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CN-121983400-A - High-moisture-proof multilayer resistor and preparation method thereof

CN121983400ACN 121983400 ACN121983400 ACN 121983400ACN-121983400-A

Abstract

The invention relates to the technical field of electronic components, in particular to a high moisture-proof multilayer resistor and a preparation method thereof, wherein the resistor comprises an alumina substrate, front and back electrodes and a resistor layer between the front and back electrodes, and is characterized in that a first protective layer formed by glass, a second protective layer which correspondingly covers a laser cutting groove and is formed by heat hardening ink, a third protective layer and a fourth protective layer which are formed by at least two layers of epoxy resin, and a fifth protective layer which is formed by resin silver and is positioned at the joint of the electrodes and the protective layers are sequentially laminated on the resistor layer; the preparation method comprises the steps of printing and sintering each functional layer and forming each protective layer in a targeted manner. The invention realizes excellent moisture resistance, long-term electrical stability and high reliability through the multilayer cooperative sealing structure, particularly the reinforced protection of the laser groove and the electrode interface and the epitaxial lap joint of the metal coating, and is suitable for severe environment.

Inventors

  • ZHAO WEIQIANG
  • XIA HOUYU

Assignees

  • 翔声科技（厦门）有限公司

Dates

Publication Date
20260505
Application Date
20260109

Claims (9)

  1. 1. The high moisture-proof multilayer resistor comprises an alumina substrate (1), back electrodes (2) which are arranged on the lower surface of the alumina substrate (1) and are separated from each other, front electrodes (3) which are arranged on the upper surface of the alumina substrate (1) and are separated from each other, and a resistance layer (4) which is connected between the front electrodes (3), and is characterized by further comprising: and a composite protection structure sequentially laminated and covered on the resistance layer (4), wherein the composite protection structure comprises: a first protective layer (5) directly covering the resistor layer (4), wherein the first protective layer (5) is made of glass material; A laser cutting groove which is positioned on the resistance layer (4) and penetrates through the first protective layer (5); The second protective layer (6) is correspondingly covered on the laser cutting groove area, and the second protective layer (6) is arranged on the first protective layer (5) and is formed by thermosetting ink; A third protective layer (7) covering the first protective layer (5) and the second protective layer (6), wherein the third protective layer (7) is made of epoxy resin; A fourth protective layer (8) covering the third protective layer (7), wherein the fourth protective layer (8) is made of epoxy resin; The fifth protective layer (9) is arranged at the end part of the front electrode (3) and is overlapped with the end part of the fourth protective layer (8), and the fifth protective layer (9) is made of resin silver; a side electrode (10) connecting the front electrode (3) and the corresponding side back electrode (2); A nickel plating layer (11) covering the back electrode (2), the side electrode (10), the front electrode (3) and the fifth protective layer (9), and And a tin plating layer (12) which is covered on the nickel plating layer (11) and extends and is lapped to the surface of the fourth protective layer (8).
  2. 2. The high moisture resistance multilayer resistor according to claim 1, wherein the pattern of the resistive layer (4) is square or serpentine.
  3. 3. The high moisture resistance multilayer resistor according to claim 1, wherein the thickness of the third protective layer (7) is different from the thickness of the fourth protective layer (8).
  4. 4. The highly moisture-resistant multilayer resistor as claimed in claim 1, characterized in that the side electrode (10) is formed by a sputtering process, the height of which is flush with the fifth protective layer (9).
  5. 5. A method of making a high moisture resistance multilayer resistor as claimed in any one of claims 1 to 4 comprising the steps of: s1, providing an alumina substrate (1); S2, printing and forming back electrodes (2) separated from each other on the lower surface of an alumina substrate (1), and printing and forming front electrodes (3) separated from each other on the upper surface of the alumina substrate (1); S3, printing resistance paste between the front electrodes (3), and drying and sintering to form a resistance layer (4); s4, printing glass slurry on the resistor layer (4), and drying and sintering to form a first protective layer (5); s5, trimming the resistor layer (4) by laser to form a laser cutting groove penetrating through the first protective layer (5); s6, printing thermosetting ink on the first protective layer (5) corresponding to the laser tangential groove area, and forming a second protective layer (6) after curing; S7, printing a first layer of epoxy resin on the first protective layer (5) and the second protective layer (6), and forming a third protective layer (7) after curing; S8, printing a second layer of epoxy resin on the third protective layer (7), and forming a fourth protective layer (8) after curing; S9, printing resin silver paste at the joint of the end part of the front electrode (3) and the end part of the fourth protective layer (8), and forming a fifth protective layer (9) after curing; S10, sputtering is carried out on the side surface of the alumina substrate (1) to form a side surface electrode (10) which is connected with the front surface electrode (3) and the corresponding side back surface electrode (2); s11, electroplating the surfaces of the back electrode (2), the side electrode (10), the front electrode (3) and the fifth protective layer (9) to form a nickel plating layer (11); and S12, electroplating the surface of the nickel plating layer (11) to form a tin plating layer (12), and extending and overlapping the tin plating layer (12) to the surface of the fourth protective layer (8).
  6. 6. The method of manufacturing a highly moisture-resistant multilayer resistor according to claim 5, wherein in step S2, after printing the materials of the back electrode (2) and the front electrode (3), drying is performed at 180℃and then sintering is performed at 850 ℃.
  7. 7. The method of manufacturing a highly moisture-resistant multilayer resistor according to claim 5, wherein in step S3, after printing the resistance paste, drying is performed at 180℃and sintering is performed at 850 ℃.
  8. 8. The method of manufacturing a highly moisture-resistant multilayer resistor according to claim 5, wherein in step S4, after printing the glass paste, drying is performed at 180℃and sintering is performed at 600 ℃.
  9. 9. The method of manufacturing a highly moisture-resistant multilayer resistor according to claim 5, wherein in steps S7, S8 and S9, after printing the epoxy resin and the resin silver paste, drying is performed at 180℃and then sintering is performed at 220 ℃.

Description

High-moisture-proof multilayer resistor and preparation method thereof Technical Field The invention relates to the technical field of electronic components, in particular to a high-moisture-proof multilayer resistor and a preparation method thereof. Background When a common resistor works in a high humidity environment, moisture permeation can lead to oxidation of internal materials, change of conductivity, reduction of insulation performance, shortening of service life and even failure, and seriously affect the electrical performance and service life of the device. With the development of technology and expansion of application fields, electronic devices are increasingly being applied to extreme or special environments. The development of the moistureproof resistor can widen the application range of the electronic component, and meet the strict requirements under the new scenes, such as intelligent agriculture, deep sea detection, outdoor advertising screens and the like. The increasing demand for moisture resistance resistors in certain industries such as outdoor electronics, marine engineering, aerospace and certain industrial automation has driven the expansion of this market segment For a long time, the high-end resistance market has been monopolized by international industry leaders; Some resistors show a certain tolerance in PCT test, but often have problems of drift of electrical parameters, reduction of insulation resistance and the like in the later stage of the test. This illustrates that existing products remain to be upgraded in terms of coping with rapid humidity intrusion and long-term wet heat stress. Therefore, the moisture-proof performance of the resistor is improved, the maintenance frequency and the maintenance cost can be reduced, the service period of equipment is prolonged, the technical blank can be filled through technical innovation, the autonomous controllability is enhanced, and the high moisture-proof multilayer resistor and the preparation method thereof are provided for the problems. Disclosure of Invention The invention aims to provide a high-moisture-resistance multilayer resistor and a preparation method thereof, which are used for solving the problems in the background technology. In order to achieve the above purpose, the present invention provides the following technical solutions: A high moisture-proof multilayer resistor includes an alumina substrate, back electrodes disposed on the lower surface of the alumina substrate and separated from each other, front electrodes disposed on the upper surface of the alumina substrate and separated from each other, and a resistive layer connected between the front electrodes, and is characterized by further comprising: The composite protection structure is sequentially overlapped and covered on the resistance layer and comprises: the first protective layer directly covers the resistor layer and is made of glass materials; a laser cutting groove which is positioned on the resistance layer and penetrates through the first protective layer; the second protective layer is arranged on the first protective layer and is formed by thermosetting ink; The third protective layer is covered on the first protective layer and the second protective layer and is made of epoxy resin materials; a fourth protective layer covering the third protective layer, the fourth protective layer being made of an epoxy resin material; The fifth protective layer is arranged at the end part of the front electrode and is overlapped with the end part of the fourth protective layer, and the fifth protective layer is made of resin silver; a side electrode connecting the front electrode and the corresponding side back electrode; A nickel plating layer covering the back electrode, the side electrode, the front electrode and the fifth protective layer, and And the tin plating layer is covered on the nickel plating layer and extends to overlap the surface of the fourth protective layer. As a preferred embodiment, the resistive layer is patterned in a square or serpentine shape. As a preferred embodiment, the thickness of the third protective layer is different from that of the fourth protective layer. As a preferred embodiment, the side electrode is formed by a sputtering process, and its height is flush with the fifth protective layer. A method of making a high moisture resistance multilayer resistor comprising the steps of: s1, providing an alumina substrate; S2, printing and forming back electrodes separated from each other on the lower surface of the aluminum oxide substrate, and printing and forming front electrodes separated from each other on the upper surface of the aluminum oxide substrate; s3, printing resistance paste between the front electrodes, and drying and sintering to form a resistance layer; S4, printing glass paste on the resistor layer, and drying and sintering to form a first protective layer; S5, trimming the resistor layer by laser to form a lase