Search

CN-121983423-A - Processing technology and equipment for preventing melting loss of SMD patch mounting annular inductor

CN121983423ACN 121983423 ACN121983423 ACN 121983423ACN-121983423-A

Abstract

The invention discloses a processing technology and equipment for installing an annular inductor on an anti-melting SMD patch, relates to the technical field of annular inductor processing, and solves the technical problem that the existing annular inductor is easy to be subjected to cold joint in the soldering tin process, and comprises a lower bending ring, an upper bending ring and a lower bending ring, wherein the lower bending ring is arranged on the periphery of a rotating disk and can move up and down in a through hole; the upper extrusion ring is arranged on the top seat in a lifting manner and moves relative to the lower bending ring so as to vertically bend the enameled wire placed on the rotary disk, the pressure plate is arranged on the top seat in a lifting manner, a plurality of telescopic arc-shaped bending plates are arranged on the outer peripheral surface of the pressure plate in an array manner, and the arc-shaped bending plates transversely bend the enameled wire which is vertically bent through telescopic action. According to the invention, vertical bending is realized through the cooperation of the lower bending ring and the upper extrusion ring, transverse bending is realized through the arc bending plate, and the enameled wire is wound on the guide pin through the manipulator, so that the whole process is finished, the operation is more automatic, and the problem of cold joint is avoided.

Inventors

  • CHEN LIN

Assignees

  • 惠州市长瑞智造电子有限公司

Dates

Publication Date
20260505
Application Date
20260331

Claims (10)

  1. 1. Processing equipment of preventing melting loss SMD paster installation toroidal inductor, characterized in that includes: A through hole (111) is arranged on the top surface of the base (1), A rotary disk (11) rotatably disposed in the through hole (111); a lower bending ring (12) which is arranged on the periphery of the rotary disk (11) and can move up and down in the through hole (111); the top seat (3) is positioned above the base (1); The upper extrusion ring (38) is arranged on the top seat (3) in a lifting manner and moves relative to the lower bending ring (12) so as to vertically bend the enameled wire placed on the rotary disk (11); the pressing plate (34) is arranged on the top seat (3) in a lifting manner, a plurality of telescopic arc-shaped bending plates (36) are arranged on the outer peripheral surface of the pressing plate in an array manner, and the arc-shaped bending plates (36) transversely bend the enameled wires which are vertically bent through telescopic actions; and the manipulator (313) is arranged on the top seat (3) and winds the transversely bent enameled wire on the guide pin (102).
  2. 2. The processing device for the anti-melting-loss SMD patch mounted toroidal inductor according to claim 1, wherein a plurality of notches (121) are formed in a surface array of said lower bending ring (12), each notch (121) corresponds to an enameled wire one by one, and a diameter of said notch (121) is adapted to a diameter of the enameled wire.
  3. 3. The processing device for the anti-melting-loss SMD patch mounting toroidal inductor according to claim 1, wherein a sleeve (131) is fixedly mounted at the top center of the rotating disc (11), a fixed cylinder (132) is fixedly mounted inside the sleeve (131), and a first semicircle (133) is fixedly mounted at the top of a piston rod of the fixed cylinder (132); a plurality of moving rods (134) which are inserted into the sleeve (131) are equidistantly arranged on the outer peripheral surface of the sleeve (131), a return spring (135) is sleeved on one end of the moving rod (134) which is positioned in the sleeve (131), a second semicircular ball (136) is fixedly arranged at the end of the moving rod (134), and an arc-shaped plate (137) is fixedly arranged at the end of the moving rod (134) which is positioned outside the sleeve (131).
  4. 4. The processing device for the anti-melting-loss SMD patch mounting toroidal inductor according to claim 1, wherein a bending cylinder (16) is fixedly arranged in the base (1), a jacking disc (17) is fixedly arranged at the top of a piston rod of the bending cylinder (16), a plurality of jacking columns (18) are arranged on a top array of the jacking disc (17), and the top of the jacking columns (18) is fixedly connected with the lower bending ring (12).
  5. 5. The processing device for the anti-melting-loss SMD patch mounting toroidal inductor according to claim 1, wherein an extrusion cylinder (31) is fixedly mounted in the top seat (3), an extrusion disc (32) is fixedly mounted at the bottom of a piston rod of the extrusion cylinder (31), and the bottom of the extrusion disc (32) is connected with an upper extrusion ring (38) through a plurality of connecting columns (37).
  6. 6. The processing device for the annular inductor mounted on the anti-melting-loss SMD patch according to claim 5, wherein a lifting cylinder (33) is fixedly mounted at the bottom center of the extrusion disc (32), a pressure disc (34) is fixedly mounted on a piston rod of the lifting cylinder (33), the pressure disc (34) is located between the extrusion disc (32) and the upper extrusion ring (38), a plurality of telescopic cylinders (35) are mounted on the outer circumferential surface of the pressure disc (34), and an arc-shaped bending plate (36) is fixedly mounted at the end part of each telescopic cylinder (35).
  7. 7. The apparatus for manufacturing a fusion-damage-preventing SMD patch mounted toroidal inductor according to claim 6, wherein a lower end surface of said arc-shaped folded plate (36) is higher by 1mm than a lower end surface of said platen (34).
  8. 8. The processing device for the anti-melting-loss SMD patch mounted toroidal inductor according to claim 7, wherein a rotating motor (39) is fixedly mounted at the bottom of said top base (3), a transverse moving assembly (311) is fixedly mounted on an output shaft of said rotating motor (39), a longitudinal moving assembly (312) is mounted on said transverse moving assembly (311), and a manipulator (313) is mounted on said longitudinal moving assembly (312).
  9. 9. The processing device for the anti-melting-loss SMD patch mounting toroidal inductor according to claim 8, wherein the toroidal inductor comprises a shell (100) and a coil (200) mounted in the shell, a plurality of round holes (103) are formed in the shell (100) and used for enabling enameled wires after vertical bending to pass through, a plurality of guide grooves (104) are formed in the top surface of the shell (100), each guide groove (104) is matched with an arc-shaped bending plate (36), a boss (101) is arranged on one side of each guide groove (104), the boss (101) is 1mm in height and used for being matched with the arc-shaped bending plate (36) to transversely bend the enameled wires, a guide needle (102) is arranged on one side of each boss (101) and is arranged with a rotating motor (39), a gap exists between each boss (101) and each guide needle (102), and after the enameled wires are clamped by a manipulator (313), the enameled wires are wound on the guide needles (102) in a rotating mode.
  10. 10. The processing technology of the anti-melting-loss SMD patch mounting toroidal inductor is characterized by comprising the following steps of: Firstly, placing a coil (200) outside a sleeve (131), placing each enameled wire in a notch (121), and then fixing the coil (200) from inside through an arc-shaped plate (137); Step two, the upper extrusion ring (38) descends to press the enameled wire, and the lower bending ring (12) ascends to vertically bend the enameled wire; The third step, the upper extrusion ring (38) and the lower bending ring (12) are reset, the shell (100) is covered on the coil (200), the enameled wire passes through the round hole (103), the pressure plate (34) is driven to descend, the arc-shaped bending plate (36) is driven to move outwards for a certain distance through the telescopic cylinder (35) at the moment because the arc-shaped bending plate (36) is higher than the lower end face of the pressure plate (34), the pressure plate (34) is driven to descend continuously, the pressure plate (34) is contacted with the top of the shell (100) to fix the arc-shaped bending plate (36) is inserted into the guide groove (104), the telescopic cylinder (35) is driven to drive the arc-shaped bending plate (36) to move horizontally, and the enameled wire is transversely bent under the action of the boss (101); Fourthly, clamping the end part of the enameled wire through a mechanical arm (313), then starting a rotating motor (39), driving the mechanical arm (313) to rotate, winding one enameled wire on a guide pin (102), enabling the enameled wire to have a distance of 1mm from the bottom surface at the hitching leg position of the guide pin (102) under the action of a boss (101), and then driving a rotating disk (11) to rotate, so that a plurality of enameled wires are wound on the corresponding guide pin (102) gradually to obtain an annular inductor; And fifthly, soldering tin is carried out on the annular inductor, the top surface of the annular inductor is immersed in the tin, and two pins are soldered each time.

Description

Processing technology and equipment for preventing melting loss of SMD patch mounting annular inductor Technical Field The invention relates to the technical field of annular inductor processing, in particular to a processing technology and equipment for a melting loss prevention SMD patch mounting annular inductor. Background There are two types of toroidal inductors in the prior art, as shown in fig. 12 (only the wire is wound around the pad) and fig. 13: 1. The outer bonding pad type bonding pad is arranged outside the shell, the annular inductor is placed in the shell, four enamelled wires are wound on the four bonding pads, and then the bonding pad type bonding pad is pulled out and soldered. Disadvantages: 1. the bonding pad is eight outside and does not meet the technological requirements of customers, 2. The pad size exceeds the housing, increasing the product body size. 3. In the technical process, the tin surface of the soldering procedure is too close to the winding toroidal inductor body, the soldering time is long, soldering heat can hurt enameled wires wound on the magnetic ring, melting loss is caused, and quality hidden trouble is brought. 4. The enameled wire can directly wind on the bonding pad, and the bonding pad can be deformed in the wire pulling process, so that the flatness of the bonding pad is uneven, and the flatness error required by customers is less than 0.05mm. 2. The inner bonding pad is arranged inside the shell and is pasted inwards, the size of the inner bonding pad is not larger than that of the shell, and the client surface pasting technology is easier to realize. Disadvantages: 1. In the technical process, the tin surface of the soldering procedure is too close to the winding toroidal inductor body, the soldering time is long, soldering heat can hurt enameled wires wound on the magnetic ring, melting loss is caused, and quality hidden trouble is brought. 2. The enameled wire can directly wind on the bonding pad, and the bonding pad can be deformed in the wire pulling process, so that the flatness of the bonding pad is uneven, and the flatness error required by customers is less than 0.05mm. Disclosure of Invention The invention aims to provide a processing technology and equipment for a melting loss prevention SMD patch mounting annular inductor, which solve the technical problem that the existing annular inductor is easy to be subjected to cold joint in the soldering process. The aim of the invention can be achieved by the following technical scheme: a processing apparatus for a melting loss prevention SMD patch mounted toroidal inductor, comprising: A through hole is arranged on the surface of the top of the base, A rotating disk rotatably disposed in the through hole; The lower bending ring is arranged on the periphery of the rotating disc and can move up and down in the through hole; The top seat is positioned above the base; the upper extrusion ring is arranged on the top seat in a lifting manner and moves relative to the lower bending ring so as to vertically bend the enameled wire placed on the rotating disk; The pressing plate is arranged on the top seat in a lifting manner, a plurality of telescopic arc-shaped bending plates are arranged on the outer peripheral surface of the pressing plate in an array manner, and the arc-shaped bending plates transversely bend the vertically bent enameled wires through telescopic actions; and the manipulator is arranged on the top seat and winds the enameled wire which is transversely bent on the guide pin. As a further scheme of the invention, a plurality of notches are formed in the surface array of the lower bending ring, each notch corresponds to the enameled wire one by one, and the diameter of each notch is matched with the diameter of the enameled wire. The invention further provides a scheme that a sleeve is fixedly arranged at the center of the top of the rotating disc, a fixed cylinder is fixedly arranged in the sleeve, and a first semicircle is fixedly arranged at the top of a piston rod of the fixed cylinder; The outer peripheral surface of the sleeve is provided with a plurality of moving rods which are inserted into the sleeve at equal intervals, one end of the moving rod positioned in the sleeve is sleeved with a reset spring, the end part of the moving rod is fixedly provided with a second semicircle sphere, and the end part of the moving rod positioned outside the sleeve is fixedly provided with an arc plate. As a further scheme of the invention, a bending cylinder is fixedly arranged in the base, a jacking disc is fixedly arranged at the top of a piston rod of the bending cylinder, a plurality of jacking columns are arranged at the top of the jacking disc in an array manner, and the tops of the jacking columns are fixedly connected with a lower bending ring. As a further scheme of the invention, an extrusion cylinder is fixedly arranged in the top seat, an extrusion disc is fixedly arranged at the bottom of a