CN-121979366-A - Novel device and method for reinforcing heat dissipation of computer board card

Abstract

The invention provides a board card liquid cooling heat dissipation device for a reinforced computer, which comprises a liquid cooling source, a liquid cooling flow divider and at least one liquid cooling board, wherein the liquid cooling flow divider is provided with a main inlet and a plurality of branch outlets, the main inlet is detachably connected with an output pipeline of the liquid cooling source through a first fluid connector, each branch outlet is detachably connected with an inlet of the liquid cooling board through a second fluid connector, the liquid cooling board is used for directly thermally contacting a heating chip on the board card in the reinforced computer, and cooling liquid sequentially flows through the first fluid connector, the liquid cooling flow divider and the second fluid connector from the liquid cooling source to enter the liquid cooling board, and returns after heat is taken away. Compared with the traditional heat radiation mode, the invention solves the problem of low heat radiation efficiency caused by indirect contact of the air channel with the heating device in the air-cooled heat radiation, and the mode not only can improve the heat radiation efficiency, but also can save the space occupied by installing the fan, reduce the volume of the reinforced computer, reduce the production cost and improve the benefit.

Inventors

• YANG JUNJIE

Assignees

• 中航华东光电有限公司

Dates

Publication Date

20260505

Application Date

20260126

Claims (8)

1. 1. A board card liquid cooling heat sink for a ruggedized computer, comprising: A liquid cold source, a liquid cooling shunt (3) and at least one liquid cooling plate (1); the liquid cooling diverter (3) is provided with a total inlet and a plurality of branch outlets; the main inlet is detachably connected with an output pipeline of the liquid cooling source through a first fluid connector (2 a); Each branch outlet is detachably connected with the inlet of one liquid cooling plate (1) through a second fluid connector (2 b); the liquid cooling plate (1) is used for directly thermally contacting with a heating chip on a board card (4) in the reinforced computer; the cooling liquid sequentially flows through the first fluid connector (2 a), the liquid cooling shunt (3) and the second fluid connector (2 b) from the liquid cooling source to enter the liquid cooling plate (1), and the cooling liquid flows back after heat is taken away.
2. 2. The board card liquid cooling heat dissipating device according to claim 1, wherein one end of the first fluid connector (2 a) is connected to the liquid cooling source, and the other end is connected to the total inlet of the liquid cooling diverter (3).
3. 3. The board card liquid cooling heat radiating device for reinforcing a computer according to claim 1 or 2, wherein the second fluid connector (2 b) comprises a second plug (21 b) and a second socket (22 b), the second socket (22 b) is arranged on a branch outlet of the liquid cooling shunt (3), the second plug (21 b) is arranged on an inlet of the liquid cooling board (1), and the second plug (21 b) and the second socket (22 b) can be in butt joint or separated.
4. 4. A board card liquid cooling heat dissipating device for reinforcing a computer according to claim 3, wherein the second fluid connector (2 b) has a straight push type locking structure, and the abutting surface of the second plug (21 b) and the second socket (22 b) has a planar sealing structure, and can be kept sealed in both the plugged-in and disconnected states.
5. 5. A board card liquid cooling heat sink for a ruggedized computer according to claim 4, wherein the first fluid connector (2 a) and the second fluid connector (2 b) have the same straight push type locking and planar sealing structure.
6. 6. A board card liquid cooling heat sink for reinforcing a computer according to claim 1, wherein the liquid cooling plate (1) and the board card (4) are designed as an integral module.
7. 7. The device of claim 6, wherein the integrated module is removably secured to the housing of the ruggedized computer by a puller.
8. 8. A method of dissipating heat from a board based on the apparatus of claim 1, comprising the steps of: connecting the total inlet of the liquid cooling diverter (3) with an external liquid cooling source through a first fluid connector (2 a); assembling a board card (4) with a heating chip with the liquid cooling plate (1) to enable the heating chip to be in direct thermal contact with the liquid cooling plate (1); The assembled liquid cooling plate (1) is in butt joint locking with a second fluid connector (2 b) on a branch outlet of the liquid cooling diverter (3) through the second fluid connector (2 b) on the liquid cooling plate; and a liquid cold source is started, so that cooling liquid circularly flows through the liquid cooling shunt (3), the second fluid connector (2 b) and the liquid cooling plate (1), and heat generated by the plate card (4) is directly taken away.

Description

Novel device and method for reinforcing heat dissipation of computer board card Technical Field The invention mainly relates to the technical field of computer heat dissipation, in particular to a novel device and a method for reinforcing computer board card heat dissipation. Background The cooling system is characterized in that a fan is arranged behind a chassis, heat dissipated by a board card inside the chassis is taken away through an induced draft mode, and the purpose of cooling is achieved. Along with the high integration of electronic technology, electronic equipment requires smaller and smaller volume, increases the number of components and the like, so that the power density of the equipment is greatly increased, the heat is concentrated, the requirement cannot be met by single air cooling, and the requirement ratio of liquid cooling heat dissipation in the whole system heat design is continuously increased. On the basis, a novel device and a method for reinforcing the heat dissipation of the computer board card are provided. Disclosure of Invention 1. The invention aims to solve the technical problems that: The invention provides a novel device and a method for reinforcing heat dissipation of a computer board card, which are used for solving the technical problems in the background technology. 2. The technical scheme is as follows: In order to achieve the above object, the technical scheme of the present invention is as follows: In a first aspect, the present invention provides a board card liquid cooling heat dissipation device for reinforcing a computer, including: a liquid cold source, a liquid cooling shunt and at least one liquid cooling plate; The liquid cooling diverter is provided with a total inlet and a plurality of branch outlets; the main inlet is detachably connected with an output pipeline of the liquid cooling source through a first fluid connector; each bypass outlet is detachably connected with the inlet of one liquid cooling plate through a second fluid connector; The liquid cooling plate is used for directly thermally contacting with a heating chip on a board card in the reinforced computer; The cooling liquid sequentially flows through the first fluid connector, the liquid cooling shunt and the second fluid connector from the liquid cooling source to enter the liquid cooling plate, and the cooling liquid flows back after heat is taken away. The further improvement is that one end of the first fluid connector is connected with the liquid cooling source, and the other end is connected with the total inlet of the liquid cooling flow divider. The liquid cooling diverter is characterized in that the second fluid connector comprises a second plug and a second socket, the second socket is arranged on a branch outlet of the liquid cooling diverter, the second plug is arranged on an inlet of the liquid cooling plate, and the second plug and the second socket can be in butt joint or separation. The second fluid connector is of a direct-push type locking structure, the butt joint surface of the second plug and the second socket is of a plane sealing structure, and sealing can be kept in the plugging and disconnecting states. A further improvement is that the first fluid connector and the second fluid connector have the same push-to-lock and planar seal structure. The liquid cooling plate and the plate card are designed into an integrated module. The integrated module is detachably fixed on a box body of the reinforced computer through the puller. In a second aspect, the invention further provides a board card heat dissipation method based on the device, which comprises the following steps: connecting a main inlet of the liquid cooling shunt with an external liquid cooling source through a first fluid connector; assembling the board card with the heating chip with the liquid cooling plate to enable the heating chip to be in direct thermal contact with the liquid cooling plate; The assembled liquid cooling plate is in butt joint locking with a second fluid connector on the branch outlet of the liquid cooling diverter through the second fluid connector on the liquid cooling plate; and starting a liquid cold source to enable the cooling liquid to circularly flow through the liquid cooling shunt, the second fluid connector and the liquid cooling plate, and directly taking away heat generated by the board card. 3. The beneficial effects are that: Compared with the prior art, the technical scheme provided by the invention has the following beneficial effects: Compared with the traditional heat radiation mode, the invention solves the problem of low heat radiation efficiency caused by indirect contact of the air channel with the heating device in the air-cooled heat radiation, and the mode not only can improve the heat radiation efficiency, but also can save the space occupied by installing the fan, reduce the volume of the reinforced computer, reduce the production cost and improve the benefit