to any one of claims 1-6.

Description

Calibration-free stress measurement method and device based on transverse wave birefringence and incremental deformation Technical Field The application relates to the technical field of nondestructive ultrasonic nondestructive detection, in particular to a calibration-free stress measurement method and device based on transverse wave birefringence and incremental deformation. Background In modern industrial equipment, key components bear alternating pressure and composite load in the manufacturing and service processes, and stress concentration is easy to induce. Especially, the rim of the train is in direct contact with the steel rail, so that the weight of the whole train is borne, traction force and braking force are transmitted, microcracks are prone to being initiated in a stress concentration area, and driving safety is directly threatened. Therefore, the nondestructive stress measurement technology for the structure is a necessary means for guaranteeing the product quality, and implementing safety evaluation and risk prevention and control, and has extremely important significance. At present, the stress detection method is numerous, and as one of important nondestructive detection methods, the ultrasonic method is widely focused due to the advantages of relatively simple instrument, high detection speed, no damage and the like. The current ultrasonic stress measurement system based on the acoustic elastic effect is based on the constitutive equation containing the third-order elastic constant. Although the transverse wave birefringence technology improves detection sensitivity by capturing polarized waves, the analytical model still cannot avoid dependence on high-order elastic parameters. Therefore, how to effectively overcome the dependence on the third-order elastic constant in the stress measurement process becomes a technical problem to be solved in the field. Disclosure of Invention The application aims to provide a calibration-free stress measurement method and device based on transverse wave birefringence and incremental deformation, which can effectively overcome the dependence on third-order elastic constants in the stress measurement process. In order to achieve the above object, the present application provides the following. In a first aspect, the present application provides a method for measuring calibration-free stress based on transverse wave birefringence and incremental deformation, the method for measuring calibration-free stress based on transverse wave birefringence and incremental deformation comprising the following steps. The method comprises the steps of obtaining a first ultrasonic echo time domain signal, a second ultrasonic echo time domain signal and a thickness value at a detection point of a test piece to be detected, wherein the first ultrasonic echo time domain signal is an ultrasonic echo time domain signal parallel to the x-axis stress direction at the detection point of the test piece to be detected, and the second ultrasonic echo time domain signal is an ultrasonic echo time domain signal parallel to the y-axis stress direction at the detection point of the test piece to be detected. And determining a first transverse wave propagation time and a second transverse wave propagation time based on the first ultrasonic echo time domain signal and the second ultrasonic echo time domain signal, wherein the first transverse wave propagation time is a transverse wave propagation time parallel to the x-axis stress direction in the bidirectional stress at the detection point of the test piece to be detected, and the second transverse wave propagation time is a transverse wave propagation time parallel to the y-axis stress direction in the bidirectional stress at the detection point of the test piece to be detected. And determining a first propagation speed and a second propagation speed based on the first transverse wave propagation time, the second transverse wave propagation time and the thickness value of the test point of the test piece to be tested, wherein the first propagation speed is the propagation speed of the transverse wave parallel to the x-axis stress direction in the stress state in the test piece to be tested, and the second propagation speed is the propagation speed of the transverse wave parallel to the y-axis stress direction in the stress state in the test piece to be tested. And determining a stress value at a detection point of the test piece to be detected according to the first propagation speed and the second propagation speed, wherein the stress value at the detection point of the test piece to be detected comprises a stress magnitude along the x-axis direction and a stress magnitude along the y-axis direction. Optionally, the calibration-free stress measurement method based on transverse wave birefringence and incremental deformation further comprises the following steps. And after the stress value is determined, the stress magnitude under diff