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CN-121978128-A - Wafer infrared detection test equipment

CN121978128ACN 121978128 ACN121978128 ACN 121978128ACN-121978128-A

Abstract

The invention relates to wafer infrared detection test equipment, which comprises a workbench, wherein a driving motor is arranged at the bottom of the workbench, a fixing mechanism is connected with the top of the driving motor in a driving way, an infrared laser detector is arranged at the top of the workbench, the fixing mechanism comprises a connecting seat fixedly arranged at the output end of the driving motor, a base is arranged at the top of the connecting seat, a centering mechanism and a clamping mechanism are arranged in the base, an over-limit protection mechanism is arranged at the end part of the clamping mechanism, the over-limit protection mechanism comprises an air cylinder, a piston rod is connected in the air cylinder in a sliding way, a buffer spring is arranged between the tail end of the piston rod and the inner wall of the air cylinder, a sliding plug is connected in the front end of the piston rod in a sliding way, and hinge plates are respectively hinged at two ends of the sliding plug. The invention realizes the beneficial effects of dual functions of stable adsorption and over-limit emergency protection in the wafer clamping process, thereby effectively avoiding wafer damage while ensuring fastening clamping and ensuring the accuracy and reliability of the subsequent infrared detection result.

Inventors

  • LI JINHONG
  • HUANG RUIQING
  • Su Juncui

Assignees

  • 广东凯威存储技术股份有限公司

Dates

Publication Date
20260505
Application Date
20260202

Claims (8)

  1. 1. The wafer infrared detection test equipment comprises a workbench (1) and is characterized in that a driving motor (3) is arranged at the bottom of the workbench (1), a fixing mechanism (4) is connected with the top of the driving motor (3) in a driving manner, and an infrared laser detector (6) is arranged at the top of the workbench (1); the fixing mechanism (4) comprises a connecting seat (41) fixedly installed at the output end of the driving motor (3), a base (42) is arranged at the top of the connecting seat (41), a centering mechanism (43) and a clamping mechanism (44) are arranged in the base (42), and an over-limit protection mechanism (45) is arranged at the end part of the clamping mechanism (44); The over-limit protection mechanism (45) comprises an air cylinder (451), a piston rod (452) is connected inside the air cylinder (451) in a sliding mode, a buffer spring (453) is arranged between the tail end of the piston rod (452) and the inner wall of the air cylinder (451), a sliding plug (456) is connected inside the front end of the piston rod (452) in a sliding mode, two ends of the sliding plug (456) are respectively hinged with a hinged plate (457), the other end of the hinged plate (457) is hinged with a sucking disc (458), and two ends of the sliding plug (456) are further provided with sealing plates (459) which are connected inside the piston rod (452) in a sliding mode.
  2. 2. The infrared wafer inspection and test apparatus as set forth in claim 1, wherein the over-limit protection mechanism (45) further comprises a trigger cylinder (454) fixedly connected to the top of the clamping mechanism (44), a gravity pressing plate (455) is slidingly connected to the inside of the trigger cylinder (454), a through hole is provided between the trigger cylinder (454) and the air cylinder (451), and an air supply channel is provided in the center of the piston rod (452).
  3. 3. The infrared wafer inspection and test apparatus according to claim 1, wherein the centering mechanism (43) comprises a circular chute (432) formed on the inner side of the base (42), a ball (433) is connected to the circular chute (432) in a rolling manner, a spherical hinge (434) is arranged on the outer side of the ball (433), and an elastic supporting plate (435) is arranged on the other end of the spherical hinge (434).
  4. 4. A wafer infrared detection test apparatus according to claim 3, wherein the inner side of the base (42) is provided with a three-stage conical surface (431), and the conical angle of the upper conical surface is 120 DEG, the conical angle of the middle conical surface is 80 DEG, and the conical angle of the lower conical surface is 60 deg.
  5. 5. The infrared wafer inspection and test equipment according to claim 1, wherein the clamping mechanism (44) comprises a lifting table (441) slidably connected to the center of the base (42), a wedge-shaped pile (442) is arranged at the bottom of the lifting table (441), and a return spring (443) is arranged between the bottom of the lifting table (441) and the base (42).
  6. 6. The infrared wafer inspection and test equipment according to claim 5, wherein the clamping mechanism (44) further comprises a fixed cylinder (445) fixedly connected to the inside of the base (42), a sliding rod (446) is slidably connected to the inside of the fixed cylinder (445), a tension spring (447) is arranged between the sliding rod (446) and the inside of the fixed cylinder (445), two fixing rings (448) are arranged at the front end of the sliding rod (446), an inclined clamping arm (444) is fixedly connected between the two fixing rings (448), and the bottom tail end of the inclined clamping arm (444) abuts against the outer inclined surface of the wedge-shaped pile (442).
  7. 7. The infrared wafer inspection and test equipment according to claim 1, wherein the rear end of the sucker (458) is communicated with the end of the piston rod (452) through a telescopic hose, and the inside of the sucker (458) is of a hollow inflation structure.
  8. 8. The wafer infrared detection test equipment according to claim 1, wherein four balance supporting legs (2) are arranged at the bottom of the workbench (1), a vertical guide rail (5) is arranged at the top of the workbench (1), and an infrared laser detector (6) is arranged on the sliding end face of the vertical guide rail (5).

Description

Wafer infrared detection test equipment Technical Field The invention relates to the technical field of wafer detection, in particular to wafer infrared detection test equipment. Background In the manufacturing process of semiconductor chips, the quality detection of wafers is a key link for guaranteeing the yield of the chips, wherein the infrared detection technology is widely applied to the detection of the problems of surface defects, internal cracks, interlayer structure anomalies and the like of the wafers due to the advantages of non-contact and nondestructive detection. The wafer infrared detection test equipment is used as core detection equipment, the wafer is required to be stably positioned through the fixing mechanism, then the wafer is scanned and detected by the infrared detection module, the performance of the fixing mechanism directly influences the detection precision and the integrity of the wafer, and the wafer infrared detection test equipment is particularly suitable for detection scenes of ultrathin wafers, compound semiconductor wafers and other wafers which are easy to damage. The fixing mechanism of the existing wafer infrared detection test equipment mostly adopts a mechanical clamping type or simple vacuum adsorption type structure. The mechanical clamping structure is folded towards the center through the driving clamp to fix the wafer, and the vacuum adsorption structure is used for fixing the wafer on the bearing table through negative pressure adsorption. However, the above-described existing structure lacks an effective over-limit protection mechanism. Specifically, in the clamping process, the clamping force is extremely easy to be overlarge due to the difference of the thickness of the wafer or the fluctuation of the power output of the driving mechanism, the wafer edge is cracked and the surface is scratched due to rigid extrusion of the mechanical clamping structure, the wafer is possibly deformed due to excessive negative pressure of the vacuum adsorption structure, meanwhile, the existing structure is difficult to maintain a stable fixed state when the clamping force is moderate, the wafer is easy to slip, the wafer is damaged, the positioning deviation of the subsequent infrared detection is caused, the accuracy and the reliability of the detection result are affected, and the requirement of high-precision wafer detection cannot be met. Disclosure of Invention The invention aims to provide wafer infrared detection test equipment, which aims to solve the problems of wafer edge cracking, surface scratch or deformation caused by overlarge clamping force due to lack of an effective over-limit protection mechanism in the prior art. The wafer infrared detection test equipment comprises a workbench, wherein a driving motor is arranged at the bottom of the workbench, a fixing mechanism is connected with the top of the driving motor in a driving way, and an infrared laser detector is arranged at the top of the workbench; The fixing mechanism comprises a connecting seat fixedly installed at the output end of the driving motor, a base is arranged at the top of the connecting seat, a centering mechanism and a clamping mechanism are arranged in the base, and an over-limit protection mechanism is arranged at the end part of the clamping mechanism; The over-limit protection mechanism comprises an air cylinder, a piston rod is connected to the inside of the air cylinder in a sliding manner, a buffer spring is arranged between the tail end of the piston rod and the inner wall of the air cylinder, a sliding plug is connected to the inside of the front end of the piston rod in a sliding manner, two ends of the sliding plug are respectively hinged with a hinged plate, the other end of the hinged plate is hinged with a sucking disc, and two ends of the sliding plug are further provided with sealing plates which are connected to the inside of the piston rod in a sliding manner. As a further description of the above technical solution: the over-limit protection mechanism further comprises a trigger cylinder fixedly connected to the top of the clamping mechanism, a gravity pressing plate is connected inside the trigger cylinder in a sliding mode, a through hole is formed between the trigger cylinder and the air cylinder, and an air supply channel is formed in the center of the piston rod; As a further description of the above technical solution: The centering mechanism comprises a round chute arranged on the inner side of the base, a ball is connected in a rolling manner in the round chute, a spherical hinge is arranged on the outer side of the ball, and an elastic supporting plate is arranged at the other end of the spherical hinge; As a further description of the above technical solution: The inner side of the base is provided with a three-section conical surface, the cone angle of the upper conical surface is 120 degrees, the cone angle of the middle conical surface is 80 degrees, and the