CN-121984467-A - Broadband filter based on high-heat-conductivity substrate integration and preparation method thereof

CN121984467ACN 121984467 ACN121984467 ACN 121984467ACN-121984467-A

Abstract

The invention relates to the technical field of filters and discloses a broadband filter based on high heat conduction substrate integration and a preparation method thereof, wherein the broadband filter comprises a high heat conduction substrate and a high heat conduction substrate, wherein the high heat conduction substrate is used for providing a thermal diffusion path; the capacitor unit comprises at least one pair of current collecting electrodes, a porous active layer and an electrolyte layer, wherein the current collecting electrodes comprise a metal dendrite framework and a metal oxide which are grown on the surface of the current collecting electrodes in situ, and the metal oxide is formed by partial area of the surface of the metal dendrite framework in situ, and the electrolyte layer is used for coating all exposed surfaces of a composite electrode formed by the current collecting electrodes and the porous active layer. The ultra-wideband noise-free power supply device can realize ultra-wideband resistance to noise from 1Hz to 1GHz on a power bus of a vector network analyzer in a very small volume.

Inventors

ZHANG GUANGLEI
ZHAO QINGSONG
DUAN ZUNBIN
YANG SHUAI
LI YANFANG

Assignees

山东大学

Dates

Publication Date: 20260505
Application Date: 20260123

Claims (10)

1. A broadband filter based on high thermal conductivity substrate integration, comprising: The high heat conduction substrate is used for bearing the filter circuit and providing a heat diffusion path; The conductive pattern is formed on the high-heat-conductivity substrate and used for forming a filter circuit; At least one capacitor unit electrically connected to the conductive pattern for implementing a wide band filtering function from a low frequency to a high frequency; Wherein the capacitor unit includes: At least one pair of current collecting electrodes, including a positive current collecting electrode and a negative current collecting electrode, formed on the high heat conduction substrate; The porous active layer comprises a metal dendrite framework and a metal oxide, wherein the metal dendrite framework grows on the surface of the current collecting electrode in situ, and the metal oxide is formed by at least two metals and is used as a conductive network; And an electrolyte layer coating all exposed surfaces of the composite electrode formed by the current collecting electrode and the porous active layer.
2. The broadband filter based on high thermal conductivity substrate integration according to claim 1, wherein the metal dendrite framework and the metal oxide in the porous active layer are in an alloy state; The metal dendrite framework is an alloy dendrite formed by at least two metals of copper, iron, nickel, cobalt, manganese, vanadium, ruthenium, iridium, titanium and zinc; the metal oxide is an alloy oxide and is loaded on the outermost layer of the alloy dendrite; The alloy dendrite is used as a conductive network to ensure conductivity and structural stability, the alloy oxide is used as an active component to provide pseudocapacitance, and the alloy dendrite and the alloy oxide form an interpenetrating network together to realize the cooperative enhancement of electron transmission and ion diffusion dynamics.
3. The broadband filter based on the high-heat-conductivity substrate integration according to claim 1, wherein the high-heat-conductivity substrate is a ceramic substrate, and the ceramic substrate has a higher heat conductivity than an organic circuit board material and is used for rapidly diffusing and guiding out joule heat generated in the filter working process and heat generated in the capacitor unit electrochemical process.
4. A broadband filter based on high thermal conductivity substrate integration according to claim 3, wherein the ceramic substrate comprises an alumina substrate, an aluminum nitride substrate or a zirconia toughened alumina ceramic substrate; The conductive patterns comprise an anode current collecting electrode pattern, a cathode current collecting electrode pattern, a connecting terminal and a resistor pattern which are electrically isolated from each other; The filter circuit is an RC circuit, an LC circuit or an RLC circuit, and the electrolyte layer is aqueous gel electrolyte and is formed by crosslinking and solidifying electrolyte and a high polymer gel.
5. The broadband filter based on the high-heat-conductivity substrate integration according to claim 1, wherein the capacitor unit adopts an asymmetric structure, and comprises a positive electrode and a negative electrode; the metals and metal oxides in the porous active layers on the positive electrode and the negative electrode are not completely the same, and the stable working voltage of the capacitor unit is larger than or equal to the theoretical decomposition voltage of water, so that the energy density and the working voltage range of the filter are improved.
6. A method for preparing a broadband filter based on high thermal conductivity substrate integration, for preparing the broadband filter based on high thermal conductivity substrate integration according to any one of claims 1 to 5, comprising: printing conductive paste through a screen printing process based on a high-heat-conductivity substrate to form a conductive pattern, and performing sintering and curing treatment; Preparing a first electrolyte containing at least two different metal cations, immersing the high-heat-conductivity substrate into the first electrolyte, taking the anode collector electrode as a working electrode, performing electrodeposition under a preset potential to form first metal dendrites, and switching to an anodic oxidation potential to convert part or all of the surface of the first metal dendrites into first metal oxides to obtain an anode porous active layer; Preparing a second electrolyte containing at least two different metal cations, immersing the high-heat-conductivity substrate into the second electrolyte, taking the negative electrode collector as a working electrode, performing electrodeposition under a preset potential to form second metal dendrites, and switching to an anodic oxidation potential to partially or completely convert the surface of the second metal dendrites into second metal oxides to obtain a negative electrode porous active layer; Preparing gel electrolyte precursor solution, coating the gel electrolyte precursor solution on the surface of the high heat conduction substrate to cover all electrode areas, and standing and curing to form an electrolyte layer so as to complete the preparation of the broadband filter.
7. The method for manufacturing a broadband filter based on high thermal conductivity substrate integration according to claim 6, wherein the sintering and curing process is performed by placing the printed high thermal conductivity substrate in a sintering furnace under an inert atmosphere, the inert atmosphere comprising nitrogen.
8. The method for preparing the broadband filter based on the high-heat-conductivity substrate integration, which is disclosed in claim 6, is characterized in that metal cations in the first electrolyte and the second electrolyte are at least two of copper, iron, nickel, cobalt, manganese, vanadium, ruthenium, iridium, titanium and zinc, and the first electrolyte and the second electrolyte are aqueous solutions of one or more of sulfate, chloride, nitrate or acetate of the metal cations.
9. The method for manufacturing a broadband filter based on high thermal conductivity substrate integration according to claim 8, wherein the electrodeposition is performed at a preset potential of-0.5V to-2.5V with respect to the saturated calomel electrode at 25 ℃ for 2 to 20 minutes at a current density of 10 to 500mA/cm 2 ; The condition of the switching to the anodic oxidation potential is that the potential is switched to +0.3V to +1.5V relative to the saturated calomel electrode, and the anodic oxidation is carried out at 25 ℃ for 2 to 20 minutes, so that the surface of the metal dendrite is partially or completely converted into metal oxide.
10. The preparation method of the broadband filter based on the high-heat-conductivity substrate integration, which is disclosed in claim 6, is characterized in that the gel electrolyte precursor solution is obtained by uniformly mixing 10% polyvinyl alcohol aqueous solution with 1-10 mol/L electrolyte, wherein the electrolyte is an acidic electrolyte, an alkaline electrolyte or a neutral electrolyte.

Description

Broadband filter based on high-heat-conductivity substrate integration and preparation method thereof Technical Field The invention relates to the technical field of filters, in particular to a broadband filter based on high-heat-conductivity substrate integration and a preparation method thereof. Background With the rapid development of 5G communication, internet of things and high performance computing technologies, high-end electronic measurement instruments such as Vector Network Analyzers (VNAs) are evolving toward higher frequency bands, higher precision and higher integration. This trend puts very demanding demands on the purity of the internal power distribution system, and needs to achieve miniaturization, ultra-wide frequency domain noise suppression and efficient thermal management in a compact space, where the noise suppression needs to cover the complete spectrum from the power frequency ripple to the radio frequency noise, i.e. the full frequency range from 1Hz to 1 GHz. At present, when the miniaturization and wide frequency domain performance of the traditional passive filter applied to the instrument power bus are pursued, the traditional passive filter faces a fundamental physical dilemma that in order to effectively filter low-frequency-band interference below MHz, including 50/60Hz power frequency interference, kHz-level switching ripple and power supply slowly varying noise, a capacitor or an inductive element with a larger capacitance value is usually required to be used, but the element is often huge in size and poor in parasitic parameter, so that the high-frequency response of the element is seriously deteriorated, the switching noise, clock harmonic and radio frequency interference of MHz to GHz-level cannot be effectively restrained, and otherwise, the small-volume element suitable for high-frequency noise restraint cannot cope with baseband disturbance due to insufficient low-frequency impedance. The inherent contradiction between the low-frequency capacitance value and the inductance, the high-frequency parasitic parameters and the physical volume makes the conventional technology path difficult to realize full-frequency noise depth filtering from Hz to GHz in the limited circuit board space inside the instrument. In addition, the packaging materials and structures of existing micro filters generally have low heat dissipation efficiency. Under the high-load or long-time working high-temperature environment of equipment such as a vector network analyzer, the filter is easy to cause parameter drift, performance attenuation and reliability reduction due to heat accumulation, which become main barriers for miniaturization and long-term stable operation of the system, and although attempts for adopting high-performance materials or complex circuit topology are made in the industry, the problems of high cost, complex process or increased size are generally accompanied, and the practical application requirements are difficult to meet. Therefore, an innovative technical scheme is needed, breakthrough can be realized in the aspects of device structures, material systems and integrated processes, and ultra-wideband noise suppression and efficient heat dissipation of 1Hz to 1GHz can be cooperatively realized in a very small volume, so that the requirements of noise purification of next-generation high-precision and compact vector network analyzers and power buses thereof are met. For the problems in the related art, no effective solution has been proposed at present. Disclosure of Invention Aiming at the defects of the prior art, the invention provides a broadband filter based on high-heat-conductivity substrate integration and a preparation method thereof, which have the advantages of broadband continuous filtering, high-efficiency heat dissipation and high structural stability, and further solve the problem that the traditional filter cannot achieve low-frequency to high-frequency full-band noise suppression and thermal management under the condition of miniaturization. In order to realize the advantages of wide-band continuous filtering, high-efficiency heat dissipation and high structural stability, the invention adopts the following specific technical scheme: A high thermal conductivity substrate integration based broadband filter, comprising: According to one aspect of the invention, a broadband filter based on high heat conduction substrate integration is provided, comprising a high heat conduction substrate for carrying a filter circuit and providing a heat diffusion path, an electric conduction pattern formed on the high heat conduction substrate for forming the filter circuit, at least one capacitor unit electrically connected with the electric conduction pattern for realizing the broadband filter function from low frequency to high frequency, wherein the capacitor unit comprises at least one pair of current collecting electrodes comprising a positive current collecting electrode