CN-121984450-A - Amplifier high-isolation direct-current power supply circuit based on multilayer ceramic

CN121984450ACN 121984450 ACN121984450 ACN 121984450ACN-121984450-A

Abstract

The invention discloses a high-isolation direct current power supply circuit of an amplifier based on multilayer ceramic, which comprises a multilayer ceramic plate, a capacitive circuit and an inductive circuit, wherein the capacitive circuit comprises a left capacitive circuit and a right capacitive circuit, the left capacitive circuit comprises a left capacitive circuit part, a first left extending part and a second left extending part, the right capacitive circuit comprises a right capacitive circuit part, a first right extending part and a second right extending part, the inductive circuit comprises an upper inductive circuit, a middle inductive circuit and a lower inductive circuit which are connected, the upper inductive circuit, the middle inductive circuit and the lower inductive circuit are arranged, the unit circuit with smaller specific size is realized through the design of the multilayer ceramic, the circuit pattern can be arranged in a proper area between the multilayer substrates according to the use requirement of the isolation degree in actual products, and meanwhile, the crosstalk influence between the power supply and the amplifier can be obviously reduced under the condition that the extra occupation of a larger design space is not needed in the design of complex inter-board products through the superposition of a plurality of the structural units.

Inventors

GUO CHAO
DUAN XIHANG
LI BIN
REN FENGCHAO
ZHANG BOCHAO
HE RONGGEN

Assignees

西安空间无线电技术研究所

Dates

Publication Date: 20260505
Application Date: 20251230

Claims (4)

1. An amplifier high isolation direct current power supply circuit based on multilayer ceramics comprises a multilayer ceramic plate (1), and is characterized by further comprising a capacitive circuit (2) and an inductive circuit (3) which are arranged between the multilayer ceramic plate (1); The capacitive circuit (2) and the inductive circuit (3) are connected through a circuit connecting column (4); The capacitive circuit (2) comprises a left capacitive circuit (2-1) and a right capacitive circuit (2-2); The left capacitive circuit (2-1) comprises a left capacitive circuit part (2-1-1), a first left extending part (2-1-2) and a second left extending part (2-1-3) which are connected on the same side of the left capacitive circuit part (2-1-1) The right capacitive circuit (2-2) comprises a right capacitive circuit part (2-2-1), a first right extending part (2-2-2) and a second right extending part (2-2-3) which are connected to the same side of the right capacitive circuit part (2-2-1); The first left extending piece (2-1-2), the first right extending piece (2-2-2), the second left extending piece (2-1-3) and the second right extending piece (2-2-3) are arranged in a staggered mode; The left capacitive circuit piece (2-1-1) is also provided with a first capacitive connecting column (2-3), and the first capacitive connecting column (2-3) is connected with a first metal plate (5) arranged at the top of the multilayer ceramic plate (1); The right capacitive circuit component (2-2-1) is also provided with a second capacitive connecting column (2-4), and the second capacitive connecting column (2-4) is connected with a second metal plate (2-5) arranged between the multilayer ceramic plates (1); the second metal plate (2-5) is communicated with the outer side of the multilayer ceramic plate (1); The inductive circuit (3) comprises an upper inductive circuit (3-1), a middle inductive circuit (3-2) and a lower inductive circuit (3-3) which are connected and arranged; The upper inductive circuit (3-1) comprises a first upper inductive circuit (3-1-1), a second upper inductive circuit (3-1-2), a third upper inductive circuit (3-1-3), a fourth upper inductive circuit (3-1-4) and a fifth upper inductive circuit (3-1-5) which are sequentially connected and arranged in the same plane; the medium inductive circuit (3-2) comprises a first medium inductive circuit (3-2-1), a second medium inductive circuit (3-2-2) and a third medium inductive circuit (3-2-3) which are sequentially connected and arranged in the same plane; The lower inductive circuit (3-3) comprises a first lower inductive circuit (3-3-1), a second lower inductive circuit (3-3-2), a third lower inductive circuit (3-3-3), a fourth lower inductive circuit (3-3-4) and a fifth lower inductive circuit (3-3-5) which are sequentially connected and arranged in the same plane; The first upper inductive circuit (3-1-1) is communicated with the outer side of the multilayer ceramic plate (1), the side surface of the tail end of the fifth upper inductive circuit (3-1-5) is connected with a first inductive connecting column (3-4), and the first inductive connecting column (3-4) is connected with the side surface of the first middle inductive circuit (3-2-1); The side surface of the tail end of the third inductive circuit (3-2-3) is connected with a second inductive connecting column (3-5), and the second inductive connecting column (3-5) is connected with the side surface of the fifth inductive circuit (3-3-5); the first inductive circuit (3-3-1) is communicated with the outer side of the multilayer ceramic plate (1); The upper inductive circuit (3-1) and the lower inductive circuit (3-3) are symmetrically distributed.
2. The high-isolation direct current power supply circuit of the multi-layer ceramic-based amplifier according to claim 1, wherein the first upper inductive circuit (3-1-1) is vertically connected with one end of the second upper inductive circuit (3-1-2), the other end of the second upper inductive circuit (3-1-2) is vertically connected with one end of the third upper inductive circuit (3-1-3), the other end of the third upper inductive circuit (3-1-3) is vertically connected with one end of the fourth upper inductive circuit (3-1-4), and the other end of the fourth upper inductive circuit (3-1-4) is vertically connected with one end of the fifth upper inductive circuit (3-1-5); The first upper inductive circuit (3-1-1) and the third upper inductive circuit (3-1-3) are positioned on different sides of the second upper inductive circuit (3-1-2), and the third upper inductive circuit (3-1-3) and the fifth upper inductive circuit (3-1-5) are positioned on the same side of the third upper inductive circuit (3-1-3).
3. The high isolation dc power supply circuit of a multilayer ceramic based amplifier according to claim 2, wherein the first inductive circuit (3-2-1) and the third inductive circuit (3-2-3) are vertically installed at both ends of the second inductive circuit (3-2-2) and are located at the same side of the second inductive circuit (3-2), respectively.
4. The high-isolation direct current power supply circuit of the multi-layer ceramic-based amplifier according to claim 2, wherein the first lower inductive circuit (3-3-1) is vertically connected with one end of the second lower inductive circuit (3-3-2), the other end of the second lower inductive circuit (3-3-2) is vertically connected with one end of the third lower inductive circuit (3-3-3), the other end of the third lower inductive circuit (3-3-3) is vertically connected with one end of the fourth lower inductive circuit (3-3-4), and the other end of the fourth lower inductive circuit (3-3-4) is vertically connected with one end of the fifth lower inductive circuit (3-3-5); The first lower inductive circuit (3-3-1) and the third lower inductive circuit (3-3-3) are positioned on different sides of the second lower inductive circuit (3-3-2), and the third lower inductive circuit (3-3-3) and the fifth lower inductive circuit (3-3-5) are positioned on the same side of the third lower inductive circuit (3-3-3).

Description

Amplifier high-isolation direct-current power supply circuit based on multilayer ceramic Technical Field The invention belongs to the technical field of wireless communication, and particularly relates to a high-isolation direct current power supply circuit of an amplifier based on multilayer ceramics. Background With the development of space microwave component products towards high performance and integration trend, the multilayer substrate provides a feasibility foundation for increasingly complex circuit design requirements, wherein the multilayer ceramic substrate has good application prospect in high-reliability platforms such as aerospace and the like due to good high-frequency performance, extremely high reliability and stability and system-in-package platform advantages. In the design of high-frequency products with high integration, the crosstalk of power supply signals of an amplifier becomes an important point to be considered in the design, and a mode of increasing capacitance or increasing distance of interference devices is often adopted in a traditional design mode, so that the space requirement in the multilayer ceramic design is high, the practical available size in the application of the products is reduced, and the miniaturization degree of the products is affected to a certain extent. Disclosure of Invention Aiming at the defects and the shortcomings of the prior art, the invention aims to provide a high-isolation direct current power supply circuit of an amplifier based on multilayer ceramic, which solves the problems that the traditional design in the prior art reduces the practical available size in product application and affects the miniaturization degree of products to a certain extent. In order to solve the technical problems, the invention adopts the following technical scheme that the high-isolation direct current power supply circuit of the amplifier based on the multilayer ceramic comprises the multilayer ceramic plates, and further comprises a capacitive circuit and an inductive circuit which are arranged among the multilayer ceramic plates, wherein the capacitive circuit and the inductive circuit are connected through a circuit connecting column. The capacitive circuit comprises a left capacitive circuit and a right capacitive circuit. The left capacitive circuit comprises a left capacitive circuit piece, and a first left extending piece and a second left extending piece which are connected to the same side of the left capacitive circuit piece. The right capacitive circuit comprises a right capacitive circuit piece, and a first right extending piece and a second right extending piece which are connected to the same side of the right capacitive circuit piece. The first left extending piece, the first right extending piece, the second left extending piece and the second right extending piece are arranged in a staggered mode. The left capacitive circuit piece is also provided with a first capacitive connecting column, and the first capacitive connecting column is connected with a first metal plate arranged at the top of the multilayer ceramic plate. And a second capacitive connecting column is also arranged on the right capacitive circuit component and is connected with a second metal plate arranged between the multilayer ceramic plates. The second metal plate is communicated with the outer side of the multilayer ceramic plate. The inductive circuit comprises an upper inductive circuit, a middle inductive circuit and a lower inductive circuit which are connected. The upper inductive circuit comprises a first upper inductive circuit, a second upper inductive circuit, a third upper inductive circuit, a fourth upper inductive circuit and a fifth upper inductive circuit which are sequentially connected and arranged in the same plane. The medium inductive circuit comprises a first medium inductive circuit, a second medium inductive circuit and a third medium inductive circuit which are sequentially connected and arranged in the same plane. The lower inductive circuit comprises a first lower inductive circuit, a second lower inductive circuit, a third lower inductive circuit, a fourth lower inductive circuit and a fifth lower inductive circuit which are sequentially connected and arranged in the same plane. The first upper inductive circuit is communicated with the outer side of the multilayer ceramic plate, the side face of the tail end of the fifth upper inductive circuit is connected with a first inductive connecting column, and the first inductive connecting column is connected with the side face of the first middle inductive circuit. The side face of the tail end of the third medium inductive circuit is connected with a second inductive connecting column, and the second inductive connecting column is connected with the side face of the fifth lower inductive circuit. The first inductive circuit is communicated with the outer side of the multilayer ceramic plate. The upper induct