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CN-121981737-A - Online tracing method for device of advanced semiconductor package

CN121981737ACN 121981737 ACN121981737 ACN 121981737ACN-121981737-A

Abstract

The invention discloses an on-line tracing method for a device for advanced packaging of a semiconductor, which relates to the technical field of semiconductor manufacturing link control and comprises the steps of inputting a tracing code, retrieving an associated identifier and a tracing map through the tracing code, clicking a corresponding device data type based on a knowledge map, retrieving device information corresponding to the device data type through a tracing path, constructing a visual tracing platform and sending the tracing map to the visual tracing platform for display. According to the invention, through comprehensive collection from equipment parameters to quality detection data, a complete data portrait of the life cycle of the product is generated, errors and delays of manual recording are reduced, and objective and timely data are ensured. And constructing a knowledge graph from the device information, clearly showing a knowledge reasoning process of the network relation between the data, fusing the data security with the depth of the trace path, and dynamically setting the access limit of the branch path according to the core level of the data so as to ensure the security of the data.

Inventors

  • ZHANG JIAN

Assignees

  • 无锡芯享信息科技有限公司

Dates

Publication Date
20260505
Application Date
20251231

Claims (7)

  1. 1. An on-line traceability method for devices of advanced semiconductor packaging is characterized by comprising the following steps: Inputting a traceability code; the identification and the tracing map associated with the tracing code are called through the tracing code; clicking the corresponding device data type based on the knowledge graph; Retrieving device information corresponding to the device data type through a trace path; And constructing a visual tracing platform, and sending the tracing map to the visual tracing platform for display.
  2. 2. The device on-line tracing method for advanced packaging of semiconductor according to claim 1, wherein the tracing map is constructed by device information, and the specific construction process is as follows: dividing the device information into four categories; carrying out knowledge extraction operation on the device information under each category to obtain a plurality of device data types, corresponding relations and attributes; And constructing a knowledge graph corresponding to the device based on the device data types, the relationships and the attributes.
  3. 3. The device on-line tracing method for advanced packaging of semiconductor according to claim 2, wherein the specific construction process of the tracing path is as follows: Grouping the data types of each device through a K-Means algorithm to obtain a device data type set, and constructing a trace path for the device data type set, wherein the trace path comprises the following steps: acquiring access time and core grade of each device data type; sequencing the access time according to the time sequence, and calculating the access frequency and the statistical traceability factor; carrying out standardized processing on the traceability factors, the access frequency and the core level, and outputting the traceability index of the device data type through a nonlinear regression formula; Selecting the device data type with the biggest tracing index as a tracing starting point, carrying out multi-level tracing division on the rest device data types to obtain corresponding levels, sequentially connecting the tracing starting point with the corresponding levels to generate corresponding branch paths, and finally forming the tracing paths.
  4. 4. The device on-line tracing method for advanced packaging of semiconductor according to claim 3, wherein a restriction program is arranged on the branch path, the restriction program is used for obtaining query authority of an operator, if the query authority passes, the query authority is allowed to pass, if the query authority does not pass, tracing of the branch path cannot be performed, the specific process of obtaining the query authority of the operator is that personnel information of the operator is obtained through an intelligent terminal, face recognition is performed on the operator, face in the face recognition and the personnel information is verified, after the face recognition and the face verification pass, the query authority of the operator is obtained, whether the query authority of a core grade is met is judged, if the query authority of the operator is met, the query authority is allowed to pass, and if the query authority is not met, the query authority of the operator is not allowed to pass.
  5. 5. The method for on-line traceback of a device for advanced packaging of a semiconductor of claim 1, further comprising storing device information according to a traceback path, encrypting device information having a core level higher than a set level threshold, and setting copy inhibition program, including executing copy inhibition program when an operator allows viewing of the encrypted device information through the intelligent terminal, decrypting if the encrypted device information passes, and failing to access if the encrypted device information does not pass.
  6. 6. The device on-line trace back method for advanced packaging of semiconductor as claimed in claim 5, wherein the specific process of executing the copy-never program is: And (3) scanning port information of the accessed intelligent terminal, judging whether an external device exists, if so, not passing, if not, scanning whether a screen recording program or screen recording software exists in the intelligent terminal, if so, not passing, decrypting, enabling an operator to access, and when the operator accesses, capturing a picture corresponding to the access environment of the intelligent terminal, identifying the captured picture image, immediately ending the access, recording the ending times of the device information, and counting the starting time and the ending time of the tracing of the operator, and recording the tracing duration of the device information.
  7. 7. The device on-line trace back method for advanced semiconductor packaging as claimed in claim 6, wherein updating the trace back factor of the device information based on the trace back time length comprises: arranging the tracing duration of the device information according to the time sequence, and counting the quantity of the tracing duration; if the number of the tracing duration is greater than the set number threshold, dividing the three tracing durations into a group, calculating the average value of the three tracing durations to obtain the average duration, and forming the tracing duration sequence by the values of all the average durations; And processing the tracing duration sequence through an exponential smoothing model to output a tracing smoothing value, and calculating a tracing factor based on the tracing smoothing value and the ending times.

Description

Online tracing method for device of advanced semiconductor package Technical Field The invention relates to the technical field of semiconductor manufacturing link control, in particular to an on-line tracing method for a device for advanced packaging of a semiconductor. Background The wafer level bonding is advanced packaging, the core process of three-dimensional stacking is realized, the atomic level combination of homogeneous or heterogeneous semiconductor materials is further realized, the chip integration level is greatly improved, the power consumption and the volume are reduced, and the wafer level bonding method is widely applied to manufacturing high-end devices such as Chiplet (core particle) and GPU, HBM, MEMS sensors. The process comprises multiple steps of pretreatment, alignment, bonding, activation and the like, and also relates to various complex modes of fusion bonding, metal hot-press bonding and the like. Wafer level bonding is a complex retrospective process, and the process is susceptible to multiple factors, thereby creating quality hazards. On one hand, the problems of thermal expansion coefficient mismatch, lattice mismatch, poor bonding temperature uniformity and the like during bonding of heterogeneous materials are easy to cause wafer warpage, interface cavities and even cracks, and the bonding strength and reliability are seriously affected, on the other hand, different bonding modes have technical limitations, such as Gao Wenjian, are easy to generate thermal stress, low-temperature bonding has severe requirements on equipment and environment, and the problem of batch quality is possibly caused by small deviation of technological parameters. The bonding failure occurs, the problem root needs to be rapidly positioned to reduce the loss, so that urgent demands are put forward on the tracing of the process, and the timeliness of the tracing is taken as a key link and plays an important role in the process. The traditional tracing mode has a plurality of defects, including 1) the processing process and the record of the wafer are independent, personnel are required to search and match in the system, the tracing efficiency is extremely low, and errors are extremely easy to generate in the manual butt joint process, so that the data safety and the accuracy are different. 2) The tracing efficiency is low and mistakes are easy to occur, part of enterprises still adopt a mode of manually inputting process data, the error rate is high, a plurality of sets of accounts are required to be turned over during tracing, and the condition of lagging tracing progress frequently occurs in the scenes of batch recall and the like. Disclosure of Invention The invention aims to solve the problems mentioned in the background art and provides an on-line tracing method for a device for advanced packaging of a semiconductor. The invention can realize the following technical scheme that the device on-line tracing method for advanced packaging of the semiconductor comprises the following steps: Inputting a traceability code; the identification and the tracing map associated with the tracing code are called through the tracing code; clicking the corresponding device data type based on the knowledge graph; Retrieving device information corresponding to the device data type through a trace path; And constructing a visual tracing platform, and sending the tracing map to the visual tracing platform for display. As a preferred embodiment of the present invention, the traceback map is constructed by device information, and the specific construction process is as follows: dividing the device information into four categories; carrying out knowledge extraction operation on the device information under each category to obtain a plurality of device data types, corresponding relations and attributes; And constructing a knowledge graph corresponding to the device based on the device data types, the relationships and the attributes. As a preferred embodiment of the present invention, the specific construction process of the trace-back path is as follows: Grouping the data types of each device through a K-Means algorithm to obtain a device data type set, and constructing a trace path for the device data type set, wherein the trace path comprises the following steps: acquiring access time and core grade of each device data type; sequencing the access time according to the time sequence, and calculating the access frequency and the statistical traceability factor; carrying out standardized processing on the traceability factors, the access frequency and the core level, and outputting the traceability index of the device data type through a nonlinear regression formula; Selecting the device data type with the biggest tracing index as a tracing starting point, carrying out multi-level tracing division on the rest device data types to obtain corresponding levels, sequentially connecting the tracing starting point with the corre