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CN-121978104-A - Inspection method, inspection device, inspection equipment, inspection system and inspection medium for semiconductor equipment

CN121978104ACN 121978104 ACN121978104 ACN 121978104ACN-121978104-A

Abstract

The method comprises the steps of controlling a test wafer to execute at least one cyclic transmission operation in a preset transmission path of semiconductor equipment after the maintenance of the semiconductor equipment is completed, obtaining a current detection image of a target area of the test wafer after the cyclic transmission operation is completed, obtaining an image similarity parameter between the current detection image and a reference image, determining that the semiconductor equipment has an abnormal contact point when the image similarity parameter does not meet a preset similarity threshold value, and generating an abnormal instruction.

Inventors

  • LI KANGKANG

Assignees

  • 西安奕斯伟材料科技股份有限公司
  • 西安奕斯伟硅片技术有限公司

Dates

Publication Date
20260505
Application Date
20251210

Claims (13)

  1. 1. A method of inspecting a semiconductor device, the method comprising: After the maintenance of the semiconductor equipment is completed, controlling a test wafer to execute at least one cyclic transmission operation in a preset transmission path of the semiconductor equipment, wherein the preset transmission path is used for simulating a processing path so as to enable the test wafer to be in physical contact with a contact point of the semiconductor equipment; After the cyclic transmission operation is completed, acquiring a current detection image of the target area of the test wafer; acquiring an image similarity parameter between the current detection image and a reference image, wherein the reference image comprises an initial state image of a target area acquired before the test wafer executes the cyclic transmission operation; and when the image similarity parameter does not meet a preset similarity threshold value, determining that the semiconductor device has a contact point abnormality, and generating an abnormality instruction.
  2. 2. The method according to claim 1, wherein the acquiring the image similarity parameter between the current detected image and the reference image includes: performing differential comparison on the current detection image and the initial state image, and identifying newly-increased defect characteristics caused by the cyclic transmission operation, wherein the newly-increased defect characteristics are used for indicating non-contact type particle defects and contact type mechanical defects; and calculating the image similarity parameter based on the distribution mode of the newly added defect characteristic.
  3. 3. The method of claim 2, wherein said performing a differential pair of the current inspection image and the initial state image to identify a new defect feature caused by the loop-through operation comprises: And identifying the newly added defect characteristic of the current detection image relative to the initial state image by utilizing an automatic defect classification ADC algorithm.
  4. 4. The method of claim 2, wherein the calculating the image similarity parameter based on the distribution pattern of the newly added defect features comprises: And calculating the image similarity parameter based on the distribution density and the weight of the mechanical defects, wherein when the newly added defect features are non-contact particle defects, the image similarity parameter is higher than the similarity threshold.
  5. 5. The method of claim 2, wherein the contact mechanical defect comprises a scratch, a flutter or a punctiform indentation.
  6. 6. The method of claim 1, wherein the current inspection image and the reference image each comprise an edge region of the test wafer, the edge region comprising a peripheral chamfer of the test wafer and an edge exclusion zone of a predetermined width.
  7. 7. The method of testing according to claim 1, further comprising: after determining that the semiconductor device has a contact point abnormality, extracting spatial coordinates of a difference region in the current detection image, which causes a similarity index to be reduced; mapping the spatial coordinates to physical sectors of the test wafer; and determining a component which causes contact point abnormality in the semiconductor device according to the position of the physical sector.
  8. 8. The method of testing according to claim 1, further comprising: And when the image similarity parameter meets the similarity threshold, generating a qualified instruction indicating that the semiconductor equipment meets the production requirement.
  9. 9. The inspection method of claim 1, wherein the cyclical transfer operation is a cold run process performed without turning on a process gas source and a radio frequency power source of an interior chamber of the semiconductor device.
  10. 10. An inspection apparatus of a semiconductor device, characterized in that the inspection apparatus comprises: A control unit configured to control a test wafer to perform at least one cyclic transfer operation in a preset transfer path of a semiconductor device after maintenance of the semiconductor device is completed, the transfer path being for simulating a processing path to bring the test wafer into physical contact with a contact point of the semiconductor device; The first acquisition unit is configured to acquire a current detection image of a target area of the test wafer after the cyclic transmission operation is completed; a second acquisition unit configured to acquire an image similarity parameter between the current detection image and a reference image; and a determining unit configured to determine that the semiconductor device has a contact point abnormality when the image similarity parameter does not satisfy a preset similarity threshold, and generate an abnormality instruction.
  11. 11. A computing device comprising a processor and a memory, the processor configured to execute instructions stored in the memory to implement a method of inspecting a semiconductor device according to any one of claims 1 to 9.
  12. 12. A computer-readable storage medium, on which a computer program is stored, characterized in that the computer program, when being executed by a processor, implements a method of inspecting a semiconductor device according to any one of claims 1 to 9.
  13. 13. A system for inspecting semiconductor devices, the system comprising: a semiconductor device, The image acquisition device is used for acquiring image data before and after the test wafer performs cyclic transmission operation in a preset transmission path of the semiconductor device; And inspection means of the semiconductor device, communicatively coupled to the semiconductor device and the image capture device, configured to perform the method steps of inspecting the semiconductor device according to any one of claims 1 to 9.

Description

Inspection method, inspection device, inspection equipment, inspection system and inspection medium for semiconductor equipment Technical Field The present disclosure relates to the field of semiconductor manufacturing technologies, and in particular, to a method, an apparatus, a device, a system, and a medium for inspecting semiconductor devices. Background In the wafer manufacturing process, the semiconductor devices such as grinding devices, polishing devices, epitaxial growth devices, etc. are inevitably subjected to slight physical drift, abrasion or thermal deformation of the internal mechanical transmission parts (such as an atmospheric robot, a vacuum robot, a wafer stage, etc.) under high load operation, and thus maintenance of the semiconductor devices is generally performed. In equipment maintenance, particularly when internal mechanical transmission components such as Vacuum Robot (Vacuum Robot), atmospheric Robot (ATM Robot), or wafer Transfer Module (Transfer Module) are to be adjusted, an engineer typically needs to perform Robot teaching (Robot Teaching) to calibrate the Transfer coordinates of the wafer. After the maintenance of the semiconductor device is completed, the slight deviation of the internal mechanical transmission components may cause abnormal contact of the wafer during the transmission process, and cause defects such as wafer scratch, pollution and the like. When defects caused by abnormal contact are found to result in reduced wafer quality, the semiconductor devices often have produced a large number of potentially low quality wafers. Meanwhile, the specific abnormal contact point cannot be immediately positioned, so that the timeliness of fault detection is poor and the maintenance cost is high. Therefore, a solution capable of rapidly and accurately locating the abnormal contact point in real time is needed to improve the detection efficiency and the product yield and reduce the maintenance cost. Disclosure of Invention The invention provides a method, a device, equipment, a system and a medium for inspecting semiconductor equipment, which can accurately position an abnormal contact point with a wafer after the semiconductor equipment is maintained, realize the inspection of the maintained semiconductor equipment, improve the detection efficiency and the product yield and reduce the maintenance cost. The technical scheme of the present disclosure is realized as follows: In a first aspect, the present disclosure provides a method of inspecting a semiconductor device, comprising: after the maintenance of the semiconductor equipment is completed, controlling the test wafer to perform at least one cyclic transmission operation in a preset transmission path of the semiconductor equipment, wherein the preset transmission path is used for simulating a processing path so as to enable the test wafer to be in physical contact with a contact point of the semiconductor equipment; After the cyclic transmission operation is completed, acquiring a current detection image of a target area of the test wafer; acquiring an image similarity parameter between a current detection image and a reference image, wherein the reference image comprises an initial state image of a target area acquired before a test wafer performs cyclic transmission operation; when the image similarity parameter does not meet a preset similarity threshold value, determining that the semiconductor device has a contact point abnormality, and generating an abnormality instruction. In a second aspect, the present disclosure provides an inspection apparatus of a semiconductor device, comprising: A control unit configured to control the test wafer to perform at least one cyclic transfer operation in a preset transfer path of the semiconductor device after the maintenance of the semiconductor device is completed, the transfer path being for simulating a processing path to bring the test wafer into physical contact with a contact point of the semiconductor device; the first acquisition unit is configured to acquire a current detection image of a target area of the test wafer after the cyclic transmission operation is completed; a second acquisition unit configured to acquire an image similarity parameter between the current detection image and the reference image; And a determining unit configured to determine that the semiconductor device has a contact point abnormality when the image similarity parameter does not satisfy a preset similarity threshold, and generate an abnormality instruction. In a third aspect, the present disclosure provides a computing device comprising a processor and a memory, the processor configured to execute instructions stored in the memory to implement a method of inspecting a semiconductor device according to the first aspect. In a fourth aspect, the present disclosure provides a computer-readable storage medium, on which a computer program is stored, which computer program, when being executed by