CN-121983410-A - Power module, manufacturing method thereof and power system

Abstract

The invention provides a power supply module, a manufacturing method thereof and a power supply system, wherein the power supply module comprises a coupling inductor and a substrate stacked below the coupling inductor, the coupling inductor comprises a skeleton type magnetic core structure, a first winding and a second winding which are wound on the skeleton type magnetic core structure, a magnetic package body which encapsulates the skeleton type magnetic core structure and the first winding and the second winding, at least a bare chip is encapsulated in the substrate, and the coupling inductor is electrically connected with pins corresponding to the bare chip in the power supply module. The first winding and the second winding are wound on a skeleton-type magnetic core structure, the skeleton-type magnetic core structure has a manufacturing effect on the first winding and the second winding, and when the magnetic packaging bodies which are packaged outside the skeleton-type magnetic core structure and the first winding and the second winding are pressed, the first winding and the second winding can be effectively prevented from being pressed and deformed, so that the manufacturing stability of the power supply module is improved.

Inventors

• DAI KE
• YAN JIAJIA
• HUANG QIUKAI
• LI CHAO
• DENG XIAOBIN

Assignees

• 合肥矽力杰半导体技术有限公司

Dates

Publication Date

20260505

Application Date

20251231

Claims (20)

1. 1. A power supply module is characterized by comprising a coupling inductor and a substrate stacked below the coupling inductor, The coupling inductor comprises a skeleton magnetic core structure, a first winding and a second winding wound on the skeleton magnetic core structure, and A magnetic package encapsulating the skeletal magnetic core structure and the first and second windings, At least a bare chip is encapsulated in the substrate; and the coupling inductor is electrically connected with a pin corresponding to the bare chip in the power supply module.
2. 2. The power module of claim 1, wherein the power module comprises a plurality of power modules, The skeleton-type magnetic core structure comprises a winding part positioned in the middle and fixing parts respectively positioned at two ends of the winding part.
3. 3. The power module of claim 2, wherein the power module comprises a power source, The fixing portion is in contact with the substrate, and the winding portion is separated from the substrate.
4. 4. The power module of claim 2, wherein the power module comprises a power source, The first winding and the second winding are wound around the winding portion.
5. 5. The power module of claim 2, wherein the power module comprises a power source, The winding part and the fixing part are of an integrally formed structure.
6. 6. The power module of claim 5, wherein the power module comprises a power source, The winding part and the fixing part are of a solidified integrated structure formed by adopting a heat treatment process after being pressed and formed by adopting metal powder.
7. 7. The power module of claim 1, wherein the power module comprises a plurality of power modules, The distance between the first winding and the second winding is adjusted to obtain different coupling coefficients.
8. 8. The power module of claim 7, wherein the power module comprises a power source, The larger the distance between the first winding and the second winding, the smaller the coupling coefficient of the coupling inductance.
9. 9. The power module of claim 1, wherein the power module comprises a plurality of power modules, The substrate is patterned to expose pins of the bare chip.
10. 10. The power module of claim 1, wherein the power module comprises a plurality of power modules, The magnetic package is formed by a pressing process.
11. 11. The power module of claim 10, wherein the power module comprises a power source, The magnetic package includes an epoxy organic material and a magnetic metal material.
12. 12. The power module according to claim 1, the power module is characterized by further comprising: And the insulating layer is coated on the outer side of the skeleton-type magnetic core structure and is used for isolating the first winding and the second winding from the skeleton-type magnetic core structure.
13. 13. A method of manufacturing a power module, comprising: A skeleton-type magnetic core structure is formed, Forming a first winding and a second winding on the skeleton-type magnetic core structure, A substrate is formed having at least a bare chip enclosed therein, Fixing the skeleton magnetic core structure on the substrate, electrically connecting the heads of the first winding and the second winding with pins corresponding to the bare chip, And forming a magnetic packaging body at the skeleton type magnetic core structure and the outer ends of the first winding and the second winding.
14. 14. The method of manufacturing according to claim 13, wherein, The method for forming the skeleton-type magnetic structure comprises the steps of carrying out compression molding on metal powder, and then solidifying the skeleton-type magnetic structure by adopting a heat treatment process.
15. 15. The method of manufacturing according to claim 14, wherein, The temperature range of the heat treatment process is 200-800 ℃.
16. 16. The method of manufacturing according to claim 14, wherein, The skeleton after compression molding is of a magnetic structure and comprises a winding part positioned in the middle and fixing parts respectively positioned at two ends of the winding part.
17. 17. The method of manufacturing according to claim 13, wherein, The method for forming the magnetic packaging body at the outer ends of the framework type magnetic core structure and the first winding and the second winding comprises the step of pressing packaging materials mixed with epoxy organic materials and magnetic metal materials at the outer ends of the framework type magnetic core structure and the first winding and the second winding.
18. 18. The method of manufacturing according to claim 17, wherein, The temperature range of the pressing is 180-200 ℃.
19. 19. The method of manufacturing according to claim 17, wherein, The pressure interval of the pressing is 5MPa-6MPa.
20. 20. The method of manufacturing of claim 13, wherein prior to forming the first winding and the second winding on the skeletal magnetic core structure, the method further comprises: and coating an insulating layer on the outer side of the skeleton-type magnetic core structure, wherein the insulating layer is used for isolating the first winding and the second winding from the skeleton-type magnetic core structure.

Description

Power module, manufacturing method thereof and power system Technical Field The invention belongs to the technical field of semiconductor device manufacturing, and particularly relates to a power supply module, a manufacturing method thereof and a power supply system. Background At present, the power module manufactured by adopting the packaging process has the advantages of high process integration level and high power density, so that the power module becomes the development direction of the power module product. In production, the inductance winding is easy to deform in the process of pressing and forming the packaging material, so that the inductance is changed, and the produced product has a poor consistency, so that the power supply module cannot realize the functional design. Disclosure of Invention In view of the above-mentioned drawbacks of the prior art, an objective of the present invention is to provide a power module, a manufacturing method thereof, and a power system for solving the technical problem of poor consistency of output of the power module in the prior art. The application provides a power supply module which comprises a coupling inductor and a substrate stacked below the coupling inductor, wherein the coupling inductor comprises a skeleton type magnetic core structure, a first winding and a second winding which are wound on the skeleton type magnetic core structure, and a magnetic package body which encapsulates the skeleton type magnetic core structure and the first winding and the second winding, at least a bare chip is encapsulated in the substrate, and the coupling inductor is electrically connected with pins corresponding to the bare chip in the power supply module. Preferably, the skeleton-type magnetic core structure comprises a winding part in the middle and fixing parts respectively positioned at two ends of the winding part. Preferably, the fixing portion is in contact with the substrate, and the winding portion is separated from the substrate. Preferably, the first winding and the second winding are wound around the winding portion. Preferably, the winding part and the fixing part are integrally formed. Preferably, the winding part and the fixing part are of a solidified integrated structure formed by adopting a heat treatment process after being pressed and formed by adopting metal powder. Preferably, the distance between the first winding and the second winding is adjusted to obtain different coupling coefficients. Preferably, the larger the distance between the first winding and the second winding, the smaller the coupling coefficient of the coupling inductance. Preferably, the substrate is patterned to expose pins of the bare chip. Preferably, the magnetic package is formed by a pressing process. Preferably, the magnetic package includes an epoxy organic material and a magnetic metal material. Preferably, the power supply module further comprises an insulating layer coated on the outer side of the skeleton-type magnetic core structure, and the insulating layer is used for isolating the first winding and the second winding from the skeleton-type magnetic core structure. In a second aspect, the application provides a method for manufacturing a power module, including forming a skeleton-type magnetic core structure, forming a first winding and a second winding on the skeleton-type magnetic core structure, forming a substrate with at least a bare chip enclosed therein, fixing the skeleton-type magnetic core structure on the substrate, electrically connecting the heads of the first winding and the second winding with pins corresponding to the bare chip, and forming a magnetic package on the skeleton-type magnetic core structure and the outer ends of the first winding and the second winding. Preferably, the method for forming the skeleton-type magnetic structure comprises the steps of performing compression molding on metal powder, and then curing the skeleton-type magnetic structure by adopting a heat treatment process. Preferably, the temperature range of the heat treatment process is 200-800 ℃. Preferably, the skeleton after compression molding is a magnetic structure and comprises a winding part positioned in the middle and fixing parts respectively positioned at two ends of the winding part. Preferably, the method for forming the magnetic packaging body at the outer ends of the framework type magnetic core structure and the first winding and the second winding comprises the step of pressing packaging materials mixed with epoxy organic materials and magnetic metal materials at the outer ends of the framework type magnetic core structure and the first winding and the second winding. Preferably, the temperature range of the pressing is 180 ℃ to 200 ℃. Preferably, the pressure interval of the pressing is 5MPa-6MPa. Preferably, before forming the first winding and the second winding on the skeleton-type magnetic core structure, the method further comprises coating an insula