Search

CN-121979412-A - Waterproof capacitive touch screen based on PCB bonding pad and transparent conductive film

CN121979412ACN 121979412 ACN121979412 ACN 121979412ACN-121979412-A

Abstract

The invention discloses a waterproof capacitive touch screen based on a PCB (printed Circuit Board) bonding pad and a transparent conductive film, which belongs to the technical field of touch screens and comprises a cover plate, a transparent conductive film sensor, a printed circuit board, an integrated connection structure and a main sealing structure, wherein the transparent conductive film sensor comprises a transparent base material, a capacitive sensing electrode pattern formed on the transparent base material and a transparent conductive film bonding pad array which is electrically connected with the capacitive sensing electrode pattern and is positioned in a non-visible area.

Inventors

  • WANG LIN

Assignees

  • 厦门鑫铭科技股份有限公司

Dates

Publication Date
20260505
Application Date
20260126

Claims (10)

  1. 1. A waterproof capacitive touch screen based on a PCB bonding pad and a transparent conductive film is characterized by comprising a cover plate, a transparent conductive film sensor, a printed circuit board, an integrated connection structure and a main sealing structure; the transparent conductive film sensor comprises a transparent substrate, a capacitance sensing electrode pattern formed on the transparent substrate, and a transparent conductive film pad array electrically connected with the capacitance sensing electrode pattern and positioned in a non-visible area; a printed circuit board provided with a touch control circuit and a PCB pad array arranged corresponding to the transparent conductive film pad array; the integrated connecting structure is made of anisotropic conductive materials, and the transparent conductive film sensor is electrically interconnected and mechanically bonded with the PCB pad array of the printed circuit board in the Z-axis direction through the integrated connecting structure by the transparent conductive film pad array of the transparent conductive film sensor; and a main sealing structure disposed around the integrated connection structure and sealing a connection region of the transparent conductive film pad array and the PCB pad array.
  2. 2. The waterproof capacitive touch screen based on the PCB bonding pad and the transparent conductive film according to claim 1, wherein the integrated connection structure is an anisotropic conductive adhesive film or an anisotropic conductive adhesive.
  3. 3. The waterproof capacitive touch screen based on the PCB bonding pad and the transparent conductive film of claim 1, wherein the transparent conductive film bonding pad and the capacitive sensing electrode pattern are made of the same transparent conductive layer through the same patterning process.
  4. 4. The waterproof capacitive touch screen based on the PCB bonding pad and the transparent conductive film of claim 1, wherein the material of the capacitive sensing electrode pattern is indium tin oxide, metal grids or nano silver wires.
  5. 5. The waterproof capacitive touch screen based on the PCB bonding pad and the transparent conductive film of claim 1, wherein the printed circuit board is a rigid printed circuit board, a flexible printed circuit board or a rigid-flex printed circuit board.
  6. 6. The waterproof capacitive touch screen based on the PCB bonding pad and the transparent conductive film of claim 1, further comprising a peripheral encapsulating layer arranged on the element surface of the printed circuit board and encapsulating the electronic elements.
  7. 7. The waterproof capacitive touch screen based on the PCB bonding pad and the transparent conductive film of claim 1, wherein the main sealing structure is a sealing glue frame formed by silica gel, epoxy resin or polyurethane material.
  8. 8. The waterproof capacitive touch screen based on the PCB bonding pad and the transparent conductive film of claim 1, wherein the cover plate is fully attached to a visible area of the transparent conductive film sensor through an optical transparent adhesive layer, and the edge of the cover plate is bonded and sealed with the printed circuit board or the middle supporting structure through edge sealant.
  9. 9. A method of manufacturing a waterproof capacitive touch screen as claimed in any one of claims 1 to 8 comprising the steps of: S1, providing a transparent conductive film sensor provided with a transparent conductive film pad array and a printed circuit board provided with a corresponding PCB pad array and a touch control circuit; s2, arranging an anisotropic conductive material on the transparent conductive film pad array or the PCB pad array; S3, aligning and enabling the transparent conductive film pad array to be in contact with the PCB pad array through the anisotropic conductive material, and performing hot-pressing binding to form an integrated connecting structure; S4, applying a sealing material on the periphery of the integrated connecting structure, and curing to form a main sealing structure; And S5, fully attaching the cover plate to the visible area of the transparent conductive film sensor through an optical transparent adhesive layer, and sealing the edge.
  10. 10. The method according to claim 9, further comprising, after step S4, pouring a potting compound on the component surface of the printed circuit board to form a peripheral potting layer covering the electronic component.

Description

Waterproof capacitive touch screen based on PCB bonding pad and transparent conductive film Technical Field The invention relates to the technical field of touch screens, in particular to a waterproof capacitive touch screen based on a PCB bonding pad and a transparent conductive film. Background Capacitive touch screens have found widespread use in consumer electronics, industrial control, automotive electronics, and outdoor equipment. The conventional capacitive touch screen generally adopts a method of manufacturing a transparent sensing electrode (ITO pattern) on a glass or film substrate, collecting signals to a flexible circuit board (FPC) through silver paste wires at the edge, and connecting with a main control circuit through a connector or a hot-press binding mode. The structure has obvious reliability defect that the silver paste wiring is easy to be influenced by environment, the main components of the silver paste are silver particles and organic binder, the texture of the silver paste is porous, moisture absorption is easy to occur in a humid environment, the impedance is increased, signals are attenuated, and under long-term exposure, silver ions are easy to migrate or sulfide/chloridize corrosion, so that the circuit is broken or electric leakage occurs between adjacent wirings, and touch failure or false touch is caused. In order to solve the waterproof problem, the prior art adopts the modes of integral dispensing sealing, adding waterproof foam or using waterproof breathable film (ePTFE) after the assembly is completed. These are "back-end remediation" measures that fail to fundamentally address the corrosiveness of the silver paste trace itself, and add structural complexity and thickness. Based on the above, the invention designs a waterproof capacitive touch screen based on a PCB bonding pad and a transparent conductive film, so as to solve the problems. Disclosure of Invention The invention aims to provide a waterproof capacitive touch screen based on a PCB bonding pad and a transparent conductive film, so as to solve the technical problems. In order to achieve the aim, the invention provides the technical scheme that the waterproof capacitive touch screen based on the PCB bonding pad and the transparent conductive film comprises a cover plate, a transparent conductive film sensor, a printed circuit board, an integrated connection structure and a main sealing structure; the transparent conductive film sensor comprises a transparent substrate, a capacitance sensing electrode pattern formed on the transparent substrate, and a transparent conductive film pad array electrically connected with the capacitance sensing electrode pattern and positioned in a non-visible area; a printed circuit board provided with a touch control circuit and a PCB pad array arranged corresponding to the transparent conductive film pad array; the integrated connection structure is composed of anisotropic conductive materials, the transparent conductive film sensor is electrically interconnected and mechanically bonded with the PCB pad array of the printed circuit board in the Z-axis direction through the integrated connection structure by the transparent conductive film pad array of the transparent conductive film sensor, only one connection mode is adopted, the surface of the conductive film is printed with 0.04-0.08mm thick salient point UV ink and conductive ink, the PCB circuit board and the transparent conductive film and the cover plate 3 layer are in an assembled overlapping structure to realize the contact of the transparent conductive film and the PCB pad, and the third mode is adopted to realize the contact of the transparent conductive film and the PCB pad by locally protruding 0.2-0.3mm height through the transparent conductive film through a die hot pressing process; and a main sealing structure disposed around the integrated connection structure and sealing a connection region of the transparent conductive film pad array and the PCB pad array. Preferably, the integrated connection structure is an anisotropic conductive adhesive film or an anisotropic conductive adhesive. Preferably, the transparent conductive film pad and the capacitive sensing electrode pattern are made of the same transparent conductive layer through the same patterning process. Preferably, the material of the capacitive sensing electrode pattern is indium tin oxide, a metal grid or nano silver wires. Preferably, the printed circuit board is a rigid printed circuit board, a flexible printed circuit board or a rigid-flex printed circuit board. Preferably, the electronic component also comprises a peripheral encapsulating layer which is arranged on the component surface of the printed circuit board and is used for encapsulating the electronic component. Preferably, the main sealing structure is a sealing rubber frame formed by silica gel, epoxy resin or polyurethane materials. Preferably, the cover plate is fully attached to the vi