Search

CN-121978374-A - MEMS probe device

CN121978374ACN 121978374 ACN121978374 ACN 121978374ACN-121978374-A

Abstract

The invention belongs to the technical field of wafer detection equipment, and particularly relates to an MEMS probe device. The MEMS probe device comprises a probe, a first guide plate, a second guide plate and a multilayer organic substrate, wherein the probe comprises a needle head, a main body and a needle tail, the first guide plate is provided with a first penetrating hole, the second guide plate is provided with a second penetrating hole, the main body sequentially penetrates through the first penetrating hole and the second penetrating hole along a preset direction, the needle head is used for butt joint of a wafer, the needle tail is in butt joint with the multilayer organic substrate, the main body is provided with an elastic arm and a containing notch, the containing notch is opposite to the first penetrating hole, the elastic arm extends along the preset direction and is fixed in the containing notch, the elastic arm is provided with a supporting end, the elastic arm can elastically deform towards one side close to the main body, and the supporting end stretches out of the peripheral wall of the main body and is in butt joint with the wall of the first penetrating hole, so that one end of the main body, which is far away from the elastic arm, is in butt joint with the wall of the first penetrating hole.

Inventors

  • YIN LANYONG
  • LI HONGPENG
  • LIU KAI
  • SHI YUANJUN

Assignees

  • 苏州晶晟微纳半导体科技有限公司

Dates

Publication Date
20260505
Application Date
20260129

Claims (10)

  1. A mems probe device comprising: a probe (300), the probe (300) comprising a needle head (320), a main body (310) and a needle tail (330) connected in sequence; The wafer butt joint device comprises a first guide plate (100) and a second guide plate (200) which are sequentially arranged along a preset direction, wherein the first guide plate (100) is provided with a first penetrating hole (110) which extends along the preset direction, the second guide plate (200) is provided with a second penetrating hole (210) which extends along the preset direction, a main body (310) sequentially penetrates through the first penetrating hole (110) and the second penetrating hole (210) along the preset direction, and a needle head (320) is used for butt joint of a wafer (2000); A multi-layered organic substrate (400) disposed at an end of the first guide plate (100) remote from the second guide plate (200), the pin tail (330) configured to interface with the multi-layered organic substrate (400); The main part (310) has elastic arm (311) and holds breach (312), hold breach (312) with first hole (110) just face, elastic arm (311) are followed preset direction extends and fixes in holding breach (312), elastic arm (311) have the supporting end, elastic arm (311) can be towards being close to one side elastic deformation of main part (310), the supporting end stretches out the peripheral wall of main part (310) and with the pore wall butt of first hole (110) is worn, so that main part (310) keep away from one end of elastic arm (311) with the pore wall butt of first hole (110) is worn.
  2. 2. The MEMS probe device according to claim 1, wherein the receiving recess (312) comprises two groove walls disposed opposite each other in the predetermined direction, and a groove bottom disposed between the two groove walls, wherein the elastic arm (311) is fixedly connected to the groove walls, and a gap is formed between the elastic arm (311) and the groove bottom.
  3. 3. The MEMS probe device according to claim 2, wherein the elastic arm (311) has a first extension protrusion (3111), the first extension protrusion (3111) being located at an end of the elastic arm (311) away from the bottom of the groove, an axial end of the elastic arm (311) being fixedly connected to the one of the two groove walls that is closer to the needle (320), the first extension protrusion (3111) being located at an end of the elastic arm (311) that is closer to the needle tail (330) in the predetermined direction, the first extension protrusion (3111) being the support end.
  4. 4. A MEMS probe device according to claim 3, wherein the bump height of the first epitaxial bump (3111) gradually increases while extending in the predetermined direction from an end closer to the needle (320) toward a direction closer to the needle tail (330).
  5. 5. A MEMS probe device according to claim 3, wherein in a state in which the elastic arm (311) is not elastically deformed, the first epitaxial protrusion (3111) protrudes beyond the body (310) by a distance K, the vertical distance between the elastic arm (311) and the groove bottom being M, the K being smaller than the M.
  6. 6. The MEMS probe device according to claim 2, wherein the two ends of the elastic arm (311) along the predetermined direction are fixedly connected to the groove wall, respectively, a second extension protrusion (3112) is provided at a center position of the elastic arm (311) along the predetermined direction, the second extension protrusion (3112) protrudes away from the groove bottom, the second extension protrusion (3112) is capable of elastically deforming toward an end near the groove bottom, and the second extension protrusion (3112) serves as the supporting end.
  7. 7. The MEMS probe device according to claim 1, wherein the diameter of the needle (320) gradually decreases while extending in the predetermined direction from an end proximal to the tail (330) toward the direction proximal to the needle (320).
  8. 8. The MEMS probe device according to claim 1, wherein the diameter of the needle tail (330) gradually decreases while extending in the predetermined direction from an end proximal to the needle head (320) toward the end proximal to the needle tail (330).
  9. 9. MEMS probe device according to claim 1, characterized in that the peripheral wall of the body (310) is provided with an abutment boss (313), said abutment boss (313) being able to abut against the first guide plate (100) along the preset direction.
  10. 10. The MEMS probe device according to claim 1, wherein the MEMS probe device has a plurality of the probes (300) and a plurality of the multilayer organic substrates (400), the first guide plate (100) is provided with a plurality of the first through holes (110), the second guide plate (200) is provided with a plurality of the second through holes (210), and each of the probes (300) is disposed corresponding to one of the multilayer organic substrates (400), one of the first through holes (110), and one of the second through holes (210).

Description

MEMS probe device Technical Field The invention relates to the technical field of wafer detection equipment, in particular to an MEMS probe device. Background MEMS is an abbreviation of Micro Electro MECHANICAL SYSTEMS (Micro Electro mechanical system), which is a generic term for systems that process various input and output signals. In the process of preparing the wafer, the MEMS probe card is used for wafer detection to judge whether the chip on the wafer is good or not. In the related art, as shown in fig. 1, the existing MEMS probe card includes an existing MLO (Multi Layer Organic, multi-layer organic) substrate 1, an existing upper guide plate 2, an existing lower guide plate 3, and an existing probe 4, and the tip of the existing probe 4 sequentially passes through the existing upper guide plate 2 and the existing lower guide plate 3 and then abuts against the wafer 2000, and the existing MLO substrate 1 abuts against the tip of the existing probe 4 to realize the detection of the wafer 2000. As shown in fig. 2, when the wafer 2000 is lifted, the wafer 2000 elastically deforms the existing probe 4, and at this time, the needle of the existing probe 4 can be bent to a designated direction by controlling the offset direction of the existing lower guide plate 3. During the elastic deformation of the existing probe 4, the needle tail of the existing probe 4 may be offset with respect to the existing MLO substrate 1. Because the pad area on the existing MLO substrate 1 is smaller, and the tail of the existing probe 4 easily slides to the edge of the pad or slides out of the pad area in combination with the influence of assembly tolerance and temperature, the connection instability conditions such as needle burning, no signal and the like occur. The prior practice is to reduce the hole gap between the prior probe 4 and the prior upper guide plate 2 and limit the movement range of the needle tail. However, the existing probe 4 is tightly abutted against the existing upper guide plate 2, so that the friction force between the existing probe 4 and the existing upper guide plate 2 is increased, the abutting force between the existing probe 4 and the existing MLO substrate 1 is reduced, the problem of needle clamping even occurs, and the risk of poor contact is increased. Accordingly, there is a need for an inventive MEMS probe device to solve the above-described problems. Disclosure of Invention The invention aims to provide a MEMS probe device, which is used for realizing stable connection of a probe and a multilayer organic substrate and wafer and reducing the offset range of the tail of the probe relative to the multilayer organic substrate. To achieve the purpose, the invention adopts the following technical scheme: A MEMS probe device comprising: The probe comprises a needle head, a main body and a needle tail which are sequentially connected; The wafer butt joint device comprises a first guide plate and a second guide plate which are sequentially arranged along a preset direction, wherein the first guide plate is provided with a first penetrating hole which extends along the preset direction, the second guide plate is provided with a second penetrating hole which extends along the preset direction, the main body sequentially penetrates through the first penetrating hole and the second penetrating hole along the preset direction, and the needle head is used for butt joint of a wafer; a multi-layer organic substrate disposed at an end of the first guide plate remote from the second guide plate, the pin tail configured to interface with the multi-layer organic substrate; The main part has elastic arm and holds the breach, hold the breach with first wearing to establish the hole just, the elastic arm is followed the direction of predetermineeing extends and fixes hold in the breach, the elastic arm has the support end, the elastic arm can be towards being close to one side elastic deformation of main part, the support end stretches out the peripheral wall of main part and with the pore wall butt in first wearing to establish the hole, so that the main part is kept away from the one end of elastic arm with the pore wall butt in first wearing to establish the hole. As an alternative, the accommodating notch comprises two groove walls and a groove bottom, the two groove walls are sequentially arranged in a relative mode along the preset direction, the groove bottom is located between the two groove walls, the elastic arm is fixedly connected with the groove walls, and a gap exists between the elastic arm and the groove bottom. As an alternative, the elastic arm has a first extension protrusion, the first extension protrusion is located at one end of the elastic arm away from the groove bottom, one axial end of the elastic arm is fixedly connected with two groove walls, which are close to the needle, of the groove walls, the first extension protrusion is located at one end of the elastic arm, which is close to