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CN-121978375-A - Full-automatic high-precision probe station

CN121978375ACN 121978375 ACN121978375 ACN 121978375ACN-121978375-A

Abstract

The invention relates to the technical field of semiconductor test equipment, in particular to a full-automatic high-precision probe station, which utilizes multi-physical field coupling sensing and compensation to remarkably improve positioning precision, wherein multi-physical field data such as a temperature field, a stress field and the like are comprehensively acquired, a coupling algorithm is combined to optimize a compensation strategy, multi-factor interference is effectively counteracted, positioning repetition precision can reach +/-0.05 mu m, the test requirement of an advanced semiconductor technology is met, a dynamic three-dimensional modeling technology is adopted, dynamic adaptability is enhanced, a dynamic three-dimensional modeling system with the size influenced by the multi-physical field data can update a test target form in real time, test deviation caused by target deviation or surface fluctuation is avoided, and the adaptation capability of the equipment to complex test scenes is improved. The automatic test device has high degree of automation, improves the test efficiency, can complete the whole flow of data acquisition, modeling, compensation and test without manual intervention, simplifies the calibration flow, shortens the test period and is suitable for batch detection scenes.

Inventors

  • LIN BANGYU
  • DU ZHENYONG

Assignees

  • 立川(无锡)半导体设备有限公司

Dates

Publication Date
20260505
Application Date
20260407

Claims (6)

  1. 1. The full-automatic high-precision probe station is characterized by comprising a multi-physical-field data acquisition module, a dynamic three-dimensional modeling system, an intelligent compensation unit, a high-precision motion control module and a central control module; the multi-physical-field data acquisition module comprises a temperature sensor, a stress sensor and a temperature sensor, which are respectively used for acquiring parameters of temperature field, stress field and environmental temperature data; The dynamic three-dimensional modeling system acquires original image data of a test target, and rebuilds the influence size of the multi-physical-field data through a coupling algorithm model of the influence size of the multi-physical-field data acquisition module; the intelligent compensation unit is internally provided with a multi-physical field coupling algorithm, receives real-time data of a multi-physical field data acquisition module and model parameters of a dynamic three-dimensional modeling system, and generates a targeted compensation instruction by combining, calibrating and fusing key parameters through weighting coefficients; The high-precision motion control module comprises a linear motor four-axis motion platform and a probe driving unit, receives a compensation instruction of the intelligent compensation unit, drives the probe to complete positioning and testing actions, and the positioning repetition precision is not lower than +/-0.05 mu m; The central control module is used for coordinating the data interaction and working time sequence of each module, storing test data and modeling results, and supporting data export and visual display.
  2. 2. The full-automatic high-precision probe station according to claim 1, wherein the length deformation of the part is set as ΔL=L 0 α L （T-T 0 ）+ L 0 σ/E (1), Wherein the equation of influence of temperature field on the size is DeltaL W =L 0 α L （T-T 0 ), the influence of the characteristic temperature change on the critical part size is represented, L 0 is the critical part length, alpha L is the critical part thermal expansion coefficient, T is the real-time temperature, T 0 is the environment temperature, the equation of influence of stress field on the size is DeltaL f =L 0 sigma/E, the influence of vibration on the critical part size is represented, sigma is the critical part stress, E is the elastic modulus, in the dynamic three-dimensional modeling system, the thermal expansion and contraction size after the temperature change is superimposed on the design size at normal temperature is represented, a dynamically updated test target three-dimensional model is constructed, the model size is updated by adopting the formula (1), and the dynamic three-dimensional modeling system integrates a high-definition industrial camera and a laser ranging unit, and the modeling error is smaller than 0.1 mu m.
  3. 3. The fully automated high precision probe station of claim 1, wherein the workflow of the dynamic three-dimensional modeling system is: (1) Synchronously acquiring surface images and distance data of a test target by using a high-definition industrial camera and a laser ranging unit; (2) Updating the original data by using a coupling algorithm model with the size influenced by the data parameters of the multiple physical fields, and driving an updating model by using the size; (3) Based on the contact state of the probe and the target in the test process, the three-dimensional model is updated every 5ms, and the consistency of the model and the actual target is ensured.
  4. 4. The fully automated high precision probe station of claim 1, wherein the multiphysics field coupling algorithm comprises the steps of: (1) Preprocessing the collected multi-physical field data, removing abnormal values and carrying out standardized processing, wherein if a certain sensor data has a large unreasonable mutation, the abnormal data is considered, and the specific values can be determined according to the data in the testing process of a prototype; (2) Determining key influence parameters through a probe station working state model, searching for optimal parameter values and corresponding weighting coefficient combinations, and directly driving the three-dimensional model size to change by the obtained sensor parameters; (3) And adjusting the weighting coefficient in real time according to the morphological change of the dynamic three-dimensional model to generate a dynamic compensation strategy, wherein compensation driving is carried out through an algorithm according to the dynamic correction size and the reference dynamic size of the three-dimensional model, and the high-precision motion control module is started to finely adjust and calibrate.
  5. 5. The full-automatic high-precision probe station according to claim 1, wherein the intelligent compensation unit further comprises a self-learning module, and the compensation precision is improved by accumulating test data under different working conditions, optimizing the parameter mapping relation of the multi-physical field coupling algorithm.
  6. 6. The full-automatic high-precision probe station according to claim 1, wherein the high-precision motion control module is internally provided with a grating ruler feedback unit, acquires displacement data of a motion platform in real time, and forms closed-loop control with an intelligent compensation instruction.

Description

Full-automatic high-precision probe station Technical Field The invention relates to the technical field of semiconductor test equipment, in particular to a full-automatic high-precision probe station. Background The wafer probe station is key equipment in the semiconductor manufacturing process, is mainly used for electrical property testing before chip cutting and packaging, and directly influences the production quality and efficiency of chips by leading probes to contact with wafer test points to acquire electrical property data. Along with the development of the semiconductor technology to the 3D packaging and heterogeneous integration, the wafer size is continuously increased, the circuit density is continuously improved, and higher requirements are provided for the positioning precision and the test stability of the probe station. The existing full-automatic probe station adopts a high-precision moving platform, but has the defects that firstly, the moving platform, an optical component, a grating ruler base and other components deform due to factors such as environmental temperature change, equipment operation heating and the like to form multiple physical field coupling interference such as a temperature field, a stress field and the like to influence the positioning precision of a probe, secondly, the existing calibration method relies on a laser interferometer, has the defects of complex erection, long time consumption and incapability of updating calibration data in real time, thirdly, lacks dynamic perception of a form of a test target, is difficult to cope with test deviation caused by fluctuation or position deviation of the target surface, and fourthly, the single physical field data acquisition and compensation mode cannot fully mine internal association of data of each physical field, so that information loss and inaccurate compensation are easily caused. Disclosure of Invention In order to solve the technical problems, the invention provides a full-automatic high-precision probe station, which is based on intelligent compensation and dynamic three-dimensional modeling of multi-physical field coupling, solves the technical problems of easy interference, complex calibration, poor dynamic suitability and the like of the existing probe station, and improves the test precision and stability of the probe station. The technical scheme is that the full-automatic high-precision probe station is characterized by comprising a multi-physical-field data acquisition module, a dynamic three-dimensional modeling system, an intelligent compensation unit, a high-precision motion control module and a central control module; the multi-physical-field data acquisition module comprises a temperature sensor, a stress sensor and a temperature sensor, which are respectively used for acquiring parameters of temperature field, stress field and environmental temperature data; The dynamic three-dimensional modeling system acquires original image data of a test target, and rebuilds the influence size of the multi-physical-field data through a coupling algorithm model of the influence size of the multi-physical-field data acquisition module; the intelligent compensation unit is internally provided with a multi-physical field coupling algorithm, receives real-time data of a multi-physical field data acquisition module and model parameters of a dynamic three-dimensional modeling system, and generates a targeted compensation instruction by combining, calibrating and fusing key parameters through weighting coefficients; The high-precision motion control module comprises a linear motor four-axis motion platform and a probe driving unit, receives a compensation instruction of the intelligent compensation unit, drives the probe to complete positioning and testing actions, and the positioning repetition precision is not lower than +/-0.05 mu m; The central control module is used for coordinating the data interaction and working time sequence of each module, storing test data and modeling results, and supporting data export and visual display. It is further characterized in that the length deformation of the part is set as ΔL=L0αL（T-T0）+ L0σ/E (1), The method comprises the steps of (1) constructing a dynamically updated test target three-dimensional model by designing a thermal expansion and contraction size after temperature change in a dynamic three-dimensional modeling system, updating the model size by adopting a formula, wherein an influence equation of a temperature field on the size is delta L W=L0αL（T-T0), representing the influence of temperature change on the critical part size, L 0 is the critical part length, alpha L is the critical part thermal expansion coefficient, T is real-time temperature, T 0 is ambient temperature, an influence equation of a stress field on the size is delta L f=L0 sigma/E, representing the influence of vibration on the critical part size, sigma is critical part stress and E is elastic modulu