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CN-121983846-A - Semiconductor laser and temperature control method

CN121983846ACN 121983846 ACN121983846 ACN 121983846ACN-121983846-A

Abstract

The invention discloses a semiconductor laser and a temperature control method, wherein the semiconductor laser comprises an outer shell, a driving plate, a laser light source module and a liquid cooling plate, wherein the outer shell is fixed on the liquid cooling plate, the driving plate and the laser light source module are both arranged on the liquid cooling plate, and the driving plate and the laser light source module are both positioned in the outer shell. The laser light source module comprises a light source shell, a vapor chamber, a TEC semiconductor refrigerating sheet, a laser component PCB, a first temperature sensor and a second temperature sensor. The invention provides a semiconductor laser and a temperature control method, which adopts a TEC semiconductor refrigerating sheet to finely control the temperature of a laser component, and the whole body dissipates heat through a vehicle body liquid cooling system, so that the power consumption fluctuation is reduced while the internal temperature of a laser light source module is maintained stable.

Inventors

  • LIU JIE

Assignees

  • 常州星宇车灯股份有限公司

Dates

Publication Date
20260505
Application Date
20260204

Claims (7)

  1. 1. The semiconductor laser is characterized by comprising an outer shell (1), a driving plate (3), a laser light source module (2) and a liquid cooling plate (4), wherein the outer shell (1) is fixed on the liquid cooling plate (4), the driving plate (3) and the laser light source module (2) are both arranged on the liquid cooling plate (4), and the driving plate (3) and the laser light source module (2) are both positioned in the outer shell (1).
  2. 2. The semiconductor laser device according to claim 1, wherein the laser light source module (2) comprises a light source shell (5), a soaking plate (7), a TEC semiconductor refrigerating sheet (6), a laser component PCB (8), a first temperature sensor (9) and a second temperature sensor (10), wherein the laser component PCB (8) is fixed in the light source shell (5), the soaking plate (7) is arranged below the laser component PCB (8), the TEC semiconductor refrigerating sheet (6) is arranged below the soaking plate (7), the liquid cooling plate (4) is arranged below the TEC semiconductor refrigerating sheet (6), the first temperature sensor (9) is arranged on the laser component PCB (8), and the second temperature sensor (10) is arranged on the bottom surface of the TEC semiconductor refrigerating sheet (6).
  3. 3. The semiconductor laser device according to claim 2, wherein a heat-conducting silicone grease is arranged between the liquid cooling plate (4) and the TEC semiconductor refrigerating plate (6).
  4. 4. The semiconductor laser according to claim 2, characterized in that the outer surface of the light source housing (5) is provided with a heat insulating layer.
  5. 5. The semiconductor laser device according to claim 1, wherein the liquid cooling plate (4) is provided with a liquid inlet (41) and a liquid outlet (42).
  6. 6. A method of controlling the temperature of a semiconductor laser according to any one of claims 1 to 5, comprising the steps of: Step S1, after the semiconductor laser is electrified, cooling liquid supply to a liquid cooling plate (4) is started, and then a first current I in for TEC working is input to a TEC semiconductor refrigerating plate (6) according to a preset temperature T set , and the TEC semiconductor refrigerating plate (6) is started; s2, detecting and acquiring the temperature of a light source shell (5) of the laser light source module (2) through a first temperature sensor (9), wherein the temperature is T low , detecting and acquiring the temperature of a contact surface of the liquid cooling plate (4) and the laser light source module (2) through a second temperature sensor (10), wherein the temperature is T h , setting a low temperature threshold value, namely T min , setting a high temperature threshold value, namely T max , and calculating the temperature difference of a cold surface and a hot surface of the TEC semiconductor refrigerating sheet (6), namely DeltaT; S3, if T low ＜T set is met, whether T low is larger than or equal to T min is further judged, if T low ≥T min is met, the laser light source module (2) is started, if T low ＜T min is met, the second working current I inh of the TEC is input into the TEC semiconductor refrigerating sheet (6), and the TEC semiconductor refrigerating sheet (6) is started to be heated reversely; Step S4, if T low ≥T set is reached, further judging whether the delta T is smaller than or equal to 40 ℃; if the delta T is less than or equal to 40 ℃, the following steps are carried out: When T low ≤T max is carried out, the laser light source module (2) is started, then if delta T is less than or equal to 20 ℃, the flow of cooling liquid in the liquid cooling plate (4) is reduced, and if delta T is more than 20 ℃, the first working current I in of the TEC is calculated and corrected according to delta T and T min , and the refrigeration power of the TEC semiconductor refrigeration piece (6) is adjusted; if DeltaT >40 ℃, the following steps are entered: And when T low ≤T max is carried out, the flow rate of the cooling liquid in the liquid cooling plate (4) is increased, and when T low ＞T max is carried out, the semiconductor laser thermal protection is closed.
  7. 7. The method according to claim 6, wherein the expression of the temperature difference Δt between the cold and hot surfaces of the TEC semiconductor cooling fin (6) is as follows: ΔT=T h -T low ; Wherein T h is the contact surface temperature of the liquid cooling plate (4) and the laser light source module (2), and T low is the light source housing (5) temperature of the laser light source module (2).

Description

Semiconductor laser and temperature control method Technical Field The invention relates to a semiconductor laser and a temperature control method, and belongs to the technical field of vehicle-mounted laser light sources. Background At present, in the age that automobile intellectualization is continuously promoted, people pay more attention to human-computer interaction experience, and requirements on light effects are higher and higher. The laser light source has the advantages of high brightness, wide color gamut, good reliability, energy conservation, environmental protection and the like, and is widely applied to various projection devices. However, due to the special properties of the laser light source, the application in the vehicle-mounted field is limited. Semiconductor lasers are commonly used as laser light sources, and the electro-optical conversion efficiency and reliability of the semiconductor lasers are closely related to the working temperature of the lasers. For example, the input power required by a red laser to output 2.5W red light at a diode case temperature of 35 ℃ is more than 1.25 times the input power required at a diode case temperature of 25 ℃. Therefore, in order to obtain better electro-optical efficiency and stable optical power output, the optical fiber can be generally used only in a stable temperature environment, and the temperature needs to be not more than 35 ℃. Because the temperature environment of the cabin on the vehicle is severe, the temperature in the cabin can reach more than 80 ℃ generally, and the temperature is too low in extremely cold weather, so that the application of the laser light source is greatly limited. In the prior art, the radiator of the semiconductor laser has large volume and high noise of the radiating fan, and is not beneficial to the development of light weight and silence of automobiles. The small semiconductor laser cannot normally work in a cabin high-temperature environment due to heat dissipation limitation, and the small semiconductor laser is placed in a cabin, so that the noise of a heat dissipation fan is high, and the problem of being unfavorable for silencing an automobile is solved. Disclosure of Invention The invention aims to solve the technical problems of overcoming the defects of the prior art and providing a semiconductor laser and a temperature control method, wherein the temperature of a laser component is finely controlled by adopting a TEC semiconductor refrigerating piece, and the whole body dissipates heat through a vehicle body liquid cooling system, so that the power consumption fluctuation is reduced while the internal temperature of a laser light source module is maintained stable. In order to solve the technical problems, the technical scheme of the invention is as follows: The invention provides a semiconductor laser, which comprises an outer shell, a driving plate, a laser light source module and a liquid cooling plate, wherein the outer shell is fixed on the liquid cooling plate, the driving plate and the laser light source module are both arranged on the liquid cooling plate, and the driving plate and the laser light source module are both positioned in the outer shell. Further, the laser light source module includes light source casing, vapor chamber, TEC semiconductor refrigeration piece, laser components and parts PCB board, first temperature sensor and second temperature sensor, laser components and parts PCB board is fixed in the light source casing, the vapor chamber sets up in the below of laser components and parts PCB board, TEC semiconductor refrigeration piece sets up in the below of vapor chamber, the liquid cooling board sets up in the below of TEC semiconductor refrigeration piece, first temperature sensor sets up on laser components and parts PCB board, second temperature sensor sets up the bottom surface at TEC semiconductor refrigeration piece. Further, a heat conduction silicone grease is arranged between the liquid cooling plate and the TEC semiconductor refrigerating sheet. Further, the outer surface of the light source shell is provided with a heat insulation layer. Further, the liquid cooling plate is provided with a liquid inlet and a liquid outlet. Another aspect of the present invention provides a temperature control method of a semiconductor laser, comprising the steps of: Step S1, after a semiconductor laser is electrified, cooling liquid supply to a liquid cooling plate is started, and then a first current I in for TEC working is input to a TEC semiconductor refrigerating plate according to a preset temperature T set, and the TEC semiconductor refrigerating plate is started; S2, detecting and acquiring the temperature of a light source shell of the laser light source module through a first temperature sensor, wherein the temperature is T low, detecting and acquiring the temperature of a contact surface of a liquid cooling plate and the laser light source module through a second t