CN-121979148-A - CDSEM measurement monitoring method and monitoring system

Abstract

The invention provides a CDSEM measurement monitoring method and a monitoring system, which are characterized in that SA triggers generated by a receiver platform are received and trigger information of the SA triggers is recorded, whether the SA triggers are generated on a plurality of different measuring points or not and whether the SA triggers are consistent or not is judged, whether the SA triggers with consistency exist on different programs of the same platform or not and whether the SA triggers with consistency exist on the same program of different platforms or not is judged, and the SA triggers are monitored, so that corresponding clamping control can be carried out, the subsequent SA triggers can be reduced, the measurement time can be reduced, and the productivity of the platform can be improved.

Inventors

• XU ZHEN

Assignees

• 芯恩（青岛）集成电路有限公司

Dates

Publication Date

20260505

Application Date

20260203

Claims (11)

1. 1. The CDSEM measurement monitoring method is characterized by comprising the following steps: The method comprises the steps that SA trigger generated by a receiver station is received and trigger information of the SA trigger is recorded; judging whether SA triggers are generated on a plurality of different measuring points and whether the SA triggers have consistency; if the same machine has the consistent SA trigger generated by the different programs of the same machine and the consistent SA trigger is not generated by the same program of the different machine, the machine problem is judged.
2. 2. The method of claim 1, wherein if there are no consistent SA triggers on different programs of the same machine and there are consistent SA triggers on the same program of different machines, then determining a program problem.
3. 3. The CDSEM metrology monitoring method of claim 1, wherein determining whether SA triggers are generated at a plurality of different measurement points and whether each SA trigger is consistent comprises: judging whether SA triggers are generated on a plurality of different measuring points or not; If yes, judging whether the offset direction and the offset amount of each SA trigger at a plurality of different measuring points are the same.
4. 4. The method for CDSEM measurement and monitoring according to any one of claims 1-3, wherein determining whether there are consistent SA triggers on different programs of the same machine and whether there are consistent SA triggers on the same program of different machines comprises: Judging whether SA triggers are generated on different programs of the same machine; if not, judging whether SA triggers are generated on the same program of different machines and whether the SA triggers have consistency.
5. 5. The CDSEM measurement and monitoring method of claim 4, wherein determining whether SA triggers are generated on different programs of the same machine; If so, judging whether the SA triggers on different programs of the same machine have consistency, and if not, judging whether the SA triggers on the same program of different machines have consistency and whether the SA triggers have consistency.
6. 6. The CDSEM measurement and monitoring method of claim 5, wherein it is determined whether each SA trigger on different programs of the same machine has consistency, and if so, whether each SA trigger is generated on the same program of different machines and whether each SA trigger has consistency.
7. 7. The method for monitoring CDSEM measurement according to any one of claims 1-3, wherein it is determined whether SA triggers are generated at a plurality of different measurement points and whether each SA trigger has consistency, and if not, it is determined that there is a wafer problem.
8. 8. The method of claim 7, wherein the SA triggered trigger information is output in the form of an offset map when a wafer problem is determined.
9. 9. A CDSEM metrology monitoring system, the CDSEM metrology monitoring system comprising: the data unit is used for receiving the SA triggers generated by the machine and recording the trigger information of the SA triggers, judging whether the SA triggers are generated on a plurality of different measuring points and whether the SA triggers are consistent, if so, judging whether the SA triggers with consistency exist on different programs of the same machine and whether the SA triggers with consistency exist on the same program of the different machine, and if the SA triggers with consistency exist on different programs of the same machine and the SA triggers with consistency do not exist on the same program of the different machine, judging the machine as a machine problem.
10. 10. The CDSEM measurement monitoring system of claim 9, wherein if there are no consistent SA triggers generated on different programs of the same machine and consistent SA triggers generated on different programs of different machines, then determining a program problem.
11. 11. The CDSEM metrology monitoring system of claim 9 or 10, further comprising: And the display unit is used for displaying the judging result.

Description

CDSEM measurement monitoring method and monitoring system Technical Field The invention relates to the technical field of semiconductor manufacturing, in particular to a CDSEM measurement monitoring method and a monitoring system. Background A CDSEM (critical dimension scanning electron microscope) machine is a key device for high-precision measurement in semiconductor manufacturing, and is mainly used for performing nanoscale imaging and dimension analysis on micro-nano structures (such as line widths, trenches, contact holes, etc.) on the surface of a wafer through a scanning electron beam. The method utilizes high-resolution electron beams to scan the surface of a sample, combines an image processing algorithm to accurately measure the Critical Dimension (CD), morphology and overlay error of the pattern, provides real-time feedback data for processes such as photoetching and etching, and ensures the stability of the process and the yield of products. CDSEM has advantages of non-contact, high sensitivity, automatic measurement and the like, is a core tool for monitoring process fluctuation, optimizing process parameters and preventing defects, and is important for guaranteeing chip performance and reliability. However, in actual measurement, if the measurement coordinates deviate, various effects may be generated on the production process and the product quality, such as distortion of measurement data, missing detection of product defects, and loss of equipment and production efficiency. The influence of the coordinate shift runs through various links from research and development to mass production, and the micrometer-scale shift can cause disastrous results. Therefore, preventing and rapidly correcting coordinate shift is one of the key elements of semiconductor quality control. There are often a large number of online programs (Recipe) on the CDSEM machine, which also makes it difficult for engineers to perform one-to-one maintenance after they have been created. In the CDSEM machine, the problem of measurement coordinate shift often occurs due to various factors in the measurement process, when the problem occurs, the machine is triggered by SA (Search Around), and SA (Search Around) is executed around the current position, so that the measurement time is too long, the productivity of the machine is seriously affected, and in order to solve the problem, the current main machine has no clamping control measure. Disclosure of Invention The invention aims to provide a CDSEM measurement monitoring method and a monitoring system, which are used for solving the problems that in the prior art, SA trigger is generated on a machine, so that the measurement time is too long and the productivity of the machine is seriously affected. In order to solve the above technical problems, the present invention provides a CDSEM measurement and monitoring method, which includes: The method comprises the steps that SA trigger generated by a receiver station is received and trigger information of the SA trigger is recorded; judging whether SA triggers are generated on a plurality of different measuring points and whether the SA triggers have consistency; if the same machine has the consistent SA trigger generated by the different programs of the same machine and the consistent SA trigger is not generated by the same program of the different machine, the machine problem is judged. Optionally, in the CDSEM measurement monitoring method, if there are no consistent SA triggers generated on different programs of the same machine and consistent SA triggers generated on the same program of different machines, the program problem is determined. Optionally, in the CDSEM measurement monitoring method, determining whether SA triggers are generated at a plurality of different measurement points and whether each SA trigger has consistency includes: judging whether SA triggers are generated on a plurality of different measuring points or not; If yes, judging whether the offset direction and the offset amount of each SA trigger at a plurality of different measuring points are the same. Optionally, in the CDSEM measurement monitoring method, determining whether there is a consistent SA trigger on different programs of the same machine and whether there is a consistent SA trigger on the same program of different machines includes: Judging whether SA triggers are generated on different programs of the same machine; if not, judging whether SA triggers are generated on the same program of different machines and whether the SA triggers have consistency. Optionally, in the CDSEM measurement monitoring method, it is determined whether SA triggers are generated on different programs of the same machine; If so, judging whether the SA triggers on different programs of the same machine have consistency, and if not, judging whether the SA triggers on the same program of different machines have consistency and whether the SA triggers have consistency. O