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CN-121978507-A - On-line monitoring system and method for operation parameters of integrated circuit chip

CN121978507ACN 121978507 ACN121978507 ACN 121978507ACN-121978507-A

Abstract

The application provides an integrated circuit chip operation parameter on-line monitoring system and method, which relate to the technical field of chip function test, and are characterized in that functional test excitation which does not affect the main function of a chip to be tested is applied when the chip to be tested is operated, failure recognition is carried out on heat distribution information to obtain thermal fatigue characteristics of the chip to be tested in an uneven heat dissipation state, the health sensitivity of the chip to be tested in the current heat dissipation state is determined by the thermal fatigue characteristics, the working state index on a test operation pin is determined according to a current test signal, defect fitting is carried out on the working state index and the health sensitivity to obtain a function retention value of the chip to be tested in the current operation state, and monitoring and judging are carried out on the current function state of the chip to be tested according to the function retention value. The application can carry out fusion monitoring on the thermal characteristics and the electrical characteristics of the chip on the premise of not interfering the operation of the main function of the chip to be detected, so as to improve the reliability of judging the operation state of the chip.

Inventors

  • TIAN HONGFEI

Assignees

  • 深圳瀚博微科技有限公司

Dates

Publication Date
20260505
Application Date
20260323

Claims (10)

  1. 1. An on-line monitoring method for operating parameters of an integrated circuit chip is characterized by comprising the following steps: Applying functional test excitation which does not affect the main function of the chip to be tested when the chip to be tested runs, and synchronously collecting excitation response signals generated by the chip to be tested under the functional test excitation; Determining heat distribution information of the chip when the operating temperature changes according to the excitation response signals, performing failure recognition on the heat distribution information to obtain thermal fatigue characteristics of the chip to be tested in an uneven heat dissipation state, and further determining health sensitivity of the chip to be tested in a current heat dissipation state according to the thermal fatigue characteristics; Acquiring a current test signal flowing through a specified path in a chip to be tested, determining a working state index on a test operation pin according to the current test signal, and performing defect fitting on the working state index and the health sensitivity to obtain a function retention value of the chip to be tested in a current operation state; and monitoring and judging the current functional state of the chip to be tested according to the functional retention value, and outputting a judging result.
  2. 2. The method for on-line monitoring of operating parameters of an integrated circuit chip according to claim 1, wherein determining the thermal profile information of the chip during the change of the operating temperature according to the excitation response signal comprises: Extracting transient thermal response values in each test circuit of the chip from the excitation response signals; Synchronizing all transient thermal response values based on a thermal-electrical analog distributed consensus algorithm to obtain thermal distribution attributes; and generating heat distribution information of the chip when the operating temperature changes according to the heat distribution attribute.
  3. 3. The method of claim 1, wherein the failure recognition is a process for recognizing a potential failure risk of the chip to be tested due to thermal action and outputting a circuit logic signal corresponding to an abnormal thermal mode.
  4. 4. The method for on-line monitoring of operating parameters of an integrated circuit chip according to claim 1, wherein determining the health sensitivity of the chip under test in the current heat dissipation state from the thermal fatigue characteristics comprises: determining the fatigue risk of the chip to be tested in the current heat dissipation state according to the thermal fatigue characteristics; determining vulnerability indexes of functions of all the test circuits in the current heat dissipation state according to the fatigue risk quantity; and carrying out collaborative decision-making according to all vulnerability indexes and the global load state of the chip to be tested, and obtaining the health sensitivity of the chip to be tested in the current heat dissipation state.
  5. 5. The method for on-line monitoring of operation parameters of integrated circuit chip as claimed in claim 1, wherein said health sensitivity is a quantitative value of the degree to which the overall performance state of the chip to be tested is affected by the current heat dissipation condition.
  6. 6. The method for on-line monitoring of operating parameters of an integrated circuit chip according to claim 1, wherein obtaining a current test signal flowing through a prescribed path in the chip to be tested comprises: Determining an original current sampling sequence of a specified path based on excitation load conditions of a chip to be detected; Each sampling test operation pin performs operation detection on an original current sampling sequence to obtain current tag values of a plurality of specified paths; And determining a current test signal flowing through a specified path in the chip to be tested according to all the current tag values.
  7. 7. The method for on-line monitoring of operating parameters of an integrated circuit chip according to claim 1, wherein determining an operating state index on a test operating pin based on the current test signal comprises: decomposing the current test signals to extract corresponding current pulse characteristics of each test operation pin; reconstructing all current pulse characteristics to obtain the state deviation degree of each test operation pin; and comparing each state deviation degree with the operation reference quantity of the corresponding test pin to obtain the working state index on the test operation pin.
  8. 8. The method of claim 1, wherein the function-keeping value is a quantization index of the current functional integrity of the chip to be tested.
  9. 9. The method of claim 1, wherein the functional states include a normal operating state, a performance decay state, and a failure risk state.
  10. 10. An integrated circuit chip operating parameter on-line monitoring system for performing an integrated circuit chip operating parameter on-line monitoring method as claimed in any one of claims 1 to 9, the monitoring system comprising: the signal acquisition module is used for applying functional test excitation which does not affect the main function of the chip to be tested when the chip to be tested runs, and synchronously acquiring excitation response signals generated by the chip to be tested under the functional test excitation; The failure test module is used for determining heat distribution information of the chip when the running temperature changes according to the excitation response signals, performing failure recognition on the heat distribution information to obtain thermal fatigue characteristics of the chip to be tested in an uneven heat dissipation state, and further determining the health sensitivity of the chip to be tested in the current heat dissipation state according to the thermal fatigue characteristics; The defect identification module is used for acquiring a current test signal flowing through a specified path in the chip to be tested, determining a working state index on a test operation pin according to the current test signal, and performing defect fitting on the working state index and the health sensitivity to obtain a function retention value of the chip to be tested in a current operation state; and the function test module is used for monitoring and judging the current functional state of the chip to be tested according to the function maintaining value and outputting a judging result.

Description

On-line monitoring system and method for operation parameters of integrated circuit chip Technical Field The application relates to the technical field of chip function test, in particular to an integrated circuit chip operation parameter on-line monitoring system and method. Background The chip function test is widely applied to research and development verification, factory screening and application guarantee scenes of various integrated circuit chips such as consumer electronics, industrial control, aerospace, automobile electronics and the like. The chip function test relates to core contents such as electric performance parameter detection, logic function integrity verification, operation stability verification and the like, a test object covers various types such as an operation chip, a communication chip, a storage chip and the like, the chip function test has the characteristics that test excitation needs to be matched with a chip architecture, response signals need to be accurately collected, result judgment needs to be attached to design standards, and meanwhile, the test result directly determines whether the chip meets application requirements or not, so that the chip function test is a key foundation for guaranteeing stable operation of terminal equipment, normal realization of system functions and safe landing of industry application. However, the existing integrated circuit chip operation parameter on-line monitoring is mostly dependent on single electrical parameter acquisition and excitation test means for disturbing a main function, so that heat distribution information when the chip operation temperature changes cannot be extracted from a response signal, further, thermal fatigue characteristics in an uneven heat dissipation state cannot be identified, health sensitivity cannot be determined, meanwhile, a current test signal of a specified path is difficult to accurately obtain, and an operating state index is difficult to calculate, so that a function retention value cannot be obtained by fitting correlation data of the regular thermal characteristics and the electrical characteristics through defects, and therefore, accurate monitoring and judgment on the functional state of the chip under the actual operation working condition cannot be performed. Therefore, how to perform fusion monitoring on the thermal characteristics and the electrical characteristics of the chip on the premise of not interfering with the operation of the main function of the chip to be tested, so as to improve the reliability of the judgment of the operation state of the chip is a problem facing the industry. Disclosure of Invention The application provides an integrated circuit chip operation parameter on-line monitoring system and method, which can carry out fusion monitoring on the thermal characteristics and the electrical characteristics of a chip on the premise of not interfering the operation of the main function of the chip to be detected so as to improve the reliability of judging the operation state of the chip. In a first aspect, the present application provides an on-line monitoring method for an operating parameter of an integrated circuit chip, where the monitoring method includes the following steps: Applying functional test excitation which does not affect the main function of the chip to be tested when the chip to be tested runs, and synchronously collecting excitation response signals generated by the chip to be tested under the functional test excitation; Determining heat distribution information of the chip when the operating temperature changes according to the excitation response signals, performing failure recognition on the heat distribution information to obtain thermal fatigue characteristics of the chip to be tested in an uneven heat dissipation state, and further determining health sensitivity of the chip to be tested in a current heat dissipation state according to the thermal fatigue characteristics; Acquiring a current test signal flowing through a specified path in a chip to be tested, determining a working state index on a test operation pin according to the current test signal, and performing defect fitting on the working state index and the health sensitivity to obtain a function retention value of the chip to be tested in a current operation state; and monitoring and judging the current functional state of the chip to be tested according to the functional retention value, and outputting a judging result. In this embodiment, determining, according to the excitation response signal, heat distribution information of the chip when the operating temperature changes specifically includes: Extracting transient thermal response values in each test circuit of the chip from the excitation response signals; Synchronizing all transient thermal response values based on a thermal-electrical analog distributed consensus algorithm to obtain thermal distribution attributes; and generating heat d