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CN-121983109-A - CXL-based test board and storage module high-low temperature test connection structure

CN121983109ACN 121983109 ACN121983109 ACN 121983109ACN-121983109-A

Abstract

The invention discloses a CXL-based high-low temperature test connection structure for a test board and a memory module, which is applied to the technical field of high-low temperature test of memory strips; including whole fuselage, high low temperature cavity has been seted up to the inside of whole fuselage, one side of whole fuselage is provided with the test mainboard, CXL interface board is all installed to one side of the inside side of high low temperature cavity and one side that the test mainboard is close to whole fuselage. The core test main board is placed in a mild normal-temperature environment, so that direct invasion of severe conditions such as high-low temperature cyclic stress and condensation is thoroughly avoided, the service life of key and expensive main test equipment is greatly prolonged, the overall failure rate of a system is reduced, and only a few CXL high-speed composite cables are required to be subjected to simple and reliable sealing treatment, so that through-wall openings are greatly reduced, and the air tightness of a test box is effectively maintained. This not only reduces the temperature control energy consumption, but also ensures the uniformity and stability of the temperature field in the box.

Inventors

  • LIU GUOHUA
  • LUO YIFAN
  • LU YINGFU

Assignees

  • 深圳泓京纬科技有限公司

Dates

Publication Date
20260505
Application Date
20260127

Claims (7)

  1. 1. The CXL-based high-low temperature test connection structure for the test board and the storage module comprises an integral machine body (1) and is characterized in that a high-low temperature cavity (3) is formed in the integral machine body (1), a test main board (2) is arranged on one side of the integral machine body (1), CXL interface boards (4) are respectively arranged on one side of the inside of the high-low temperature cavity (3) and one side, close to the integral machine body (1), of the test main board (2), and a connecting wire (5) is electrically connected between the CXL interface boards (4).
  2. 2. The CXL-based test board and storage module high-low temperature test connection structure according to claim 1 is characterized in that a CXL host controller is integrated in the test main board (2), a host controller CXL device controller is integrated in the CXL interface board (4) on one side of an inner cavity of the high-low temperature cavity (3), the CXL device controller is tightly attached to a metal substrate with high heat capacity through a heat conducting silica gel pad, and the substrate is fixed in the high-low temperature cavity (3) through a low heat conductivity bracket.
  3. 3. The CXL-based test board and storage module high-low temperature test connection structure according to claim 1 is characterized in that a programmable delay compensation module and a link health monitoring unit are further installed in the test main board (2).
  4. 4. The CXL-based test board and storage module high-low temperature test connection structure according to claim 1 is characterized in that the connecting wires (5) are respectively a power wire for supplying power to two CXL interface boards (4) and a low-speed control and monitoring wire for reading a temperature sensor and monitoring the power state on the CXL interface boards (4).
  5. 5. The CXL-based test board and storage module high-low temperature test connection structure according to claim 1 is characterized in that the CXL interface board (4) adopts a CXL equipment controller chip with low power consumption and optimizes a passive heat dissipation design formed by a power circuit.
  6. 6. The CXL-based test board and storage module high-low temperature test connection structure according to claim 1 is characterized in that a CXL interface board (4) on one side of an inner cavity of the high-low temperature cavity (3) is connected with one side of an integral machine body (1) through bolts by adopting a sealing flange, and a Peltier effect temperature control module is integrated in the sealing flange.
  7. 7. The CXL-based test board and storage module high-low temperature test connection structure according to claim 1 is characterized in that a low ESR wide-temperature ceramic capacitor and tantalum capacitor combination is adopted in the CXL interface board (4).

Description

CXL-based test board and storage module high-low temperature test connection structure Technical Field The invention belongs to the technical field of high-low temperature testing of memory strips, and particularly relates to a CXL-based high-low temperature testing connection structure of a test board and a memory module. Background In the high-low temperature reliability test of the memory module, a mode of directly and tightly connecting a test main board to a tested module through a hardware adapter board is generally adopted. While conventional memory modules (e.g., DDR DIMMs) employ parallel signaling, they are extremely sensitive to signal integrity, forcing the physical distance between the test board and the module under test to be very close. However, the existing test main board is generally integrally arranged in a high-low temperature test box for connection, precise electronic components on the test main board directly bear severe temperature cycle stress and condensation risk, accelerated ageing and high failure rate, and the test main board also needs a large number of cables to penetrate through the box wall for connection, so that the heat insulation sealing property in the box body is damaged, energy leakage is caused, the temperature control energy consumption is increased, the uniformity and stability of a temperature field in the box are more difficult to maintain, and the accuracy and consistency of test conditions are affected. And the test box must be opened for replacement, upgrading or maintenance of the test main board, the test environment is interrupted, the process is complicated, and the downtime is long, so that the cost is high. Disclosure of Invention The invention aims at a high-low temperature test connection structure of a test board and a storage module based on CXL, and has the advantages that the test board is placed in a mild outdoor environment, so that the temperature-change stress and condensation threat are avoided, the service life is greatly prolonged, the CXL cable is simply sealed, the cavity leakage risk and the energy consumption are reduced, the test environment in the cavity is not required to be interrupted for maintenance and upgrading of the test board, and the hot plug type maintenance is realized. The technical aim of the invention is achieved through the following technical scheme that the CXL-based test board and storage module high-low temperature test connection structure comprises an integral body, a high-low temperature cavity is formed in the integral body, a test main board is arranged on one side of the integral body, CXL interface boards are arranged on one side of the inner part of the high-low temperature cavity and one side of the test main board, which is close to the integral body, and a connecting line is electrically connected between the two CXL interface boards. By adopting the technical scheme, the core test main board is placed in a mild normal-temperature environment, so that direct invasion of severe conditions such as high-low temperature cyclic stress and condensation is thoroughly avoided, the service life of key and expensive main test equipment is greatly prolonged, the overall failure rate of a system is reduced, and only a few CXL high-speed composite cables are required to be subjected to simple and reliable sealing treatment, so that wall penetrating openings are greatly reduced, and the air tightness of a test box is effectively maintained. The temperature control energy consumption is reduced, more importantly, the uniformity and stability of the temperature field in the box are ensured, so that the accuracy of test conditions and the comparability of results are improved, meanwhile, the maintenance, upgrading or software debugging of the test main board is performed outside the box, the 'hot plug' type maintenance is realized, the test task in the box is not required to be interrupted, and the downtime is obviously reduced. And through designing the removable standardized interface board, the same external test mainboard can adapt to DDR, LPDDR, CXL memory module in a flexible way, has shown the commonality that has improved test equipment. The invention is further characterized in that the CXL host controller is integrated in the test main board, the CXL device controller of the host controller is integrated in the CXL interface board at one side of the inner cavity of the high-low temperature cavity, the CXL device controller is tightly attached to the metal substrate with high heat capacity through the heat conducting silica gel pad, and the substrate is fixed in the high-low temperature cavity through the low heat conductivity bracket. By adopting the technical scheme, the heat generated by the CXL equipment controller is absorbed by the heat sink and slowly released, so that the impact on the transient temperature field in the cavity is reduced, and meanwhile, the heat conduction outwards through the interface