CN-121978210-A - Method, device, medium and program product for detecting defect of glued structure

CN121978210ACN 121978210 ACN121978210 ACN 121978210ACN-121978210-A

Abstract

The invention relates to the technical field of aviation manufacturing, and discloses a defect detection method, device, medium and program product of a cementing structure. The method comprises the steps of obtaining a first depth of an interface between a surface metal skin and a composite material skin in a glue joint structure and a second depth of an interface between the composite material skin and a glue film, calculating echo delay according to the first depth and the second depth, generating a first defect tracking gate and a second defect tracking gate according to the echo delay, and performing defect detection based on the first defect tracking gate and the second defect tracking gate to obtain a defect detection image and obtaining a defect detection result according to the defect detection image. The method comprises the steps of determining corresponding echo delay according to the depth of interfaces between different materials, generating a corresponding defect tracking gate according to the echo delay, extracting effective ultrasonic echo signals, accurately determining the effective interval of ultrasonic reflection signals, and improving the accuracy of defect detection.

Inventors

MENG JIA
XIAO PENG
KONG QINGRU
CHU QIQI
YUAN YUHUI

Assignees

上海飞机制造有限公司

Dates

Publication Date: 20260505
Application Date: 20260212

Claims (10)

1. A defect detection method of a bonded structure, comprising: Acquiring a first depth of an interface between the surface metal skin and the composite material skin in the glued structure and a second depth of an interface between the composite material skin and the glue film; according to the first depth and the second depth, echo delay is calculated, and a first defect tracking gate and a second defect tracking gate are generated according to the echo delay; and performing defect detection based on the first defect tracking gate and the second defect tracking gate to obtain a defect detection image, and obtaining a defect detection result according to the defect detection image.
2. The method of claim 1, wherein calculating an echo delay from the first depth and the second depth comprises: Acquiring a first sound velocity corresponding to the surface metal skin and a second sound velocity corresponding to the composite material skin; And calculating echo delay according to the first depth, the second depth, the first sound velocity and the second sound velocity.
3. The method of claim 2, wherein calculating an echo delay from the first depth, the second depth, the first speed of sound, and the second speed of sound comprises: Calculating a depth difference between the second depth and the first depth; calculating to obtain a first delay according to the first depth and the first sound velocity, and calculating to obtain a second delay according to the depth difference and the second sound velocity; and calculating the echo delay according to the first delay and the second delay.
4. The method of claim 1, wherein generating a first defect tracking gate and a second defect tracking gate based on the echo delay comprises: Acquiring the thickness of a honeycomb layer in the cementing structure and a third sound velocity corresponding to the honeycomb layer; and calculating a propagation time length according to the thickness and the third sound velocity, and generating the first defect tracking gate and the second defect tracking gate according to the echo time delay and the propagation time length.
5. The method of claim 1, wherein performing defect detection based on the first defect tracking gate and the second defect tracking gate to obtain a defect detection image comprises: Acquiring initial ultrasonic echo signals corresponding to each detection position of the cementing structure through a low-frequency ultrasonic probe; Analyzing the initial ultrasonic echo signals based on the first defect tracking gate and the second defect tracking gate to obtain signal analysis results corresponding to the detection positions, and generating the defect detection image according to the signal analysis results.
6. The method of claim 5, wherein analyzing the initial ultrasonic echo signal based on the first and second defect tracking gates to obtain a signal analysis corresponding to each of the inspection locations comprises: performing sparsification treatment on the initial ultrasonic echo signal to obtain a target ultrasonic echo signal; Extracting a first ultrasonic echo signal corresponding to the first defect tracking gate and a second ultrasonic echo signal corresponding to the second defect tracking gate from the target ultrasonic echo signal; Comparing the first ultrasonic echo signal with the first defect tracking gate in amplitude to obtain a first analysis result, and comparing the second ultrasonic echo signal with the second defect tracking gate in amplitude to obtain a second analysis result; And acquiring the signal analysis result according to the first analysis result and the second analysis result.
7. The method of claim 6, wherein comparing the first ultrasonic echo signal to the first defect tracking gate in magnitude to obtain a first analysis result comprises: judging whether a candidate wave crest with the amplitude larger than that of the first defect tracking gate exists in the first ultrasonic echo signal, if so, determining a target wave crest in the candidate wave crest; And acquiring a target moment corresponding to the target wave crest, and acquiring a first analysis result according to the target moment.
8. An electronic device, the electronic device comprising: At least one processor, and A memory communicatively coupled to the at least one processor, wherein, The memory stores a computer program executable by the at least one processor to enable the at least one processor to perform the defect detection method of the bonded structure of any one of claims 1-7.
9. A computer readable storage medium, characterized in that the computer readable storage medium stores a computer program for causing a processor to execute the defect detection method of the bonded structure according to any one of claims 1-7.
10. A computer program product comprising a computer program which, when executed by a processor, implements the method of defect detection of a glued structure according to any of claims 1-7.

Description

Method, device, medium and program product for detecting defect of glued structure Technical Field The present invention relates to the field of aerospace manufacturing technologies, and in particular, to a method, an apparatus, a medium, and a program product for detecting defects in a bonded structure. Background The metal-composite-honeycomb adhesive joint structure is a typical aviation component, has strong impact damage resistance, is widely used in the front edge area of an airplane, and is used for transmitting pneumatic load, resisting external impact, protecting internal pipeline circuits and the like. However, the structure has complex process and is easy to generate layering and debonding defects in the manufacturing process. At present, the existing defect detection method of the adhesive joint structure generally adopts an ultrasonic detection method, and the defect detection is realized by carrying out signal analysis on ultrasonic reflection signals. However, the bonding structure is a sandwich structure formed by bonding a plurality of materials according to a specific sequence, so that interfaces among different materials are more, an ultrasonic reflection signal has a certain time delay, an effective interval of the ultrasonic reflection signal is difficult to determine, and further the defect detection accuracy is low. Disclosure of Invention The invention provides a defect detection method, device, medium and program product of a cementing structure, which can realize the accurate determination of the effective interval of ultrasonic reflection signals and can improve the accuracy of defect detection. According to an aspect of the present invention, there is provided a defect detection method of a bonded structure, including: Acquiring a first depth of an interface between the surface metal skin and the composite material skin in the glued structure and a second depth of an interface between the composite material skin and the glue film; according to the first depth and the second depth, echo delay is calculated, and a first defect tracking gate and a second defect tracking gate are generated according to the echo delay; and performing defect detection based on the first defect tracking gate and the second defect tracking gate to obtain a defect detection image, and obtaining a defect detection result according to the defect detection image. According to another aspect of the present invention, there is provided a defect detecting device of a bonded structure, including: the depth acquisition module is used for acquiring a first depth of an interface between the surface metal skin and the composite material skin in the glued structure and a second depth of an interface between the composite material skin and the adhesive film; The gate generation module is used for calculating echo delay according to the first depth and the second depth and generating a first defect tracking gate and a second defect tracking gate according to the echo delay; And the result acquisition module is used for carrying out defect detection based on the first defect tracking gate and the second defect tracking gate so as to acquire a defect detection image and acquiring a defect detection result according to the defect detection image. According to another aspect of the present invention, there is provided an electronic apparatus including: at least one processor, and A memory communicatively coupled to the at least one processor, wherein, The memory stores a computer program executable by the at least one processor to enable the at least one processor to perform the method of defect detection of a bonded structure according to any one of the embodiments of the present invention. According to another aspect of the present invention, there is provided a computer readable storage medium storing a computer program for causing a processor to execute the defect detection method of the bonded structure according to any embodiment of the present invention. According to another aspect of the invention, there is provided a computer program product comprising a computer program which, when executed by a processor, implements the method for defect detection of a glued joint according to any of the embodiments of the invention. According to the technical scheme, a first depth of an interface between a surface metal skin and a composite material skin in a glue joint structure and a second depth of an interface between the composite material skin and a glue film are obtained, echo delay is calculated according to the first depth and the second depth, a first defect tracking gate and a second defect tracking gate are generated according to the echo delay, defect detection is conducted on the basis of the first defect tracking gate and the second defect tracking gate to obtain a defect detection image, a defect detection result is obtained according to the defect detection image, corresponding echo delay is determined accordin