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CN-121979368-A - Notebook computer cooling system

CN121979368ACN 121979368 ACN121979368 ACN 121979368ACN-121979368-A

Abstract

The invention discloses a notebook computer cooling system, which comprises a cooling module which is respectively in heat conduction contact with a CPU chip and a GPU chip, wherein the cooling module is arranged in a containing area formed by an upper notebook computer shell and a lower notebook computer shell, the CPU chip and the GPU chip are arranged on the lower notebook computer shell, the notebook computer cooling system also comprises 2 cooling cavities which are respectively arranged in the lower notebook computer shell, the heat absorption ends of the L-shaped 2 cooling cavities are adjacently arranged in the central area of the lower notebook computer shell provided with the CPU chip and the GPU chip, the heat absorption ends of the 2 cooling cavities are oppositely far away and are respectively positioned at the edges of the two sides of the lower notebook computer shell, and a medium flow passage is formed between the adjacent barrier strips and between the barrier strips and the side walls of the adjacent cooling cavities. The invention can fully utilize the notebook shell to greatly increase the heat conduction area and efficiency, improve the heat dissipation efficiency of the CPU chip and the GPU chip and meet the design requirement of light weight.

Inventors

  • YU CHAOYANG
  • MA JUNKANG
  • CHEN SHUAIFENG
  • ZHUANG GAOFENG

Assignees

  • 昆山品岱电子有限公司

Dates

Publication Date
20260505
Application Date
20251225

Claims (10)

  1. 1. The notebook computer cooling system comprises a cooling module (100) which is respectively in heat conduction contact with a CPU chip and a GPU chip, wherein the cooling module (100) is arranged in a containing area formed by an upper notebook computer shell (200) and a lower notebook computer shell (300), the CPU chip and the GPU chip are arranged on the lower notebook computer shell (300), the notebook computer cooling system is characterized by also comprising 2 cooling cavities (1) which are respectively arranged in the lower notebook computer shell (300), the cooling module is adjacent to the respective heat absorption ends of the L-shaped 2 cooling cavities (1) and are arranged in the central area of the lower notebook computer shell (300) provided with the CPU chip and the GPU chip, the respective cooling ends of the 2 cooling cavities (1) are far away from each other and are respectively positioned at the edges of the two sides of the lower notebook computer shell (300), an isolating strip (2) is respectively arranged in the inner part of the cooling cavities (1), the cooling cavities (1) are divided into a liquid outlet channel (3) and a liquid inlet channel (4) which are positioned at the two sides of the isolating strip (2), the cooling cavities (2) are connected with the inner walls of the cooling channels (1) which are connected with the heat absorption ends of the cooling cavities (1) at the other ends of the cooling channels (1) which are mutually connected, be provided with 2 pump body (5) that correspond setting with heat dissipation cavity (1) on notebook casing (100), be located heat dissipation cavity (1) heat absorption end outside the play liquid end of pump body (5) is connected with liquid outlet channel (3), the feed liquor end and the feed liquor passageway (4) of pump body (5) are connected, all be provided with in liquid outlet channel (3) and feed liquor passageway (4) of heat dissipation cavity (1) a plurality of blend stop (6) that are parallel to each other and interval distribution to form medium runner (7) between adjacent blend stop (6) and between the lateral wall of blend stop (6) and adjacent heat dissipation cavity (1).
  2. 2. The notebook computer cooling system according to claim 1, wherein the cooling module (100) is a liquid cooling module.
  3. 3. The notebook computer cooling system according to claim 1, wherein the lower notebook computer casing (300) is provided with a cooling hole (301) which is matched with the cooling module (100).
  4. 4. The notebook computer cooling system according to claim 1, wherein the isolation strip (2) further comprises a main body part (21) which is L-shaped and two ends of which are respectively arranged at intervals with the heat absorption end and the inner wall of the heat dissipation end of the cooling cavity (1), and a bending part (22) which is positioned at the heat absorption end of the cooling cavity (1) and vertically crosses one end of the main body part (21), and the other end of the bending part (22) with one end connected with the main body part (21) is connected with the side wall of one side of the cooling cavity (1).
  5. 5. The notebook computer cooling system according to claim 4, wherein the liquid inlet channel (4) is defined between the side wall of the cooling cavity (1) connected with the bending part (22) of the isolation strip (2) and the isolation strip (2), and the width of the liquid inlet channel (4) is smaller than that of the liquid outlet channel (3).
  6. 6. The notebook computer cooling system according to claim 5, wherein a drainage strip (10) with one end connected with the main body part (21) of the isolation strip (2) is arranged in the liquid outlet channel (3), and the other end of the drainage strip (10) collinear with the bending part (22) of the isolation strip (2) is arranged at intervals with the side wall of the other side of the cooling cavity (1) to form a liquid outlet (11).
  7. 7. The notebook cooling system according to claim 6, wherein a flow equalizing area (12) is formed between one end of each baffle strip (6) which is arranged in the liquid outlet channel (3) and the drainage strip (10), the flow equalizing area (12) is internally provided with a plurality of flow guiding strips (13) which are perpendicular to the drainage strip (10), and among the plurality of flow guiding strips (13) which are distributed at equal intervals along the width direction of the liquid outlet channel (3), one end of the flow guiding strip (13) which is positioned in the middle and is close to the drainage strip (10) is provided with an inclined part (131) which extends towards the direction of the liquid outlet (11).
  8. 8. The notebook heat dissipation system as set forth in claim 7, wherein the distance between adjacent guide strips (13) is greater than the distance between adjacent barrier strips (6) distributed at equal intervals in the liquid outlet channel (3).
  9. 9. The notebook computer cooling system according to claim 6, wherein the liquid outlet end and the liquid inlet end of the pump body (5) are respectively connected with two sides of one end, far away from the main body part (21), of the bending part (22) of the isolation strip (2).
  10. 10. The notebook heat dissipation system as set forth in claim 1, wherein the pump body (5) is a piezoelectric ceramic micropump.

Description

Notebook computer cooling system Technical Field The invention relates to the field of heat dissipation of electronic products, in particular to a notebook computer heat dissipation system. Background In the field of notebook computers, especially in business books for mobile office, light and thin have become the core design direction. In order to improve portability and grip feeling, manufacturers continuously compress the thickness of the machine body, which directly results in the continuous extrusion of the space between the D-shell (bottom shell) of the device and the internal heat dissipation module, even if the gap of a part of the machine types is reduced to millimeter level, the layout space of the conventional heat dissipation structure is severely limited. Meanwhile, the arrival of the AI age promotes the upgrading of the notebook function, namely whether local AI calculation, multi-task intelligent scheduling or high-load AI application running, the power consumption of chips (CPU, GPU and AI acceleration chip) is continuously increased, and the instantaneous power consumption of part of business books breaks through the bearing upper limit of the traditional heat dissipation design. The compressed D shell space not only can not provide mounting conditions for larger-size heat dissipation modules (such as a plurality of heat pipes and large fins), but also can enable heat to be difficult to conduct rapidly between the D shell and the modules and dissipate a large amount of heat to accumulate on the inner side of the D shell, so that on one hand, the local temperature of the D shell is suddenly increased, the risk of scalding the hands of a user exists, on the other hand, the heat can not be discharged timely and can be conducted reversely to a chip, frequent frequency reduction of the chip is caused, the smoothness of AI operation and multitasking is not only influenced, and long-term high temperature can also accelerate the ageing of the D shell and internal components, so that the service life of equipment is shortened. Therefore, an efficient active heat dissipation scheme which is suitable for the light and thin structure of the business book, can cope with the high power consumption requirement of the AI era and is not limited by the D shell space is urgently needed, so that the contradiction between the D shell space compression and the high power consumption heat dissipation requirement is solved, and the risks of D shell overheating and equipment performance attenuation are avoided. Disclosure of Invention The invention aims to provide a notebook computer cooling system which can fully utilize a notebook computer shell to greatly increase the heat conduction area and efficiency, improve the cooling efficiency of a CPU chip and a GPU chip and meet the design requirement of light weight. The technical scheme includes that the notebook cooling system comprises cooling modules which are in heat conduction contact with a CPU chip and a GPU chip respectively, wherein the cooling modules are arranged in a containing area formed by an upper notebook shell and a lower notebook shell, the CPU chip and the GPU chip are mounted on the lower notebook shell, the notebook cooling system further comprises 2 cooling cavities which are respectively formed in the lower notebook shell, the cooling cavities are arranged in the central area of the lower notebook shell, the heat absorption ends of the cooling cavities are adjacently arranged in the central area of the lower notebook shell, the CPU chip and the GPU chip are mounted, the cooling ends of the cooling cavities are oppositely far away and are respectively located at the edges of the two sides of the lower notebook shell, a separation strip is arranged in each cooling cavity, the cooling cavities are divided into a liquid channel and a liquid inlet channel which are located at the two sides of the separation strip, one end of the separation strip is connected with the inner wall of a cavity suction end, the other end of the separation strip extends to the cooling end of the cooling cavity and is arranged at intervals with the inner wall of the cooling cavity, the cooling cavity is arranged in the heat absorption end of the separation strip, the cooling cavity is arranged in the liquid channel and the liquid channel is connected with the liquid inlet channel at the two sides of the heat absorption end of the separation strip, and the cooling cavity is arranged in the liquid channel and the liquid channel is arranged in the liquid cooling cavity, and the liquid channel is arranged in the liquid channel and the liquid channel is arranged in the liquid cooling cavity and the liquid channel and the heat absorption cavity. The further improved scheme in the technical scheme is as follows: 1. in the above scheme, the heat radiation module is a liquid cooling heat radiation module. 2. In the scheme, the radiating holes matched with the radiating module are