Search

CN-121977918-A - DIC technology-based high-throughput mechanical testing equipment and method

CN121977918ACN 121977918 ACN121977918 ACN 121977918ACN-121977918-A

Abstract

The invention relates to a high-throughput mechanical testing device and method based on DIC technology, the method comprises the following steps of installing a clamp matched with a material sample to be tested on the device, and connecting a clamping mechanism and a strain mechanism; the method comprises the steps of respectively fixing a plurality of material samples to be tested on a clamp, configuring strain parameters and image acquisition parameters, starting an actuator or a driving system to drive a cross beam to move, synchronously applying tension to the plurality of material samples to be tested to synchronously strain, simultaneously measuring force values in real time through a force sensor when the plurality of material samples to be tested are strained, acquiring images of gauge length sections of the plurality of material samples to be tested through a camera, performing DIC processing on the acquired images after the material samples to be tested are pulled off, calculating strain data of the gauge length sections of the material samples to be tested, and generating a stress-strain curve of the material samples according to the force values measured in the strain acquisition process and combining the strain data to realize high-flux mechanical test.

Inventors

  • CHEN BIN

Assignees

  • 上海交通大学

Dates

Publication Date
20260505
Application Date
20251226

Claims (10)

  1. 1. A high throughput mechanical testing apparatus based on DIC technology, comprising: a strain mechanism; the clamping mechanisms are connected with the strain mechanisms and are used for fixing a plurality of material samples; A camera facing the clamping mechanism, measuring a three-dimensional strain of a material sample with a plurality of the cameras; the image acquisition module is connected with the cameras and is used for synchronously acquiring speckle images of the gauge length sections of the plurality of material samples through one or more cameras; The DIC processing module is used for processing the received speckle images of the gauge length sections simultaneously, calculating the strain distribution of each sample by analyzing the pixel displacement of the gauge length sections of the plurality of material samples, and corresponding the strain results to each sample; the control module is respectively connected with the image acquisition module and the strain mechanism; and the force sensor is connected with the strain mechanism and is used for measuring the tensile force applied to the material sample in the strain process.
  2. 2. The DIC-based high throughput mechanical testing apparatus of claim 1, wherein the strain mechanism is capable of simultaneously applying force to a plurality of clamping mechanisms to simultaneously force the plurality of material samples to deform during the strain.
  3. 3. The DIC-based high throughput mechanical testing apparatus of claim 1, wherein the control module is configured to control the strain parameters of the strain mechanism 1 while controlling the image acquisition parameters of the image acquisition module 4.
  4. 4. The DIC-based high throughput mechanical testing apparatus of claim 3, wherein the strain parameters comprise strain velocity and displacement and the image acquisition parameters comprise image acquisition frequency.
  5. 5. The DIC-based high throughput mechanical testing system of claim 1, wherein the strain mechanism comprises an upper beam, a column, a lower beam, and a table sequentially disposed in a straight line direction, and the plurality of clamping mechanisms are connected to the upper beam and/or the lower beam through the force sensor.
  6. 6. A high throughput mechanical testing method based on DIC technology, characterized in that it is implemented based on the high throughput mechanical testing apparatus according to any one of claims 1-5, the method comprising the steps of: processing a tested material sample into a standard shape to form a test piece; preparing speckle patterns on the surface of the gauge length section of the processed measured material sample; Installing a clamping mechanism matched with a material sample to be tested on equipment, and connecting the clamping mechanism and a strain mechanism; Respectively fixing a plurality of material samples to be tested on the clamping mechanism; configuring a strain parameter and an image acquisition parameter; Starting an actuator or a driving system to drive the cross beam to move, synchronously applying tension to a plurality of material samples to be tested, and synchronously straining; simultaneously measuring force values in real time through a force sensor while straining a plurality of material samples to be measured, and synchronously collecting speckle images of gauge length sections of the plurality of material samples to be measured through a camera; Performing DIC processing on the acquired images during or after stretching of the sample of the material to be measured, and calculating strain data of gauge length sections of the sample of the material to be measured; And according to the force value measured in the strain acquisition process, generating a stress-strain curve of the material sample by combining the strain data, and realizing high-flux mechanical test.
  7. 7. The method of high throughput mechanical testing based on DIC technology of claim 6, wherein the step of performing DIC processing on the acquired images and calculating strain data for each gauge length section of the sample of the material under test comprises the steps of: and calculating the pixel displacement of the gauge length section through digital image correlation processing to obtain the strain.
  8. 8. The DIC-based high throughput mechanical testing method of claim 6, further comprising: Based on the stress-strain curve, tensile strength, yield strength and elongation after break are calculated and displayed.
  9. 9. The DIC-based high throughput mechanical testing method of claim 6, wherein the strain parameters comprise strain velocity and displacement.
  10. 10. The DIC-based high throughput mechanical testing method of claim 6, wherein the image acquisition parameters comprise image acquisition frequency.

Description

DIC technology-based high-throughput mechanical testing equipment and method Technical Field The invention relates to the field of mechanical property testing of materials, in particular to high-throughput mechanical testing equipment and method based on Digital Image Correlation (DIC) technology. Background In material strain tests, such as tensile tests, accurate acquisition of the force to which a material is subjected and the elongation of a sample gauge length are key to drawing a tensile curve and analyzing the performance of the material. At present, the measurement of force values mainly depends on force sensors, and the tensile force born by materials in the stretching process can be directly obtained, so that the data of the change of the force values with time or displacement are formed. And the displacement measurement mainly depends on an extensometer, the extensometer is clamped on a sample gauge length section, and the elongation of the extensometer is measured in real time, so that the strain is calculated. The same applies to compression tests and the like. The conventional testing machine can only test one sample at a time, and has low testing efficiency. The multi-channel testing machine can test a plurality of samples simultaneously, but each sample is required to be provided with an independent extensometer, so that the testing cost is increased, the installation process of the extensometer is complex, and more time and effort are required. In addition, physical contact of the extensometer with the sample may cause a certain disturbance to deformation of the sample, affecting accuracy of the test results. Meanwhile, with the material genome project proposed in recent years, research and application of new materials are accelerated by promoting calculation-experiment-deep fusion of data. However, although the experimental range is narrowed by high-flux calculation screening, the range of potential candidate materials with mechanical properties required to be verified by experiments is still quite large, and high-flux experiments are realized by accelerating the experiments by methods such as high-flux mechanical tests and the like, so that the high-efficiency development of the materials is truly realized. Therefore, a technical scheme is needed that can monitor the strain of a plurality of material samples simultaneously, and has the advantages of low cost, simple operation and accurate test result. Disclosure of Invention The invention aims to overcome the defects of the prior art and provide a high-throughput mechanical testing device and method based on the DIC technology, wherein strain is corresponding to each sample by software through simultaneously carrying out DIC strain analysis on a plurality of samples, so that the simultaneous testing of the plurality of samples is realized, and the problem of low testing efficiency of the conventional mechanical testing device and method is solved or partially solved. The aim of the invention can be achieved by the following technical scheme: In one aspect of the present invention, there is provided a high throughput mechanical testing apparatus based on DIC technology, comprising: a strain mechanism; the clamping mechanisms are connected with the strain mechanisms and are used for fixing a plurality of material samples; A camera facing the clamping mechanism, measuring a three-dimensional strain of a material sample with a plurality of the cameras; The image acquisition module is connected with the cameras and is used for synchronously acquiring speckle images of the gauge length sections of the plurality of material samples through the one or more cameras; The DIC processing module is used for processing the received speckle images of the gauge length sections simultaneously, calculating the strain distribution of each sample by analyzing the pixel displacement of the gauge length sections of the plurality of material samples, and corresponding the strain results to each sample; the control module is respectively connected with the image acquisition module and the strain mechanism; and the force sensor is connected with the strain mechanism and is used for measuring the tensile force applied to the material sample in the strain process. As a preferable technical scheme, the strain mechanism can apply force to a plurality of clamping mechanisms simultaneously, so that a plurality of material samples are synchronously stressed to deform in the strain process. As a preferable technical solution, the control module is configured to control the strain parameter of the strain mechanism 1, and simultaneously control the image acquisition parameter of the image acquisition module 4. As a preferable technical solution, the strain parameter includes a strain speed and a displacement, and the image acquisition parameter includes an image acquisition frequency. As the preferable technical scheme, the strain mechanism comprises an upper beam, an upri