CN-121978867-A - Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board

Abstract

The invention provides a photosensitive resin composition, a photosensitive element, a method for forming a resist pattern and a method for manufacturing a printed wiring board. The photosensitive resin composition of the present invention contains a binder polymer, a photopolymerizable compound and a photopolymerization initiator, wherein the binder polymer contains a structural unit derived from a (meth) acrylate compound having a dicyclopentanyl group, and the binder polymer has a weight molecular weight of 7500 to 23000.

Inventors

• KATO TETSUYA
• TAKEDA AKIKO
• KAWAKAMI MINORU

Assignees

• 株式会社力森诺科

Dates

Publication Date

20260505

Application Date

20210427

Priority Date

20200807

Claims (14)

1. 1. A photosensitive resin composition comprising a binder polymer, a photopolymerizable compound and a photopolymerization initiator, The adhesive polymer comprises a structural unit derived from a (methyl) acrylate compound having dicyclopentyl, and has a weight average molecular weight of 7500-23000.
2. 2. The photosensitive resin composition according to claim 1, wherein, The content of the structural unit derived from the (meth) acrylate compound having a dicyclopentyl group is 1 to 30% by mass based on the total mass of the structural units derived from the polymerizable monomers constituting the binder polymer.
3. 3. The photosensitive resin composition according to claim 1 or 2, further comprising a sensitizer having an absorption at 340 to 430 nm.
4. 4. The photosensitive resin composition according to any one of claim 1 to 3, wherein, The photopolymerizable compound comprises bisphenol a type (meth) acrylate.
5. 5. The photosensitive resin composition according to claim 4, wherein, The bisphenol a type (meth) acrylate comprises 2, 2-bis (4- ((meth) acryloxypolyethoxy) phenyl) propane.
6. 6. The photosensitive resin composition according to claim 4, wherein, The bisphenol a type (meth) acrylate comprises 2, 2-bis (4- ((meth) acryloxydipropyloxy) phenyl) propane.
7. 7. The photosensitive resin composition according to claim 4, wherein, The bisphenol a type (meth) acrylate comprises 2, 2-bis (4- (methacryloxypentaethoxy) phenyl) propane.
8. 8. The photosensitive resin composition according to any one of claims 1 to 7, wherein, The photopolymerizable compound includes polyalkylene glycol di (meth) acrylate.
9. 9. The photosensitive resin composition according to any one of claims 1 to 8, wherein, The adhesive polymer further comprises structural units derived from styrene or styrene derivatives.
10. 10. The photosensitive resin composition according to claim 9, wherein, The content of the structural unit derived from the (meth) acrylate compound having a dicyclopentyl group and the structural unit derived from styrene or a styrene derivative is 50 mass% or more based on the total mass of the structural units derived from the polymerizable monomers constituting the binder polymer.
11. 11. A photosensitive element comprising a support and a photosensitive layer comprising the photosensitive resin composition according to any one of claims 1 to 10 formed on the support.
12. 12. A method for forming a resist pattern, comprising: a photosensitive layer forming step of laminating a photosensitive layer containing the photosensitive resin composition according to any one of claims 1 to 10 or a photosensitive layer of the photosensitive element according to claim 11 on a substrate; An exposure step of irradiating a predetermined portion of the photosensitive layer with an active light to form a photo-cured portion, and And a developing step of removing a region other than the predetermined portion of the photosensitive layer from the substrate.
13. 13. The method for forming a resist pattern according to claim 12, wherein, The wavelength of the active light is in the range of 340-430 nm.
14. 14. A method of manufacturing a printed wiring board, comprising: a step of forming a conductor pattern by performing an etching treatment or a plating treatment on the substrate on which the resist pattern is formed by the method for forming a resist pattern according to claim 12 or 13.

Description

Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board The present application is a divisional application with chinese application number 202180058102.7, whose application date is 2021, 04, 27, and its name is "photosensitive resin composition, photosensitive element, method for forming resist pattern" and method for manufacturing printed wiring board. Technical Field The invention relates to a photosensitive resin composition, a photosensitive element, a method for forming a resist pattern and a method for manufacturing a printed wiring board. Background In the field of manufacturing printed wiring boards, as a resist material used in etching treatment, plating treatment, and the like, a photosensitive resin composition, and a photosensitive element (laminate) including a support and a layer (hereinafter referred to as a "photosensitive layer") formed on the support using the photosensitive resin composition are widely used. In the case of manufacturing a printed wiring board using a photosensitive element, first, a photosensitive layer of the photosensitive element is laminated on a circuit-forming substrate. Then, an active light is irradiated onto a predetermined portion of the photosensitive layer to cure the exposed portion. After that, the support is peeled off and removed, and then the unexposed portion of the photosensitive layer is removed by a developer, whereby a resist pattern is formed on the substrate. Next, the substrate on which the resist pattern is formed is subjected to etching treatment or plating treatment using the resist pattern as a mask, and a circuit pattern is formed on the substrate, and finally the cured portion (resist pattern) of the photosensitive layer is peeled off from the substrate. As a method of exposure, the photosensitive layer is subjected to pattern exposure through a mask film or the like. In recent years, a projection exposure method is available in which an active light beam for projecting an image of a mask is irradiated to a photosensitive layer through a lens to expose the image. As a light source used in the projection exposure method, an ultrahigh pressure mercury lamp can be used. In general, an exposure machine using i-ray monochromatic light (365 nm) for exposure wavelength is often used, but h-ray monochromatic light (405 nm) may be used with exposure wavelength ihg mixed lines. The projection exposure method is an exposure method capable of ensuring high resolution and high alignment as compared with the contact exposure method. Accordingly, recently, miniaturization of circuit formation in a printed wiring board has been demanded, and a projection exposure system has been attracting attention. With recent increases in the density of printed wiring boards, there has been an increasing demand for photosensitive resin compositions excellent in resolution (resolution) and adhesion. In particular, in the production of a package substrate, a photosensitive resin composition capable of forming a resist pattern having a line width/line spacing of 10/10 (unit: μm) or less is required. For example, patent document 1 discloses that resolution and adhesion are improved by using a specific photopolymerizable compound. Technical literature of the prior art Patent literature Patent document 1 Japanese patent application laid-open No. 2013-195712 Disclosure of Invention Technical problem to be solved by the invention In recent years, miniaturization of conductor patterns has progressed, and it has been desired to form a fine resist pattern which further improves resolution and adhesion of a photosensitive resin composition. The present invention has been made in view of the problems of the conventional techniques, and an object of the present invention is to provide a photosensitive resin composition capable of forming a resist pattern excellent in resolution and adhesion, a photosensitive element using the photosensitive resin composition, a method for forming a resist pattern, and a method for manufacturing a printed wiring board. Means for solving the technical problems One aspect of the present invention relates to a photosensitive resin composition containing a binder polymer, a photopolymerizable compound, and a photopolymerization initiator, wherein the binder polymer contains a structural unit derived from a (meth) acrylate compound having a dicyclopentyl group, and the binder polymer has a weight molecular weight of 7500 to 23000. The content of the structural unit derived from the (meth) acrylate compound having a dicyclopentyl group may be 1 to 30% by mass based on the total mass of the structural units derived from the polymerizable monomers constituting the binder polymer. The photosensitive resin composition may further contain a sensitizer having an absorption at 340 to 430 nm. Another aspect of the present invention relates to a photosensitive element including a