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CN-121978504-A - CSP (chip size package) packaged chip testing equipment

CN121978504ACN 121978504 ACN121978504 ACN 121978504ACN-121978504-A

Abstract

The invention relates to the technical field of chip testing, and discloses CSP packaging chip testing equipment which comprises a processing bin, wherein a conveyor is arranged in the processing bin, an operation table is arranged at the tail end of the conveyor, and a lifting table is arranged at the top end of the operation table. The CSP packaging chip testing equipment relies on the detection of the spiral moving track on the surface of a solder ball, greatly improves the detection accuracy, drives a semicircular straight gear to form a motion mode of self rotation and revolution around a shaft through a composite transmission structure of a spherical transposition assembly, drives a probe assembly to move along the spiral track on the outer spherical surface of the solder ball, thoroughly breaks through the single detection limitation of vertical contact of traditional equipment, can effectively avoid the problem of unstable electrical connection caused by the local oxide layer of the solder ball, fully covers the detection point position on the surface of the solder ball, obviously reduces the misjudgment risk of chip performance caused by misjudgment of single-point contact, and accurately restores the real electrical performance state of the chip.

Inventors

  • CAO YIXIN
  • MAO JUNJIE
  • LU HONGFENG
  • FAN JIAWEN
  • ZHOU DONGFENG

Assignees

  • 苏州光寰智封半导体设备有限公司

Dates

Publication Date
20260505
Application Date
20260202

Claims (7)

  1. The CSP packaging chip testing equipment comprises a processing bin (1) and is characterized in that a conveyor (2) is arranged in the processing bin (1), an operation table (201) is arranged at the tail end of the conveyor (2), a lifting table (3) is arranged at the top end of the operation table (201), a spherical transposition assembly (4) is integrated in the lifting table (3), a probe assembly (6) for testing solder ball contact is arranged in the spherical transposition assembly (4), the spherical transposition assembly (4) can drive the probe assembly (6) to spirally move on the outer spherical surface of the solder ball, an adjacent station transposition contact linkage assembly (5) is arranged in the spherical transposition assembly (4) at one side of the probe assembly (6), and the adjacent station transposition contact linkage assembly (5) can drive the probe assembly (6) to obliquely descend to contact the solder ball of the adjacent station; the spherical transposition assembly (4) comprises a plurality of groups of first spherical transposition assemblies (403) with the same structure, the first spherical transposition assemblies (403) comprise first bevel gears (4031), one side below each first bevel gear (4031) is meshed with a second bevel gear (4034), the center position of each second bevel gear (4034) is connected with a transmission gear (4035) positioned inside the corresponding retainer (4032) through a shaft, the transmission gears (4035) are meshed with semicircular straight gears (4033) positioned below the inner part of the corresponding retainer (4032), and the adjacent station transposition contact linkage assemblies (5) and the probe assemblies (6) are installed on the inner sides of the semicircular straight gears (4033); Adjacent station transposition contact linkage subassembly (5) are including second helical gear (503), and second helical gear (503) one side is provided with mount (504), mount (504) one end is connected with arc gear (505), and arc gear (505) one side meshing has pinion (506), pinion (506) front side is connected with gear wheel (507) through the axle, gear wheel (507) are located swivel mount (510) inboard, and gear wheel (507) and lift slider (508) meshing drive its lift, lift slider (508) drive lift inner tube (604) go up and down, and three contact spring probes (607) with solder ball contact are installed to the bottom of lift inner tube (604).
  2. 2. The CSP packaged chip testing apparatus according to claim 1, wherein an XY axis moving rail (202) is installed above the operation table (201), a clamp for fixing a chip carrier tray is installed on the XY axis moving rail (202), a transplanting mechanism (203) is installed between the conveyor (2) and the operation table (201), the transplanting mechanism (203) is used for conveying the chip carrier tray conveyed on the conveyor (2) onto the XY axis moving rail (202), the XY axis moving rail (202) is composed of two groups of lead screws corresponding to an X axis and a Y axis respectively, and the matching carrier tray is moved linearly through the XY axis to adjust the position.
  3. 3. The CSP packaged chip testing device according to claim 1, wherein the spherical transposition assembly (4) comprises a motor (401), the output end of the motor (401) is connected with a synchronous belt pulley group (402), the first spherical transposition assembly (403) is located below the synchronous belt pulley group (402), the retainer (4032) is located below the middle position of the first bevel gear (4031), the transmission gear (4035) is located inside the retainer (4032) to rotate, the second bevel gear (4034) is located on one side of the retainer (4032), the semicircular spur gear (4033) is located below the inside of the retainer (4032) to rotate, the synchronous belt pulley group (402) comprises a plurality of multi-groove pulleys and belts wound on the outer side, and the number of the multi-groove pulleys is matched with that of the first spherical transposition assembly (403), so that synchronous operation of a plurality of groups of first spherical transposition assemblies (403) is realized.
  4. 4. The CSP packaging chip testing apparatus according to claim 1, wherein the adjacent station transposition contact linkage assembly (5) includes a driving motor (501), and an output end of the driving motor (501) is connected with a first bevel gear (502), and the first bevel gear (502) is meshed with a second bevel gear (503), the second bevel gear (503) penetrates through a fixing frame (504) through a shaft and is connected with a rotating frame (510), and the rotating frame (510) is connected with a slide rail (509) through a fixing cylinder (601), the lifting slider (508) moves inside the slide rail (509), and the lifting slider (508) includes a wedge portion, a rack portion and a connecting portion, the rack is meshed with a large gear (507) and is arranged on one side of the wedge portion, and the connecting portion is fixed on the rear side of the wedge portion and penetrates through the fixing cylinder (601) to be connected with a lifting inner cylinder (604), and the wedge portion is in contact fit with the slide rail (509).
  5. 5. The CSP packaged chip testing apparatus according to claim 1, wherein the probe assembly (6) comprises a fixed cylinder (601), a spring (603) is connected inside the fixed cylinder (601), the spring (603) is penetrated by a lifting inner cylinder (604), a worm (605) is connected to the bottom end of the lifting inner cylinder (604), and the three-contact spring probe (607) is installed below the worm (605).
  6. 6. The CSP packaged chip testing apparatus according to claim 5, wherein the outer side of the fixed cylinder (601) is connected with a hinge base (602), the inside of the hinge base (602) is hinged with three groups of hinge claws (606), the hinge claws (606) comprise worm wheels (6061) and cleaning blocks (6062), the head parts of the worm wheels (6061) are meshed with the worm (605), the cleaning blocks (6062) are located on the inner side of the tail parts of the hinge claws (606), grooves are formed in the outer side of the fixed cylinder (601), and the hinge claws (606) move in the grooves.
  7. 7. The CSP packaged chip test apparatus according to claim 6, wherein the number of the three-contact spring probes (607) is three, and the three sets of the three-contact spring probes (607) are respectively contacted with the three sets of cleaning blocks (6062).

Description

CSP (chip size package) packaged chip testing equipment Technical Field The invention relates to the technical field of chip testing, in particular to CSP (chip scale package) packaged chip testing equipment. Background CSP (CHIP SCALE PACKAGE, chip level package) is a miniature packaging technology with package size close to chip core size, has the characteristics of small volume, low power consumption and excellent electrical performance, is widely applied to the fields of consumer electronics, communication, automobile electronics and the like, CSP package chip test equipment is key equipment for guaranteeing the factory yield and performance compliance of the chip, and the core function is to verify the electrical performance, functional integrity and reliability of the chip after penetrating through the finished product test link after chip package. The utility model discloses a CN117554788B, a chip packaging test equipment is provided, relate to chip technical field, including the loading tray, the detection subassembly, feeding subassembly, bottom plate and unloading subassembly, three detection grooves have been seted up on the loading tray, all be provided with in every detection groove and block the subassembly, feeding subassembly is arranged in sending the chip to the detection groove, it is used for spacing to the chip to block the subassembly, the detection subassembly is used for testing the chip, loading tray middle part fixedly connected with transmission cover, loading tray bottom fixedly connected with two bracing pieces, the annular has been seted up on the bottom plate, the bracing piece slides and sets up in the annular, bottom plate middle part fixedly connected with first electric telescopic handle, first electric telescopic handle tip fixedly connected with push rod, the push rod runs through the transmission cover, the push rod top links to each other with detection subassembly, can realize the automatic unloading of chip, material loading and detection work, improve detection efficiency. In the prior art, although automatic feeding and discharging and detection operations of chips can be realized, an obvious function short board still exists, the multi-angle and multi-dimensional comprehensive detection capability of CSP packaging chip tin balls is not realized, the single detection mode of vertically contacting the tin balls by probes is generally adopted by the current equipment, the probes are vertically arranged right above the tin balls and can only finish contact detection at the vertical angle, once an oxidation layer exists at the contact point of the tin balls, the probes cannot establish stable electrical connection with a tin ball body, the true performance state of the chips is difficult to accurately judge, in addition, the damage problem in the chip detection process can also be caused by multiple loss faults of the probes, such as surface pollution caused by contact of the probes with the tin balls, namely, pollutants such as soldering tin particles, oxidation chips and the like are easy to adhere when the probes contact with different chip tin balls, the pollutants can form an insulating layer at the tip of the probes to cause abnormal increase of the subsequently detected contact resistance, signal misjudgment is also possible to cause damage to the surface integrity of the tin balls, and the probe damage judging mechanism in the prior art has obvious hysteresis, the probe judging mechanism is usually difficult to accurately judge the real performance state of the chips by continuously passing through a plurality of chips, and the corresponding stations are difficult to judge that the chip is difficult to be judged in time, and the production is difficult to be judged, and bad quality is not judged. Therefore, there is a need to develop a CSP package chip testing device, which is used for improving the single vertical probe contact mode, and the defects of probe pollution and damage hysteresis determination of the existing CSP package chip testing device, so as to solve the problems of bad contact and erroneous test caused by the solder ball oxide layer, self pollution and secondary pollution of solder balls caused by the adhesion of solder particles and oxidized scraps of the probe, failure in timely identifying the probe loss, and the like, which cause the batch erroneous judgment loss of chips. Disclosure of Invention The invention aims to provide CSP packaged chip testing equipment for solving the problems in the background technology. In order to solve the technical problems, the CSP packaging chip testing equipment comprises a processing bin, wherein a conveyor is arranged in the processing bin, an operation table is arranged at the tail end of the conveyor, a lifting table is arranged at the top end of the operation table, a spherical transposition assembly is integrated in the lifting table, a probe assembly for testing contact with a solder ball is arrang