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CN-121983415-A - SMD common mode inductor with terminals on side surfaces and firm welding and preparation process thereof

CN121983415ACN 121983415 ACN121983415 ACN 121983415ACN-121983415-A

Abstract

The invention discloses a firmly welded patch common mode inductor with terminals on the side and a preparation process thereof, belonging to the technical field of patch common mode inductor preparation, comprising the following steps of S1, selecting a bare magnetic core, wherein the initial magnetic permeability of nickel-zinc ferrite is 10-2000uiac, the initial magnetic permeability of manganese-zinc ferrite is more than 2000uiac, and cleaning and drying the bare magnetic core; S2, sticking the Clip on the magnetic core by using high-temperature-resistant high-strength epoxy resin glue, wherein the curing temperature is 150 ℃, the curing time is 90min, and the positioning tool is adopted to ensure the position accuracy of the Clip, and S3, plating Ni/Sn outside the magnetic core with the Clip stuck, wherein the plating thickness is Ni2-4 mu m and Sn7.0 mu mmin. In the welding optimization link, the invention adopts the solder dropping operation of the reflow oven, precisely controls the component proportion of the solder paste and the welding temperature curve, and greatly improves the stability and the service life of the product.

Inventors

  • YIN HANG
  • SONG KAIBO

Assignees

  • 尹航
  • 宋凯波

Dates

Publication Date
20260505
Application Date
20260318

Claims (7)

  1. 1. The preparation process of the patch common-mode inductor with the terminal on the side surface and firm welding is characterized by comprising the following steps of: S1, selecting a bare magnetic core, wherein the initial magnetic permeability of nickel-zinc ferrite is 10-2000uiac, and the initial magnetic permeability of manganese-zinc ferrite is more than 2000uiac, and cleaning and drying the bare magnetic core; S2, sticking the Clip on the magnetic core by using high-temperature-resistant high-strength epoxy resin glue, wherein the curing temperature is 150 ℃, the curing time is 90 minutes, and the positioning tool is adopted to ensure the position accuracy of the Clip; S3, plating Ni/Sn outside the magnetic core adhered with the Clip, wherein the plating thickness is Ni2-4 mu m, sn is more than or equal to 7.0 mu m, the current density is controlled to be 1-5A/dm < 2 > in the plating process, and the plating time is 10-30min; S4, selecting copper wires with proper specifications, and winding by using a winding machine to control winding tension according to a winding mode of 1to 4 groups of wires and 2 to 3 groups of wires from a starting section (left side) to an ending section (right side); S5, fixing the cover plate by using high-temperature-resistant high-strength epoxy resin glue, wherein the curing temperature is 150 ℃ and the curing time is 90 minutes, and completing the installation and the fixation of the assembled cover plate; s6, paint stripping treatment is carried out on the to-be-welded part of the inductor, a laser paint stripping device is adopted to remove insulating paint on the surface of a copper wire, the laser paint stripping power is precisely controlled, a reflow soldering furnace is adopted to carry out solder paste solidification welding operation after a solder paste is coated at a paint stripping position, performance detection is carried out after product manufacturing is completed, wherein the component ratio of the solder paste is Sn 96.5/Ag 3/Cu 0.5, nitrogen is introduced in the welding heating process for protection, and the attached surface is prevented from oxidation.
  2. 2. The process for manufacturing a firmly welded chip common mode inductor with terminals on the side according to claim 1, wherein the diameter of the copper wire is selected according to the performance requirement of the inductor, and the winding tension is controlled to be 15-25g.
  3. 3. The process for manufacturing the firmly welded patch common mode inductor with the terminals on the side surfaces, according to claim 1, wherein the positioning tool is provided with a positioning structure matched with the magnetic core and the Clip, and the accuracy error of the Clip pasting position is ensured to be within +/-0.1 mm.
  4. 4. The process for manufacturing the firmly welded chip common mode inductor with the terminal on the side surface according to claim 1, wherein the current density is controlled to be 1-5A/dm2 and the electroplating time is controlled to be 10-30min in the electroplating process.
  5. 5. The process for manufacturing the firmly welded patch common-mode inductor with the terminals on the side surface according to claim 1, wherein the performance detection comprises the testing of an inductance value, a quality factor and a direct-current resistance parameter, the error range of the inductance value is within +/-5%, the quality factor meets the design requirement, and the error range of the direct-current resistance is within +/-10%.
  6. 6. The chip common mode inductor with terminals on the side surfaces and firm in welding, which is prepared by the preparation process of the chip common mode inductor, comprises a bare magnetic core, a guide piece, a composite conductive coating and a coil winding, wherein the composite conductive coating is coated on the surface of the bare magnetic core, the coil winding is wound or welded on the surface of the composite conductive coating, and the guide piece is adhered to a designated position of the bare magnetic core through epoxy resin glue.
  7. 7. Use of a firmly soldered patch common mode inductor with terminals on the sides according to claim 6 in electronic devices including but not limited to power modules, communication devices, consumer electronics.

Description

SMD common mode inductor with terminals on side surfaces and firm welding and preparation process thereof Technical Field The invention relates to the technical field of preparation of a patch common mode inductor, in particular to a patch common mode inductor with terminals on side surfaces and firm welding and a preparation process thereof. Background The common mode inductance is an electromagnetic interference suppression element commonly used in a power circuit and a signal transmission circuit, and the core structure of the common mode inductance generally comprises a magnetic core body and a coil winding wound on the magnetic core body, wherein the coil winding is required to be electrically conducted with an external circuit through a conductive connection structure so as to exert the common mode suppression function. In the conventional common-mode inductance manufacturing process, an electroplating process is generally adopted to form a conductive coating on the surface of the magnetic core body, so that the conductive coating is used as a connection medium between the coil winding and an external circuit. However, the conventional electroplating process has a plurality of technical defects, so that the use reliability and environmental adaptability of the common-mode inductor are severely limited, firstly, the bonding force between a conductive coating formed by electroplating and a magnetic core body is limited, and after an end customer welds the common-mode inductor on a plate, if equipment is in a high-vibration working environment, the coating is easy to peel off, crack and even fall off, so that a circuit is directly conducted and fails, equipment faults are caused, secondly, the process consistency of the electroplating process is poor, the problems of uneven coating thickness, fluctuation of conductivity and the like are difficult to avoid, the adverse effects on the impedance characteristic, the filtering effect and other core electrical properties of the common-mode inductor are caused, thirdly, the electroplating process involves links such as the allocation of chemical plating solution, the waste water treatment and the like, the flow is complicated, the production cost is high, and certain environmental protection and control pressure exists. And welding is a key link in the preparation process of the patch common-mode inductor, and the welding quality directly influences the reliability and stability of the inductor. However, the existing manufacturing process has some problems in terms of welding. On the one hand, oxidation phenomenon easily appears in the welding process, leads to copper line and terminal surface's contact resistance to increase, influences welded conductivity. Under the high-temperature welding environment, the surfaces of the copper wires and the terminals are easy to react with oxygen in the air to generate an oxide layer, so that the contact resistance is increased, and the welding quality is reduced. On the other hand, the control of welding process parameters is not accurate enough, such as fluctuation of parameters of welding temperature, welding time and the like, can lead to unstable quality of welding spots, generate the problems of cold joint, false joint and the like, and influence the electrical connection reliability of the inductor. With the development of electronic devices toward miniaturization, high reliability and strong vibration resistance, the performance requirements of terminal application scenes on common-mode inductors are more severe, and particularly in the fields of automobile electronics, industrial control, rail transit and the like where vibration is frequent, the common-mode inductors prepared by the traditional electroplating process are difficult to meet the actual use requirements. Therefore, development of a novel magnetic core conductive connection structure is needed to replace the conventional electroplating process, so as to solve the technical pain of insufficient reliability of the common-mode inductor in a high-vibration environment, and improve the process stability and environmental adaptability of the product. Disclosure of Invention The invention aims to solve the problems in the prior art, and provides a chip common mode inductor with terminals on the side surfaces and firm welding and a preparation process thereof. In order to achieve the above purpose, the present invention adopts the following technical scheme: The preparation process of the patch common mode inductor with the terminal on the side surface and firm welding comprises the following steps: S1, selecting a bare magnetic core, wherein the initial magnetic permeability of nickel-zinc ferrite is 10-2000uiac, and the initial magnetic permeability of manganese-zinc ferrite is more than 2000uiac, and cleaning and drying the bare magnetic core; S2, sticking the Clip on the magnetic core by using high-temperature-resistant high-strength epoxy resin glue, whe